JPS6037253U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6037253U
JPS6037253U JP1983130217U JP13021783U JPS6037253U JP S6037253 U JPS6037253 U JP S6037253U JP 1983130217 U JP1983130217 U JP 1983130217U JP 13021783 U JP13021783 U JP 13021783U JP S6037253 U JPS6037253 U JP S6037253U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
island portion
semiconductor device
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983130217U
Other languages
English (en)
Inventor
大津　寿招
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983130217U priority Critical patent/JPS6037253U/ja
Publication of JPS6037253U publication Critical patent/JPS6037253U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のリードフレームを説明する半導体装置の
平面図、第２図、第３図はそれぞれボンディングを行っ
た後の二つの従来の例を示す部分断面図、第４図はボン
ディングを行った後の従来のリードフレームの一部を拡
大した平面図、第５図は本考案の一実施例によるリード
フレームを示す平面図である。 １・・・・・・アイランド部、２・・・・・・リード、
３・・・・・・樹脂、４・・・・・・半導体チップ、５
・・・・・・金属細線、６・・・・・・電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子が取り付けられたアイランド部と、このアイ
    ランド部の周辺に配置され前記半導体素子の各電極と金
    属細線で結線される複数のリードとを備えた半導体装置
    において、各リードの前記アイランド部側の先端部分の
    形状が円弧状となるように成形されていることを特徴と
    する半導体装置。
JP1983130217U 1983-08-23 1983-08-23 半導体装置 Pending JPS6037253U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983130217U JPS6037253U (ja) 1983-08-23 1983-08-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983130217U JPS6037253U (ja) 1983-08-23 1983-08-23 半導体装置

Publications (1)

Publication Number Publication Date
JPS6037253U true JPS6037253U (ja) 1985-03-14

Family

ID=30294793

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983130217U Pending JPS6037253U (ja) 1983-08-23 1983-08-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS6037253U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245969A (ja) * 1988-08-06 1990-02-15 Toshiba Corp 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0245969A (ja) * 1988-08-06 1990-02-15 Toshiba Corp 半導体装置の製造方法

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