JPS5867883A - Manufacture of low hydrogen overvoltage cathode - Google Patents
Manufacture of low hydrogen overvoltage cathodeInfo
- Publication number
- JPS5867883A JPS5867883A JP56163395A JP16339581A JPS5867883A JP S5867883 A JPS5867883 A JP S5867883A JP 56163395 A JP56163395 A JP 56163395A JP 16339581 A JP16339581 A JP 16339581A JP S5867883 A JPS5867883 A JP S5867883A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nickel
- plating layer
- cathode
- hydrogen overvoltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 239000001257 hydrogen Substances 0.000 title claims abstract description 29
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000007747 plating Methods 0.000 claims abstract description 133
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 15
- 238000009713 electroplating Methods 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 139
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000010419 fine particle Substances 0.000 claims description 19
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 11
- 229910052717 sulfur Inorganic materials 0.000 claims description 11
- 239000011593 sulfur Substances 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 15
- 239000002585 base Substances 0.000 abstract description 10
- 229910052742 iron Inorganic materials 0.000 abstract description 5
- 239000003513 alkali Substances 0.000 abstract description 4
- 229910052799 carbon Inorganic materials 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract description 4
- 239000007864 aqueous solution Substances 0.000 abstract description 3
- 239000006229 carbon black Substances 0.000 abstract description 2
- 239000000571 coke Substances 0.000 abstract description 2
- 239000010439 graphite Substances 0.000 abstract description 2
- 229910002804 graphite Inorganic materials 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 229910000990 Ni alloy Inorganic materials 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000011282 treatment Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 15
- 239000006185 dispersion Substances 0.000 description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 10
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000005868 electrolysis reaction Methods 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 7
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 7
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 230000013011 mating Effects 0.000 description 6
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 6
- 235000019270 ammonium chloride Nutrition 0.000 description 5
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 5
- 239000004327 boric acid Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000001103 potassium chloride Substances 0.000 description 5
- 235000011164 potassium chloride Nutrition 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000003014 ion exchange membrane Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- 244000060011 Cocos nucifera Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- SQZYOZWYVFYNFV-UHFFFAOYSA-L iron(2+);disulfamate Chemical compound [Fe+2].NS([O-])(=O)=O.NS([O-])(=O)=O SQZYOZWYVFYNFV-UHFFFAOYSA-L 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- -1 platinum group metals Chemical class 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- 229940071127 thioglycolate Drugs 0.000 description 1
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は電解に使用して低い水素過電圧を示す陰極、特
にアルカリ水酸化物、アルカリ炭酸化物、その他アルカ
リ性の水溶液中において、優れ九低水素7M′I/L圧
を示す陰極に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a cathode that is used in electrolysis and exhibits a low hydrogen overvoltage, especially in aqueous solutions of alkali hydroxides, alkali carbonates, and other alkaline solutions. Regarding the cathode shown.
従来より陰極で水素ガスを発生する技術とし膜を用いる
イオン交換脱法塩化アルカリ水溶液電解及び水電解等が
知られている
特に近年省エネルギーの観点から、こノ種技術において
電解電圧の低減が望まれており、その−環として陰極の
水素過電圧を減少させることが提唱されている。Conventionally, techniques for generating hydrogen gas at the cathode, such as ion exchange de-alkali chloride aqueous electrolysis and water electrolysis using membranes, have been known.In recent years, especially from the perspective of energy conservation, reduction of the electrolysis voltage has been desired in this type of technology. It has been proposed that the hydrogen overvoltage at the cathode can be reduced by using the ring.
低水素過電圧陰極に関しては、従来より各種材料の電極
が提案されており、本発明者等は先に炭素質からなる微
粒子を分散させたニッケルを含むメッキ浴を使用して電
極基材に電気メッキを施すことにより優れた低水素過電
圧を示す陰極の製造方法を出願した。(特願昭55−1
11066号、特願昭55−164682号、特願昭5
−5−169059号、特願昭55−169060号)
これらの方法によって得られた陰極はいずれも電極基材
表面に被覆する金属がニッケルを主体とするもので、ニ
ッケル単独の層か、又は優位量のニッケルを含む合金の
層を前記炭素質微粒子の分散メッキ浴により形成したも
のであって、低い水素過電圧と優れた耐久性をもつ陰極
が得られるものの、11L極としての機械的強度、特に
電解運転時に発生する気泡による侵蝕などの点において
未だ充分なものとは云えない。Regarding low hydrogen overvoltage cathodes, electrodes made of various materials have been proposed in the past, and the present inventors first electroplated the electrode base material using a plating bath containing nickel in which carbonaceous fine particles were dispersed. We have filed an application for a method for producing a cathode that exhibits excellent low hydrogen overvoltage. (Special application 1986-1
No. 11066, patent application No. 164682, patent application No. 1983
(No. 5-169059, Japanese Patent Application No. 55-169060) In all of the cathodes obtained by these methods, the metal coated on the surface of the electrode base material is mainly nickel, and either a layer of nickel alone or a layer of nickel predominant. Although a layer of an alloy containing a certain amount of nickel is formed in a dispersion plating bath of the carbonaceous fine particles, and a cathode with low hydrogen overvoltage and excellent durability is obtained, the mechanical strength as an 11L electrode, especially It is still not sufficient in terms of corrosion caused by bubbles generated during electrolytic operation.
