JPH0351297B2 - - Google Patents

Info

Publication number
JPH0351297B2
JPH0351297B2 JP19816484A JP19816484A JPH0351297B2 JP H0351297 B2 JPH0351297 B2 JP H0351297B2 JP 19816484 A JP19816484 A JP 19816484A JP 19816484 A JP19816484 A JP 19816484A JP H0351297 B2 JPH0351297 B2 JP H0351297B2
Authority
JP
Japan
Prior art keywords
cap
electronic component
electronic components
present
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19816484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61179557A (ja
Inventor
Kenro Kimata
Osamu Fujikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP59198164A priority Critical patent/JPS61179557A/ja
Publication of JPS61179557A publication Critical patent/JPS61179557A/ja
Publication of JPH0351297B2 publication Critical patent/JPH0351297B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
JP59198164A 1984-09-20 1984-09-20 電子部品用キヤツプ Granted JPS61179557A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59198164A JPS61179557A (ja) 1984-09-20 1984-09-20 電子部品用キヤツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59198164A JPS61179557A (ja) 1984-09-20 1984-09-20 電子部品用キヤツプ

Publications (2)

Publication Number Publication Date
JPS61179557A JPS61179557A (ja) 1986-08-12
JPH0351297B2 true JPH0351297B2 (2) 1991-08-06

Family

ID=16386527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59198164A Granted JPS61179557A (ja) 1984-09-20 1984-09-20 電子部品用キヤツプ

Country Status (1)

Country Link
JP (1) JPS61179557A (2)

Also Published As

Publication number Publication date
JPS61179557A (ja) 1986-08-12

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