JPS5844857U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5844857U
JPS5844857U JP1981139984U JP13998481U JPS5844857U JP S5844857 U JPS5844857 U JP S5844857U JP 1981139984 U JP1981139984 U JP 1981139984U JP 13998481 U JP13998481 U JP 13998481U JP S5844857 U JPS5844857 U JP S5844857U
Authority
JP
Japan
Prior art keywords
plate
semiconductor equipment
resin
semiconductor device
metal terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981139984U
Other languages
English (en)
Inventor
庚塚　峻夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981139984U priority Critical patent/JPS5844857U/ja
Publication of JPS5844857U publication Critical patent/JPS5844857U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａは従来構造の半導体装置を示す断面図であり、
第１図Ｂはそれに用いる金属端子板を示す斜視図である
。第２図Ａは本考案の実施例を示す断面図であり、第２
図Ｂはそれに用いる金属端子板の斜視図である。 図において、１・・・・・・エポキシ樹脂、２・・・・
・・金属放熱板、３，３′・・・・・・金属端子板、４
・・・・・・金属ワイヤー、５・・・・・・半導体ペレ
ット、６・・・・・・半田、７・・・・・・絶縁板であ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 平坦状の金属放熱板の第一の面に、絶縁板、半導体ペレ
    ット及び板状の金属端子板を配置し、且つ、これらを樹
    脂によって封止する半導体装置において、前記板状の金
    属端子板の形状が、樹脂によって封止される部分の一部
    にＣ状もしくはコの字の曲がりを有することを特徴とす
    る半導体装置。
JP1981139984U 1981-09-21 1981-09-21 半導体装置 Pending JPS5844857U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981139984U JPS5844857U (ja) 1981-09-21 1981-09-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981139984U JPS5844857U (ja) 1981-09-21 1981-09-21 半導体装置

Publications (1)

Publication Number Publication Date
JPS5844857U true JPS5844857U (ja) 1983-03-25

Family

ID=29933159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981139984U Pending JPS5844857U (ja) 1981-09-21 1981-09-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS5844857U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521674A (ja) * 1991-07-10 1993-01-29 Mitsubishi Electric Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521674A (ja) * 1991-07-10 1993-01-29 Mitsubishi Electric Corp 半導体装置

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