本発明者等はかかる炭素質微粒子の分散メッキ浴を使用
する陰極の製法につき引続く研究の結果、低い水素過電
圧特性を維持しつつ、より発明を完成するに至った。As a result of continued research into a method for manufacturing a cathode using such a dispersion plating bath of carbonaceous fine particles, the present inventors have successfully completed the invention while maintaining low hydrogen overvoltage characteristics.
即ち本発明は、電極基材表面に、(イ)炭素質からなる
微粒子を分散させたニッケル、又はこれと他の金属成分
を含むメッキ浴を用いて、電気メッキによりニッケルメ
ッキ層、又は20重鎗チ以上のニッケルを含む合金メッ
キ層を形成させ、次いで(ロ)その表面に常法の電気メ
ッキによりニッケルメッキ層又は含硫黄ニッケルメッキ
層を形成させることからなり、これら(イ)、(ロ)の
組合せを少なくとも1回行なうことを特徴とする低水素
過電圧陰極の製法である。That is, the present invention provides a method for forming a nickel plating layer or a 20-layer plating layer on the surface of an electrode base material by electroplating using (a) nickel in which carbonaceous particles are dispersed, or a plating bath containing nickel and other metal components. The process consists of forming an alloy plating layer containing more than a nickel, and then (b) forming a nickel plating layer or a sulfur-containing nickel plating layer on the surface by conventional electroplating. ) is performed at least once.
上記の本発明方法においては、先ず(イ)の工程として
先の出願と略同様な炭素質微粒子による分散メッキ浴を
用いて基材表面に電気メッキを施すものであり、かかる
メッキにおいても、被覆金属としてニッケルの存在を必
須とするが、その量は必ずしもニッケルの優位量を必要
とせず、20重量−以上のニッケルを含む層によって被
覆されておればよく、勿論ニッケル単独で構成されてい
てもよい。In the method of the present invention described above, first, in step (a), electroplating is applied to the surface of the substrate using a dispersion plating bath using carbonaceous fine particles, which is substantially the same as in the previous application, and in such plating, the coating is Although the presence of nickel as a metal is essential, the amount thereof does not necessarily require a predominant amount of nickel, and it is sufficient if the layer is coated with a layer containing 20% or more of nickel by weight, and of course, it may be composed of nickel alone. good.
この様にして炭素質微粒子を分散せしめたメッキ浴を用
いて、ニッケルを20重tチ以上析出させたものは表面
積が大きく、優れた活性の低水素過電圧陰極を得ること
が出来るが、本発明では更にその表面にニッケル又は含
硫黄ニッケルの層を電気メッキにより形成させるもので
ある。Using a plating bath in which carbonaceous fine particles are dispersed in this manner, a cathode in which nickel is precipitated by 20 weights or more has a large surface area and an excellent activity and low hydrogen overvoltage cathode can be obtained, but the present invention Then, a layer of nickel or sulfur-containing nickel is further formed on the surface by electroplating.
かくすることにより電極の機械的強度を向上させ、かつ
ニッケルの持つ低水素過電圧特性を一層向上させ長期に
亘って高い性能を維持することが出来る。特に前述した
炭素質微粒子の分散メッキ浴で形成されたメッキのニッ
ケル成分が優位量でない場合においてかかるニッケルメ
ッキ、又は含硫黄ニッケルメッキはニッケル成分を補填
して低水素過電圧を確保することが出来る0
この場合のメッキは、前記の炭素質微粒子の分散メッキ
浴によるものではなく、通常の電気メッキによって行な
われる。By doing so, it is possible to improve the mechanical strength of the electrode, further improve the low hydrogen overvoltage characteristics of nickel, and maintain high performance over a long period of time. In particular, when the nickel component of the plating formed in the carbonaceous fine particle dispersion plating bath described above is not in a dominant amount, such nickel plating or sulfur-containing nickel plating can compensate for the nickel component and ensure a low hydrogen overvoltage. In this case, plating is performed not by the above-mentioned dispersion plating bath of carbonaceous fine particles, but by ordinary electroplating.
本発明方法に使用する電極基材としては、鉄、ニッケル
、ステンレス、銅、およびこれらの合金などや、鉄玉に
ニッケル、銅、クロムなどをメッキしたもの、更にはパ
ルプ金属に特定の金属をメッキしたものなど多くのもの
が使用出来る〇
一方、メッキ浴中に分散させる前記炭素質からなる微粒
子としては、木炭、石炭、骨炭などの炭素類、および黒
鉛、活性炭、カーボンブラック、コークス等の微粒子を
挙げることが出来、特に木材、ヤシガラ等を原料とした
活性炭が性能上も又、経済的にも有利である0
かかる炭素質微粒子の分散メッキ浴に用いる金属成分と
しては既述の通りニッケルを必須の金属として含むもの
であるが、これ以外にはコバルト、鉄、銀、銅、リン、
タングステン、モリブデン、マグネシウム、チタン、ベ
リリウム、クロム、鉛、マンガン、錫、亜鉛、ビスマス
等、多くの金属が用いられ、これらの一種又は二種以上
を併用せしめてもよい。The electrode base materials used in the method of the present invention include iron, nickel, stainless steel, copper, and alloys thereof, iron balls plated with nickel, copper, chromium, etc., and pulp metal plated with specific metals. Many materials such as plated particles can be used. On the other hand, the carbonaceous particles to be dispersed in the plating bath include carbons such as charcoal, coal, and bone charcoal, as well as graphite, activated carbon, carbon black, coke, etc. In particular, activated carbon made from wood, coconut husk, etc. is advantageous both in terms of performance and economics. As mentioned above, the metal component used in the dispersion plating bath for such carbonaceous particles is nickel. It contains cobalt, iron, silver, copper, phosphorus,
Many metals such as tungsten, molybdenum, magnesium, titanium, beryllium, chromium, lead, manganese, tin, zinc, and bismuth are used, and one or more of these may be used in combination.
