JPS5832436A - Semiconductor element - Google Patents

Abstract

PURPOSE:To prevent the disconnection of conductors, etc., when connecting electrodes of a semiconductor pellet fixed at the center surface of a pedestal to standoffs situated at both sides of the pellet using connecting conductors, by providing the upper surface of the standoff with a recess to which one end of the conductor is connected. CONSTITUTION:On a pedestal 1 having standoffs 13 situated parallel to each other and a specified distance apart a semiconductor pellet 2 is fixed in such a way that it is positioned between the standoffs. Electrodes on the pellet 2 and the standoffs 13 are connected by means of two connecting conductors 4. In this constitution the upper surface of the standoff is provided with a deep recess 13a having a metallized layer, one end of the conductor being soldered to this recess. This prevens the conductor 4 from disconnection due to contact with a hold plate when it is placed on the element surface, and also the exfoliation of the electrodes is prevented.

Description

[Detailed description of the invention] In the present invention, semiconductor pellets are placed on the top surface of one pedestal.

The present invention relates to a type of semiconductor element in which the electrodes of this pellet and an insulated relay stand provided side by side with this pellet are connected by multiple connection conductors.

In such semiconductor devices, insulating relay stands (referred to as standoffs) are used to reduce case capacitance when used at high frequencies.

FIG. 1 shows a conventional semiconductor device using standoffs. In FIG. 1, a semiconductor pellet 2 is placed approximately in the center of the upper surface of a pedestal L made of Kovar or copper.
Quartz insulating relay stands 3, 3 are provided on the pedestals on both sides, and a tape-shaped connecting conductor 4 is passed over the metallized upper surface of the standoff 3.3, and the central part of the connecting conductor 4 hangs down to form a semiconductor pellet. It is connected to the upper electrode metal 5 of No. 2.

2(a) to 2(C) are cross-sectional views showing how the semiconductor device shown in FIG. 1 is used. When using such a semiconductor device, as shown in FIG. 2(a), A hold plate 1 (one stacked and loaded) is used to make electrical contact with the top surface of the standoff 3 of the element.

Then, as shown in Figure 2(b), the electrode metal 5 peels off and malfunctions, resulting in 99. As shown in FIG. 4(C), there is a drawback that the Kl connecting conductor 4 may be broken or deformed even if it is not broken, resulting in a change in characteristics.

An object of the present invention is to provide a semiconductor element in which peeling off of electrode metal or disconnection caused by such press-bonding of the holding plate is prevented.

The semiconductor element of the present invention includes a pedestal, a semiconductor pellet placed on the top surface of the pedestal, an insulating relay stand provided on the pedestal alongside the pellet, and a metallized surface on the top surface of the relay stand and an electrode of the pellet. and a connecting conductor connected between them, and a connecting portion of the connecting conductor of the insulated relay stand is recessed.

Next, the present invention will be explained by examples.

FIG. 3 is a perspective view of one embodiment of the present invention. In FIG. 3, the difference from the conventional example shown in FIG.
They are connected at the metallized surface of a. In this way, if the connecting conductor 4 is connected at the recessed part,
The Holt plate that is crimped onto the top surface of the standoff 13 when using this semiconductor element does not have any effect on the connecting conductor 4, so there is no disconnection of the connecting conductor, peeling of the connecting electrode metal, etc., and reliability is improved. A semiconductor element with high properties can be obtained.

FIG. 4 is a perspective view of another embodiment of the invention.

In this example, the standoff 23 is simpler than the example shown in FIG.
In this example, only one IVC is used, and the connecting portion of the connecting conductor 14 is a concave surface 23a that is stepped down one step in the longitudinal direction. Figure 5 is almost the same as Figure 4, with only one standoff 3.
3 is used, and the connecting portion of the connecting conductor 14 is a concave surface 33a that is stepped down one step in the width direction.

FIG. 6 shows yet another embodiment of the present invention. The standoff 43 forms a semicircular wall surrounding the semiconductor pellet 2, and a step-like recess 43 is formed at both ends of the semicircular shape.
A connection is made to the connecting conductor 4 at point a. In this example, as shown in Fig. 3, two separate standoffs are provided on both sides of the pellet, and the connecting conductor is drawn out in both the left and right directions, but one standoff is the first between the attachments, and two Similar characteristics can be obtained with book connecting conductors.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a conventional semiconductor device, @Figure 2 (a) (b)
) and (C) are respectively cross-sectional views for explaining the usage state of the semiconductor element shown in FIG. 1, @3 is a perspective view of an embodiment of the present invention, and FIGS. Perspective view of another embodiment, Figure @6 is a perspective view of still another embodiment of the present invention. l...Pedestal, 2...Semiconductor Benz),
3,13゜23, 33... Insulated relay stand (standoff), 4.14... Connection conductor, 5...
... Electrode metal, 10 ... Holt plate. 13a, 23a, 33a...concave surfaces. 5- Cold 1 Figure (lln (b)
(C) Mine 2 boxes ≠ 3 boxes

Claims (1)

[Claims] A pedestal, a semiconductor pellet placed on the top surface of the pedestal,
In a semiconductor device comprising an insulated relay stand provided on the pedestal alongside the pellet, and a connection conductor connected between a metallized surface on the top surface of the relay stand and an electrode of the pellet, the insulated relay stand is A semiconductor device characterized in that a connecting portion of the connecting conductor is recessed.