JPS5844857U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5844857U JPS5844857U JP1981139984U JP13998481U JPS5844857U JP S5844857 U JPS5844857 U JP S5844857U JP 1981139984 U JP1981139984 U JP 1981139984U JP 13998481 U JP13998481 U JP 13998481U JP S5844857 U JPS5844857 U JP S5844857U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- semiconductor equipment
- resin
- semiconductor device
- metal terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａは従来構造の半導体装置を示す断面図であり、
第１図Ｂはそれに用いる金属端子板を示す斜視図である
。第２図Ａは本考案の実施例を示す断面図であり、第２
図Ｂはそれに用いる金属端子板の斜視図である。
図において、１・・・・・・エポキシ樹脂、２・・・・
・・金属放熱板、３，３′・・・・・・金属端子板、４
・・・・・・金属ワイヤー、５・・・・・・半導体ペレ
ット、６・・・・・・半田、７・・・・・・絶縁板であ
る。FIG. 1A is a cross-sectional view showing a semiconductor device with a conventional structure,
FIG. 1B is a perspective view showing a metal terminal plate used therein. FIG. 2A is a sectional view showing an embodiment of the present invention;
Figure B is a perspective view of a metal terminal plate used therein. In the figure, 1... epoxy resin, 2...
...Metal heat sink, 3,3'...Metal terminal board, 4
. . . Metal wire, 5 . . . Semiconductor pellet, 6 . . . Solder, 7 . . . Insulating plate.
Claims (1)
ット及び板状の金属端子板を配置し、且つ、これらを樹
脂によって封止する半導体装置において、前記板状の金
属端子板の形状が、樹脂によって封止される部分の一部
にＣ状もしくはコの字の曲がりを有することを特徴とす
る半導体装置。In a semiconductor device in which an insulating plate, a semiconductor pellet, and a plate-shaped metal terminal plate are arranged on a first surface of a flat metal heat sink, and these are sealed with resin, the plate-shaped metal terminal plate is A semiconductor device characterized in that a portion of a portion sealed with a resin has a C-shape or U-shape bend.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981139984U JPS5844857U (en) | 1981-09-21 | 1981-09-21 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981139984U JPS5844857U (en) | 1981-09-21 | 1981-09-21 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5844857U true JPS5844857U (en) | 1983-03-25 |
Family
ID=29933159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981139984U Pending JPS5844857U (en) | 1981-09-21 | 1981-09-21 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5844857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0521674A (en) * | 1991-07-10 | 1993-01-29 | Mitsubishi Electric Corp | Semiconductor device |
-
1981
- 1981-09-21 JP JP1981139984U patent/JPS5844857U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0521674A (en) * | 1991-07-10 | 1993-01-29 | Mitsubishi Electric Corp | Semiconductor device |
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