但しこれらの合金組成は使用条件において十分耐蝕性を
有する様な組成とすることが必要であり、ニッケル以外
の上記金属が過大に含まれると、耐蝕性が悪くなる。従
って、電気メッキされたメッキ層中のニッケル含量がメ
ッキ金属に対して20重量%以上を含むことが必要であ
り、その配合比率は使用する金属の組合せにより好適に
配合されるべきである。・
例えば、ニッケルーコバルト、ニッケルー鉄の組合せに
おいては、耐蝕性の面よりニッケル20重量%以上、好
ましくは25重量−以上が適当であり、ニッケルー鋼の
組合せにおいては、耐蝕性の面よa=ニッケル3重量−
以上がよい。However, it is necessary that these alloy compositions have sufficient corrosion resistance under the conditions of use, and if the above-mentioned metals other than nickel are included in an excessive amount, the corrosion resistance will deteriorate. Therefore, it is necessary that the electroplated plating layer contains 20% by weight or more of nickel based on the plating metal, and the mixing ratio should be suitably adjusted depending on the combination of metals used.・For example, in the combination of nickel-cobalt and nickel-iron, 20% by weight or more of nickel, preferably 25% by weight or more is appropriate in terms of corrosion resistance, and in the combination of nickel-steel, a= Nickel 3 weight -
The above is good.
耐蝕性とメッキ操作の容易性から最も好ましいメッキ浴
は、はぼニッケルのみの浴成分である0
上記した分散メッキ浴における炭素質微粒子の作用は明
らかではないが、電気メッキに際して、前記ニッケル又
はこれと他の金属と共に基材表面に適度に破着し、陰極
表面を粗面化し、かつ触媒能を大きくして水素過電圧の
低下に寄与するものと推定される。In view of corrosion resistance and ease of plating operation, the most preferable plating bath is one containing only nickel.Although the effect of carbonaceous particles in the above-mentioned dispersion plating bath is not clear, during electroplating, It is presumed that this adhesion to the base material surface along with other metals makes the cathode surface rough, increases the catalytic ability, and contributes to a reduction in the hydrogen overvoltage.
かかる微粒子は細かいもの程有利であるが、100μ以
下、特に10μ以下が好ましい。但し一般市販の微粒子
は可成り広範囲の粒度分布を持つものが多いので、10
0μ以下の粒子が5Ots以上含まれておれば本発明の
目的達成には特に支障を生じない。The finer the fine particles, the more advantageous they are, but preferably 100 μm or less, particularly 10 μm or less. However, since many commercially available fine particles have a fairly wide particle size distribution,
As long as 5 Ots or more of particles with a size of 0 μ or less are contained, there will be no particular problem in achieving the object of the present invention.
メッキ浴中にかかる微粒子を分散させる場合、その濃度
は0.1〜100g/l、好ましくは1〜20 g/l
である。When such fine particles are dispersed in a plating bath, the concentration thereof is 0.1 to 100 g/l, preferably 1 to 20 g/l.
It is.
この微粒子の濃度は、ある一定濃度を越えて高濃度とな
っても得られ九陰極の水素過電圧には余り影響を及ぼさ
ないが、濃度が過大となると、均一な分散が困難とな抄
、メッキ操作は厄介となる。又、低濃度に過ぎるときは
所期の低水素過電圧陰極は得られ難くなり、前記した濃
度範囲が望ましい。炭、素質微粒子をメッキ浴に分散さ
せるには適当な撹拌を行う必要があるが、その具体的手
段としては、ガス吹込みによる方法、液循環による方法
、或は撹拌機を用いる方法等があり、又小規模の場合に
はマグネチツクスターラーによる撹拌方法も推奨出来る
。Even if the concentration of these fine particles exceeds a certain level, it will not affect the hydrogen overvoltage of the cathode much, but if the concentration becomes too high, uniform dispersion becomes difficult. Operation becomes cumbersome. Furthermore, if the concentration is too low, it becomes difficult to obtain the desired low hydrogen overvoltage cathode, so the concentration range described above is desirable. Appropriate stirring is required to disperse carbon and elementary particles in the plating bath, and specific methods include gas blowing, liquid circulation, or using a stirrer. In addition, in the case of a small scale, a stirring method using a magnetic stirrer is also recommended.
この撹拌が不充分でおると、均一なメッキ物を得ること
が出来ず、逆に強過ぎると活性のあるメッキ物とならな
い。又メッキ操作を長時間継続すると炭素質微粒子は消
費され、特に細かい粒子が多く減少してゆくが、その際
にはブレコート濾過器などを用いてすべての微粒子を除
去し、再び新しい粒子を添加して操作することがよい。If this stirring is insufficient, a uniform plated product cannot be obtained, and on the other hand, if it is too strong, an active plated product cannot be obtained. Furthermore, if the plating operation continues for a long time, the carbonaceous particles will be consumed, and many of the fine particles in particular will be reduced, but in this case, all the particles should be removed using a Brecoat filter, etc., and new particles should be added again. It is recommended to operate the
上記のメッキを行うに際してはメッキ条件、即ちメッキ
浴組成、メッキ温度、メッキ電流密度、メッキ液PH%
相手極の金属組成などを適宜選定することにより目的と
するメッキ物を得ることが出来る。When performing the above plating, the plating conditions, i.e. plating bath composition, plating temperature, plating current density, plating solution PH%
By appropriately selecting the metal composition of the mating electrode, the desired plated product can be obtained.
