JPS58432U - モ−ルド型半導体整流装置 - Google Patents

モ−ルド型半導体整流装置

Info

Publication number
JPS58432U
JPS58432U JP9396081U JP9396081U JPS58432U JP S58432 U JPS58432 U JP S58432U JP 9396081 U JP9396081 U JP 9396081U JP 9396081 U JP9396081 U JP 9396081U JP S58432 U JPS58432 U JP S58432U
Authority
JP
Japan
Prior art keywords
semiconductor rectifier
molded semiconductor
molded
abstract
rectifier elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9396081U
Other languages
English (en)
Other versions
JPS6211006Y2 (ja
Inventor
大松　智則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9396081U priority Critical patent/JPS58432U/ja
Publication of JPS58432U publication Critical patent/JPS58432U/ja
Application granted granted Critical
Publication of JPS6211006Y2 publication Critical patent/JPS6211006Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はモールド型半導体整流装置を示す外観図、第２
図は従来技術によるモールド型半導体整流装置で樹脂を
覆う前を示す斜視図、第３図は本考案−実施例によるモ
ールド型半導体整流装置で樹脂を覆う前を示す斜視図で
ある。 なお図において、１−ａ、　　ＩＬｂ・・・外部取出用
電極、２・・・熱硬化性樹脂、３・・・半導体整流素子
、３−ａ・・・リード線部、３−ｂ−・・余分なリード
線部、である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体整流素子を複数個接続して形成した接続体を熱硬
    化性樹脂を用いて覆い放熱板上に形成し゛たモールド型
    半導体整流装置において、前記半導体整流素子相互の前
    記接続構成上余分なリード線を切り取っていないことを
    特徴とするモールド型半導体整流装置。
JP9396081U 1981-06-25 1981-06-25 モ−ルド型半導体整流装置 Granted JPS58432U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9396081U JPS58432U (ja) 1981-06-25 1981-06-25 モ−ルド型半導体整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9396081U JPS58432U (ja) 1981-06-25 1981-06-25 モ−ルド型半導体整流装置

Publications (2)

Publication Number Publication Date
JPS58432U true JPS58432U (ja) 1983-01-05
JPS6211006Y2 JPS6211006Y2 (ja) 1987-03-16

Family

ID=29888916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9396081U Granted JPS58432U (ja) 1981-06-25 1981-06-25 モ−ルド型半導体整流装置

Country Status (1)

Country Link
JP (1) JPS58432U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816756U (ja) * 1971-07-06 1973-02-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4816756U (ja) * 1971-07-06 1973-02-24

Also Published As

Publication number Publication date
JPS6211006Y2 (ja) 1987-03-16

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