JPS5826536Y2 - Stacked semiconductor device - Google Patents

Description

[Detailed Description of the Invention] The present invention is directed to a stacked semiconductor device, in particular, which has a high packaging density and wide spacing between external terminals to facilitate wire bonding. That's what you're trying to get.

Conventional stacked semiconductor devices have been proposed in which a plurality of semiconductor elements are interconnected and sealed with resin.

However, in conventional stacked semiconductor devices, the number of external terminals increases as the degree of integration of semiconductor elements improves, so the overall size of the device must be increased or the spacing between external terminals must be narrowed. .

If the entire device is large, there is a disadvantage that the packaging density will be reduced when this device is loaded into electronic equipment, etc. Also, if the spacing between external terminals is narrow, it will be difficult to perform wire bonding and static noise between external terminals will be reduced. The capacitance increases, which is a big problem especially in high frequency ICs.

The present invention eliminates the drawbacks of the conventional integrated semiconductor device described above, and embodiments of the present invention will be described below with reference to FIGS. 1 to 3.

FIG. 1A is a plan view of a stacked semiconductor device showing an embodiment of the present invention, and FIG. 1A is a sectional view of the same device.

In FIG. 1, A9, 1 and 2 are semiconductor elements to which external terminals 3 and 4 are connected, and are installed on lead frames 5 and 6, respectively, and together with the lead frames 5 and 6, external molded resin parts are attached. 7 and 8 constitute semiconductor devices 9 and 10, each of which is sealed with resin and determined to be non-defective by inspection, for example, DC inspection, AC inspection (gain, high frequency characteristics, lower current characteristics), or screening inspection. There is.

Note that the external molded resin parts 7 and 8 are formed thickly on the semiconductor elements 1 and 2 side, and are very thin on the lead frame 5 and 6 side, for example, 0.5 mm or less, or are not formed at all. It's okay.

Reference numeral 11 denotes a resin-impregnated fiber material adhesive sheet, and the semiconductor devices 9 and 1 are
The surfaces of lead frames 5 and 6 on the lead frames 5 and 6 are bonded to each other so as to face each other.

The external terminals 3 of the semiconductor device 9 and the external terminals 4 of the semiconductor device 10 are arranged with their positions shifted to prevent them from coming into contact with each other.

As is clear from the above configuration, the semiconductor devices 9 and 10 are
are bonded facing each other, so each semiconductor device 9, 10
The externally molded resin parts 7 and 8 on the lead frames 5 and 6 may be formed very thinly, or may not be formed at all.

Moreover, this allows the external terminal 3 of one semiconductor device 9 to
and the external terminal 4 of the other semiconductor device 10 are close to each other, and sometimes come into contact with each other.
．． 4 are arranged offset from each other, so each external terminal 3,
The distance between the external terminals 3 and 4 is wide, making wire bonding easier and reducing the capacitance between the external terminals 3 and 4.

Furthermore, since the semiconductor devices 9 and 10 are individually resin-sealed and then inspected and determined to be good, even if the two are combined, the combination will not be defective.

In addition, if the capacitance between the external terminals is large and does not cause a problem, as shown in FIG. For example, it is preferable to increase the pull-out strength of the external terminal by widening it or by providing a through hole 18 in a part 17 of the external terminal 15 and filling the through hole 18 with external molding resin.

Next, a plan view of a stacked semiconductor device showing another embodiment of the present invention is shown in FIG. 3A, and a sectional view thereof is shown in FIG.

In FIG. 3A, the same components as those in FIG. 1 showing the above-mentioned embodiment are given the same numbers.

An external terminal 21 connected to the semiconductor element 1 resin-sealed by one external molded resin part 7 and an external terminal 22 connected to the semiconductor element 2 resin-sealed by the other external molded resin part 8. are arranged so as to intersect perpendicularly to each other.

That is, one external terminal 21 is arranged leading out in one direction or the opposite direction, and the other external terminal 22
are arranged to perpendicularly intersect with the external terminal 21.

As a result, one external terminal 21 and the other external terminal 22 do not come close to each other or come into contact with each other.

In each of the above embodiments, when two semiconductor elements are embedded in one stacked semiconductor device, that is, two semiconductor devices each having - semiconductor elements are bonded to a resin-impregnated fiber material. Although the case where the semiconductor elements are bonded via a sheet has been described, each semiconductor device may be provided with a plurality of semiconductor elements.

As is clear from the above description, according to the present invention, it is possible to obtain a stacked semiconductor device that has a high packaging density, widens the distance between external terminals and facilitates wire bonding, and also allows for individual inspection. A high-density device can be obtained at a high yield by combining good quality semiconductor devices that have been completely processed.

[Brief explanation of drawings]

Fig. 1A is a plan view of a stacked semiconductor device showing one embodiment of the present invention, the opening in Fig. 1 is a sectional view of the same, and Fig. 2 is a part of a stacked semiconductor device showing another embodiment of the invention. 3A is a plan view of a stacked semiconductor device showing still another embodiment of the present invention, and FIG. 3A is a sectional view of the same. 1.2... Semiconductor element, 3, 4, 15, 21.
22... External terminal, 5, 6... Lead frame, 7, 8.16... External molded resin part,
9, 10...Semiconductor device, 11...Resin-impregnated fiber material adhesive sheet.

Claims (3)

[Scope of utility model registration request] (1) Equipped with two separate semiconductor devices in which the entire semiconductor element electrically connected to external terminals and the lead frame on which the semiconductor element is installed are resin-sealed with an externally molded resin part, and resin-impregnated fiber material is bonded. A stacked semiconductor device, characterized in that the two semiconductor devices are bonded to each other via a sheet, with main surfaces of the lead frame on the side on which the semiconductor element is not placed facing each other. (2) The stacked semiconductor device according to claim 1, wherein an external terminal of one semiconductor device is arranged between adjacent external terminals of the other semiconductor device. (3) The external terminals of one semiconductor device are arranged extending out from two opposing side surfaces, and the external terminals of the other semiconductor device are arranged perpendicularly crossing these external terminals. A stacked semiconductor device according to claim 1 of the utility model registration claim.