この場合、メッキ浴中又は相手極中に含まれていない第
3の金属成分を微量添加することにより、更に過電圧の
低いメッキ物を得ることが出来る。In this case, by adding a trace amount of a third metal component that is not included in the plating bath or the mating electrode, a plated product with even lower overvoltage can be obtained.
かかる微量の第3成分は析出金属中に1重量%以下の量
で存在させることが好ましく、効果のあるものとしては
白金、ロジウム、イリジウム、パラジウム等の白金族金
属、或は銅、クロム、アルミニウム、スズ、亜鉛、バリ
ウム、銀等を挙げることが出来る。It is preferable that such a trace amount of the third component be present in the precipitated metal in an amount of 1% by weight or less, and effective examples include platinum group metals such as platinum, rhodium, iridium, and palladium, or copper, chromium, and aluminum. , tin, zinc, barium, silver, etc.
ニッケル以外の第2成分として上記のものを含む場合に
は、それ以外の第3成分を適宜選定することが必要であ
る。When the above-mentioned second component other than nickel is included, it is necessary to appropriately select the third component other than nickel.
本発明方法では上述のメッキに次いで、更に(ロ)の工
程のニッケルメッキ又は含硫黄ニッケルメッキを行うの
であるが、この場合のメッキは既述の通り炭素質微粒子
による分散メッキ浴を用いるものではなく、通常のメッ
キ浴、例えば、硫酸ニッケル、塩化ニッケル、スル7ア
ミノ酸ニツケル等を主体とするメッキ浴を使用するか、
或は電気メッキによって硫黄を含むニッケルメッキ層を
形成しうる浴、例えば前記通常のメッキ浴中にチオ尿素
、チオシアン酸塩、チオ硫酸塩、チオグリコール酸塩等
を添加した浴を使用する0
ここで上記の如き炭素質微粒子による分散メッキ及び通
常のニッケルメッキ、又は含硫黄ニッケルメッキの工程
は、これらの組合せを2回以上繰返し行って、積層メッ
キとすることも出来る。尚、これらの組合せによるメッ
キの最後の層はニッケルメッキ層又は含硫黄ニッケルメ
ッキ層となるが、これが取扱などの点で有利となるので
ある。In the method of the present invention, after the above-mentioned plating, nickel plating or sulfur-containing nickel plating is performed in step (b), but as described above, the plating in this case does not use a dispersion plating bath using carbonaceous fine particles. Instead, use a normal plating bath, for example, a plating bath mainly containing nickel sulfate, nickel chloride, nickel 7-amino acid, etc.
Alternatively, a bath capable of forming a sulfur-containing nickel plating layer by electroplating, such as a bath in which thiourea, thiocyanate, thiosulfate, thioglycolate, etc. are added to the above-mentioned ordinary plating bath, is used. The steps of dispersion plating using carbonaceous fine particles and normal nickel plating or sulfur-containing nickel plating as described above can also be combined to form a laminated plating by repeating the combination two or more times. Incidentally, the final layer of plating formed by these combinations is a nickel plating layer or a sulfur-containing nickel plating layer, which is advantageous in terms of handling and the like.
この様な方法で得られるメッキ物の厚さは純金属換算で
炭素質微粒子を分散させた浴によるメッキにおいて合計
約10〜150μ、ニッケル又は含硫黄ニッケル浴によ
るメッキで合計約5〜100μであるが、実際のメッキ
物は炭素質微粒子が存在しているため可成り厚くなって
お9、それは純金属換算の2〜50倍位の範囲と推定さ
れる。The thickness of the plated product obtained by this method is approximately 10 to 150 μ in total when plating with a bath in which carbonaceous fine particles are dispersed, and approximately 5 to 100 μ in total when plating with a nickel or sulfur-containing nickel bath in terms of pure metal. However, the actual plated material is considerably thicker due to the presence of carbonaceous fine particles9, which is estimated to be in the range of 2 to 50 times that of pure metal.
ここでかかる工程の組合せを少くとも1回実施した後、
このメッキ物を100〜500℃の温度で焼成すること
により、電極としての耐蝕性を増し、高電流密度におけ
る操業に対しても充分な耐性を持つようになる。After performing such a combination of steps at least once,
By firing this plated product at a temperature of 100 to 500°C, it has increased corrosion resistance as an electrode and has sufficient resistance to operation at high current density.
例えばこの様な焼成をしない本発明方法による陰極で電
流密度150 A /13tr?において50〜150
時間水累発生を行うと一部においてメッキの剥落が認め
られ劣化の傾向を示すことがあるが、焼成したものは2
00A/d!n?で100時間の水素発生操作でも劣化
は全く認められない。For example, a current density of 150 A/13 tr with a cathode made by the method of the present invention without such firing? 50-150 in
If water accumulates for a long time, the plating may peel off in some areas and show a tendency for deterioration.
00A/d! n? No deterioration was observed even after 100 hours of hydrogen generation operation.
