JPS6083250U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6083250U
JPS6083250U JP1983177118U JP17711883U JPS6083250U JP S6083250 U JPS6083250 U JP S6083250U JP 1983177118 U JP1983177118 U JP 1983177118U JP 17711883 U JP17711883 U JP 17711883U JP S6083250 U JPS6083250 U JP S6083250U
Authority
JP
Japan
Prior art keywords
groove
semiconductor element
heat sink
leads
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983177118U
Other languages
English (en)
Inventor
寛 山田
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1983177118U priority Critical patent/JPS6083250U/ja
Publication of JPS6083250U publication Critical patent/JPS6083250U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本案の一実施例を示す横断面図、第２図は溝部
の拡大断面図、第３図は凹部の拡大断面である。 図中、１は放熱板、４は溝部、４′は凹部、５は半導体
素子、６はリード、７は金属細線、８は樹脂材である。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）入口が内部より狭い溝部を有する放熱板に半導体
    素子を固定すると共に、半導体素子の電極とリードとを
    金属細線にて接続し、かつ半導体素子、溝部を含む主要
    部分を樹脂材にてモールド被覆したものにおいて、上記
    溝部を、■字形に押圧形成した凹部の頂部を押圧変形す
    ることによって構成したことを特徴とする半導体装置。
  2. （２）放熱板の両側部分に複数の溝部をリードの導出方
    向に直角に形成したことを特徴とする実用新案登録請求
    の範囲第１項に記載の半導体装置。
JP1983177118U 1983-11-15 1983-11-15 半導体装置 Pending JPS6083250U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983177118U JPS6083250U (ja) 1983-11-15 1983-11-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983177118U JPS6083250U (ja) 1983-11-15 1983-11-15 半導体装置

Publications (1)

Publication Number Publication Date
JPS6083250U true JPS6083250U (ja) 1985-06-08

Family

ID=30384878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983177118U Pending JPS6083250U (ja) 1983-11-15 1983-11-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS6083250U (ja)

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