この焼成の雰囲気は、一般的には不活性ガス又は空気雰
囲気でよく、空気雰囲気で焼成したものは最初は水素過
電圧が高いが、数時間〜数日間水素発生を行うと低い水
素過電圧を示すようになる。The atmosphere for this firing may generally be an inert gas or air atmosphere. Products fired in an air atmosphere initially have a high hydrogen overvoltage, but after hydrogen generation for several hours to several days, they show a low hydrogen overvoltage. become.
この場合の不活性ガスとはメッキ物と反応しないガスを
意味し、析出金属の主体がニッケルの場合にはアルゴン
、ヘリウム、ネオン、窒素、炭酸ガス、水素等である。The inert gas in this case means a gas that does not react with the plated material, and when the main deposited metal is nickel, it includes argon, helium, neon, nitrogen, carbon dioxide, hydrogen, etc.
焼成は100〜5.00℃という比較的低い温度範囲内
で実施することがよく、100℃未満および500℃を
超えた温度での焼成は、いずれも上記温度範囲内での焼
成に比べて陰極としての寿命が短くなる。Firing is often carried out within a relatively low temperature range of 100 to 5.00°C, and firing at temperatures below 100°C and above 500°C both result in lower cathode resistance than firing within the above temperature range. The lifespan of the product will be shortened.
上記温度範囲内での焼成物は、陰極の寿命延長のほか、
特に高電流密度下での操業における耐性に優れ、又通常
の取扱いの際にも摩擦などでメッキの剥落が生じ鎗い。Products fired within the above temperature range not only extend the life of the cathode, but also
In particular, it has excellent resistance to operation under high current density, and the plating may peel off due to friction during normal handling.
以上の様にして得九本発明方法による陰極は水素発生用
の陰極として各種の電気化学的反応装置に用いられるが
、と9わけイオン交換膜法塩化アルカリ水溶液電解或は
アスベストの如き炉隔膜を用いるいわゆる隔膜法の塩化
アルカリ水溶液電解に用いて有効であり、その利用価値
は著しく大きい。The cathode obtained by the method of the present invention as described above is used as a cathode for hydrogen generation in various electrochemical reaction devices, but it is especially used in ion exchange membrane method, alkaline chloride aqueous solution electrolysis, or furnace diaphragm such as asbestos. It is effective for use in aqueous alkali chloride electrolysis using the so-called diaphragm method, and its utility value is extremely large.
以下実施例および比較例によって本発明を説明する。The present invention will be explained below with reference to Examples and Comparative Examples.
実施例1
直径3mmφのニッケル丸棒よりなる電極基材をトリク
ロルエチレンで脱脂洸浄後、塩酸中に80℃、30分間
浸漬してエツチングし、水洗した後、下記第1表に示す
組成のメッキ浴およびメッキ条件により電気メッキを行
なった。Example 1 An electrode base material made of a nickel round rod with a diameter of 3 mmφ was degreased with trichlorethylene, etched by immersing it in hydrochloric acid at 80°C for 30 minutes, washed with water, and then plated with the composition shown in Table 1 below. Electroplating was performed using different baths and plating conditions.
第1表
(炭素質微粒子分散メッキ浴によるメッキ)〔メッキ浴
組成〕
硫酸ニッケル 84g/を塩化ニッケ
ル 30g/を塩化アンモニウム
4.5g/を塩化カリ
6g/lホウ酸 30g/
を微粒子活性炭(二村化学■製KV−3,5g/110
0μ以下の粒子7oチ以上)
〔メッキ条件〕
メッキ浴pH3,5
相手極 電解ニッケルプレート温
度 40℃
メッキ電流密度 2A/(背メッキ時間
2時間次に、このメッキ物を
下記第2表のメッキ浴およびメッキ条件で電気メッキを
行った。Table 1 (Plating using carbonaceous fine particle dispersion plating bath) [Plating bath composition] Nickel sulfate 84g/nickel chloride 30g/ammonium chloride
4.5g/potassium chloride
6g/l boric acid 30g/
Particulate activated carbon (KV-3, manufactured by Nimura Kagaku ■, 5g/110
[Plating conditions] Plating bath pH 3.5 Counter electrode Electrolytic nickel plate temperature 40℃ Plating current density 2A/(back plating time 2 hours) Next, this plated product was placed in the plating bath shown in Table 2 below. Electroplating was performed under the following plating conditions.
第2表
にッケルメッキ浴によるメッキ)
〔メッキ浴組成〕
硫酸ニッケル s 4 g/l塩化ニ
ッケル 30g/を塩化アンモニウム
4.sg/を塩化カリ
6 g/lホウ酸
30 g/l〔メッキ条件〕
メッキ浴pH4
相手極 ニッケルプレート
温度 40℃メッキ電流
密度 2ん4−メッキ時間
0.5時間かくて得たメッキ物の水素発生
電位を2O−KOH較ao℃、20A/j−にオイテH
sc/&0電極基準で測定したところ−1,15Vであ
った。(Table 2 shows plating using Keckel plating bath) [Plating bath composition] Nickel sulfate s 4 g/l Nickel chloride 30 g/l ammonium chloride 4. sg/potassium chloride
6 g/l boric acid
30 g/l [Plating conditions] Plating bath pH 4 Counter electrode Nickel plate temperature 40℃ Plating current density 2-4-Plating time
The hydrogen generation potential of the plated material obtained in this way was compared with 2O-KOH at 20°C and 20A/J-.
When measured using the sc/&0 electrode standard, the voltage was -1.15V.
実施例2
直径3rrrnφのニッケル丸棒よりなる電極基材をト
リクロルエチレンで脱脂洗浄し、次いで塩酸中で80℃
、30分間エツチングし、水洗後、第3表に示すメッキ
浴組成およびメッキ条件で電気メッキし、次いで第4表
に示すメッキ浴組成およびメッキ条件で電気メッキし、
その後、再び第3表によるメッキ、及び第4表によるメ
ッキを行った。Example 2 An electrode base material made of a nickel round rod with a diameter of 3rrrnφ was degreased and cleaned with trichlorethylene, and then heated at 80°C in hydrochloric acid.
, etched for 30 minutes, washed with water, electroplated using the plating bath composition and plating conditions shown in Table 3, then electroplated using the plating bath composition and plating conditions shown in Table 4,
Thereafter, plating according to Table 3 and plating according to Table 4 were performed again.
硫酸ニッケル 84 g/を塩化ニッ
ケル 30g/を塩化アンモニウム
4.sg/L塩化カリ
6 g/lホウ酸 30
g/l〔メッキ条件〕
メッキ浴pH3,5
相手極 Ni30. Co709b合金
温度 40℃
メッキ電流密度 2A/dm’メッキ時
間 1時間〔メッキ浴組成〕
硫酸ニッケル 84g/を塩化ニッケ
ル aog/を塩化アンモニウム
4.sg/を塩化カリ
6 g/lホウ酸 3Og
/lチオ尿素 sg/l〔メッ
キ条件〕
メッキ浴pH4
相手極 ニッケル温度
40℃
メッキ電流密度 2A/d?F7″メッ
キ時間 0.5時間かくして得たメ
ッキ物の水素発生電位は−1,11Vであり、又第3表
のメッキを施したものの表面を剥して、金属成分の分析
を行ったところNi 32%、Co68%であった。Nickel sulfate 84 g/nickel chloride 30 g/ammonium chloride
4. sg/L potassium chloride
6 g/l boric acid 30
g/l [Plating conditions] Plating bath pH 3.5 Counter electrode Ni 30. Co709b alloy temperature 40℃ Plating current density 2A/dm' Plating time 1 hour [Plating bath composition] Nickel sulfate 84g/ to nickel chloride aog/ to ammonium chloride
4. sg/potassium chloride
6 g/l boric acid 3Og
/l Thiourea sg/l [Plating conditions] Plating bath pH 4 Mating electrode Nickel temperature
40℃ Plating current density 2A/d? F7'' Plating time: 0.5 hours The hydrogen generation potential of the plated product thus obtained was -1.11V, and when the surface of the plated product shown in Table 3 was peeled off and analyzed for metal components, it was found to be Ni 32 %, Co68%.
実施例3
実施例2における第3表の条件に代えて下記第5表を行
った以外は実施例2と同様に操作した。Example 3 The same procedure as in Example 2 was carried out except that the conditions in Table 3 below were replaced with those in Table 5 below.
硫酸ニッケル 1oog/lモリブデン
酸カリ 55 g/lクエン酸ナトリウム
91 g/l〔メッキ条件〕
メッキ浴pH3,5
相手極 ニッケルプレート
温度 30℃
メッキ電流密度 2 Alapr?メ
ッキ時間 1時間かくして得た
メッキ物の水素発生電位は−1,11Vであり、又第5
表のメッキを施したものの表面を剥して金属成分の分析
を行つ九ところNi70チ、Mo30チであった。Nickel sulfate 1oog/l Potassium molybdate 55 g/l Sodium citrate 91 g/l [Plating conditions] Plating bath pH 3,5 Mating electrode Nickel plate temperature 30°C Plating current density 2 Alapr? Plating time: 1 hour The hydrogen generation potential of the plated product thus obtained was -1.11V, and the fifth
When the surface of the plated surface was peeled off and the metal components were analyzed, the results were 70% Ni and 30% Mo.
実施例4
実施例1における第1表の条件に代えて下記第6表を行
った以外は実施例1と同様に操作したO
〔メッキ浴組成〕
スルファミン酸ニッケル 410 g/lスル
ファミン酸鉄 115 g/を尿素
30g/l
ポウ酸 25 g/lサッカリン
0.3g/lフッ化水素アンモニウム
10 g/l〔メッキ条件〕
メッキ浴PH3,0
相手極 電解ニッケルプレート温
度 70℃
メッキ電流密度 3A/dydメッキ時
間 1.3時間■でおり、第6表
のメッキを施したものの表面を剥離して金属成分の分析
を行ったところ、N138チ、Fe62チであった。Example 4 The same procedure as in Example 1 was carried out except that the conditions in Table 1 below were replaced with the conditions in Table 1 in Example 1. [Plating bath composition] Nickel sulfamate 410 g/l Iron sulfamate 115 g / urea
30g/l poric acid 25g/l saccharin
0.3 g/l ammonium hydrogen fluoride 10 g/l [Plating conditions] Plating bath PH3.0 Counter electrode Electrolytic nickel plate temperature 70°C Plating current density 3A/dyd Plating time 1.3 hours When the plated surface was peeled off and the metal components were analyzed, it was found to be 138% N and 62% Fe.
実施例5
3nmφのニッケル丸棒の多数を実施例1と同様にして
エツチングし、下記第7表に示すメッキ条件でメッキ後
、実施例2の第4表に示すメッキ条件でメッキした。Example 5 A large number of 3 nm diameter nickel round bars were etched in the same manner as in Example 1, plated under the plating conditions shown in Table 7 below, and then plated under the plating conditions shown in Table 4 of Example 2.
第7表
(炭素質微粒子分数メッキ浴によるメッキ)〔メッキ浴
組成〕
硫酸ニッケル 84 g/を塩化ニッ
ケル 30 g/を塩化アンモニウム
4.5g/を塩化カリ
6 g/Lホウ酸 s
ag/L微粒状活性炭 5 g /
L(二杓化学■製KV−:1 ”)
硫酸鋼 100嘘/l〔メッキ条
件〕
メッキ浴pH3,5
相手極 Ni40%、Co60%のプレー
ト温度 40℃
メッキ電流密度 2A/dW?メッキ
時間 1時間かくて得たメッキ
部分の組成分析結果はNi42チ、Co58チであった
。Table 7 (Plating using carbonaceous fine particle fractional plating bath) [Plating bath composition] Nickel sulfate 84 g/nickel chloride 30 g/ammonium chloride 4.5 g/potassium chloride
6 g/L boric acid s
ag/L fine granular activated carbon 5 g/
L (KV-: 1 ” manufactured by Nisaku Kagaku ■) Sulfuric acid steel 100 lie/l [Plating conditions] Plating bath pH 3,5 Mating electrode 40% Ni, 60% Co Plate temperature 40℃ Plating current density 2A/dW?Plating time 1 The compositional analysis result of the plated part obtained over time was 42% Ni and 58% Co.
次にこれに実施例1の第2表による条件でニッケルメッ
キ層を形成し、更に前記第7表による炭素質微粒子分散
ニッケルメッキ浴によるメッキを行い、最後に第2表に
よる条件でニッケルメッキ層を形成した。得られたメッ
キ物の水素発生電位は−i、osvであった。Next, a nickel plating layer was formed on this under the conditions according to Table 2 of Example 1, and further plating was performed using a carbonaceous fine particle dispersed nickel plating bath according to Table 7, and finally a nickel plating layer was formed under the conditions according to Table 2. was formed. The hydrogen generation potential of the obtained plated product was -i, osv.
実施例6
実施例5において第7表のメッキ浴組成中で第3成分と
して使用した硫酸銅の代りに下記第8表に示す第3成分
を使用して実施例5と同様に操作し九。その結果得た各
メッキ物の水素発生電位を第8表に示す。Example 6 The same procedure as in Example 5 was carried out except that the third component shown in Table 8 below was used in place of the copper sulfate used as the third component in the plating bath composition shown in Table 7 in Example 5. Table 8 shows the hydrogen generation potential of each plated product obtained as a result.
第8表
実施例7
実施例5において第7表のメッキ条件中で用いた相手極
としてNi 80%%Co20%のプレートを使用した
以外は実施例5と同様に操作した。Table 8 Example 7 The same procedure as in Example 5 was carried out except that a plate of 80% Ni and 20% Co was used as the mating electrode under the plating conditions shown in Table 7.
この場合、第1回目の炭素質微粒子による分散メッキ(
第7表による初回のメッキ)で得たメッキの析出金属組
成はNi81%、Co19チであった。In this case, the first dispersion plating using carbonaceous particles (
The precipitated metal composition of the plating obtained in the first plating according to Table 7 was 81% Ni and 19% Co.
次に、上記と同様の操作により多数のメッキ物を作り、
これらを空気中及びアルゴンガス中で100〜600℃
の範囲の所定温度で30分間焼成し、その後これを20
0 A/dtr?で3O−1NaOH中で80℃、10
時間水素発生せしめた後、実施例1の方法で電位を測定
し、その電位について−1,15V以下が2回続いた時
点を電極の寿命と判断してその性能(耐蝕性)を調べた
。Next, make a large number of plated items by the same operation as above,
These were heated to 100 to 600℃ in air and argon gas.
Baked for 30 minutes at a predetermined temperature in the range of
0 A/dtr? in 3O−1 NaOH at 80°C, 10
After hydrogen was generated for an hour, the potential was measured by the method of Example 1, and the life of the electrode was determined when the potential was below -1.15 V twice, and its performance (corrosion resistance) was examined.
この試験は、各温度について3本のサンプルで実施した
。This test was conducted on three samples for each temperature.
その結果を第1図(アルゴン雰囲気下における焼成)お
よび第2図(空気雰囲気下における焼成)に示す。なお
図中Aは焼成しない電極についての性能を示したもので
ある。The results are shown in FIG. 1 (firing in an argon atmosphere) and FIG. 2 (firing in an air atmosphere). Note that A in the figure shows the performance of an electrode that is not fired.
実施例8および比較例1
実施例5と同様の6浴を用い、同様の操作によってメッ
キ物を得た。但し、使用した電極基材はニッケル製の菱
形開口形状を持クラス網であって、厚みIX、刻み巾1
.5 X、網目の短手方向長さ6.5%、長手方向長さ
12.7%のものを用いた。Example 8 and Comparative Example 1 Using the same six baths as in Example 5, plated products were obtained by the same operations. However, the electrode base material used was made of nickel and had a diamond-shaped opening shape, and had a thickness of IX and a width of 1.
.. 5X, the length of the mesh in the transverse direction was 6.5%, and the length in the longitudinal direction was 12.7%.
このメッキ物をアルゴンガス中で温度300℃で焼成し
、これを陰極として陽イオン交換膜電解槽に組込み、食
塩電解を実施した。(実施例8)
この際、同様に陰極としてメッキを施さないニッケルラ
ス網を組込んだ電解槽による食塩電解も併せて実施した
。(比較例1)
これらの電解槽は共にldm”の電極面積を持ち、Na
C1分解率45%、槽温度90℃、陰極液(NaOH)
濃度30チ、イオン交換膜はスルホン酸膜の片面をカル
ボン酸型に改質した膜を使用し、6力月間の運転を行っ
た。This plated product was fired at a temperature of 300° C. in argon gas, and was incorporated into a cation exchange membrane electrolytic cell as a cathode to carry out salt electrolysis. (Example 8) At this time, salt electrolysis was also carried out using an electrolytic cell incorporating a nickel lath mesh without plating as a cathode. (Comparative Example 1) Both of these electrolytic cells have an electrode area of 1 dm", and the Na
C1 decomposition rate 45%, bath temperature 90°C, catholyte (NaOH)
The concentration was 30%, the ion exchange membrane was a sulfonic acid membrane with one side modified to a carboxylic acid type, and the operation was carried out for 6 months.
この場合の3力月目、6力月目における摺電圧および電
流効率の測嚢値を第9表に示す。Table 9 shows the measured values of the sliding voltage and current efficiency at the third and sixth months in this case.
第9表Table 9
図面は共に本発明方法によって得た陰極について各焼成
温度に対する劣化に至るまでの時間を示したもので、第
1図はアルゴンガス雰囲気中で焼成した場合を、第2図
は空気雰囲気中で焼成した場合を示す。
特許出願人
東亜合成化学工業株式会社Both drawings show the time required for the cathode obtained by the method of the present invention to deteriorate at each firing temperature. Figure 1 shows the case when fired in an argon gas atmosphere, and Figure 2 shows the time taken for the cathode to deteriorate in an air atmosphere. Indicates the case where Patent applicant Toagosei Chemical Industry Co., Ltd.
Claims (1)
散させたニッケル、又はこれと他の金属ツケルを含む合
金メッキ層を形成させ、次いで(ロ)その表面に常法の
電気メッキによ抄ニッケルメッキ層又は含硫黄ニッケル
メッキ層を形成させることからなり、これら(イ)、(
ロ)の組合せを少なくとも1回行なうことを特徴とする
低水素過電圧陰極の製法。 2、電極基材表面に、(イ)炭素質からなる微粒子を分
散させたニッケル、又はこれを他の金属成分を含むメッ
キ浴を用いて電気メッキによりニッケルメッキ層又は2
0重量−以上のニッケルを含む合金メッキ層を形成させ
、次いで(ロ)その表面に常法の電気メッキによりニッ
ケルメッキ層又は含硫黄ニッケルメッキ層を形成させる
ことからなり、これら(イ)、(ロ)の組合せを少なく
とも1回行なった後、温度100〜500℃で焼成する
ことを特徴とする低水素過電圧陰極の製法。[Claims] 1. Forming on the surface of the electrode base material (a) a plating layer of nickel in which carbonaceous particles are dispersed, or an alloy plating layer containing nickel and other metals, and then (b) the surface thereof. It consists of forming a sulfur-containing nickel plating layer or a sulfur-containing nickel plating layer by conventional electroplating, and these (a), (
A method for producing a low hydrogen overvoltage cathode, characterized by carrying out the combination of (b) at least once. 2. A nickel plating layer is formed on the surface of the electrode base material by electroplating using (a) nickel in which carbonaceous fine particles are dispersed, or a plating bath containing other metal components.
It consists of forming an alloy plating layer containing 0 weight or more of nickel, and then (b) forming a nickel plating layer or a sulfur-containing nickel plating layer on the surface by conventional electroplating, and these (a), ( A method for producing a low hydrogen overvoltage cathode, which comprises performing the combination (b) at least once and then firing at a temperature of 100 to 500°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56163395A JPS6053757B2 (en) | 1981-10-15 | 1981-10-15 | Manufacturing method of low hydrogen overvoltage cathode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56163395A JPS6053757B2 (en) | 1981-10-15 | 1981-10-15 | Manufacturing method of low hydrogen overvoltage cathode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5867883A true JPS5867883A (en) | 1983-04-22 |
| JPS6053757B2 JPS6053757B2 (en) | 1985-11-27 |
Family
ID=15773069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56163395A Expired JPS6053757B2 (en) | 1981-10-15 | 1981-10-15 | Manufacturing method of low hydrogen overvoltage cathode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053757B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147577A (en) * | 1982-02-24 | 1983-09-02 | Toyo Soda Mfg Co Ltd | Production of electrode |
| WO2018029967A1 (en) * | 2016-08-12 | 2018-02-15 | 日立造船株式会社 | Electrode manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6348743B2 (en) * | 2014-03-19 | 2018-06-27 | 日立造船株式会社 | Alloy electrode for hydrogen generation and method for producing the same |
-
1981
- 1981-10-15 JP JP56163395A patent/JPS6053757B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58147577A (en) * | 1982-02-24 | 1983-09-02 | Toyo Soda Mfg Co Ltd | Production of electrode |
| WO2018029967A1 (en) * | 2016-08-12 | 2018-02-15 | 日立造船株式会社 | Electrode manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6053757B2 (en) | 1985-11-27 |
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