JPS5868954A - 高周波トランジスタのパツケ−ジ - Google Patents

高周波トランジスタのパツケ−ジ

Info

Publication number
JPS5868954A
JPS5868954A JP56169058A JP16905881A JPS5868954A JP S5868954 A JPS5868954 A JP S5868954A JP 56169058 A JP56169058 A JP 56169058A JP 16905881 A JP16905881 A JP 16905881A JP S5868954 A JPS5868954 A JP S5868954A
Authority
JP
Japan
Prior art keywords
dielectric thin
electrode
package
metal
thin films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56169058A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6255721B2 (2
Inventor
Osamu Ishihara
理 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56169058A priority Critical patent/JPS5868954A/ja
Publication of JPS5868954A publication Critical patent/JPS5868954A/ja
Publication of JPS6255721B2 publication Critical patent/JPS6255721B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
  • Microwave Amplifiers (AREA)
JP56169058A 1981-10-20 1981-10-20 高周波トランジスタのパツケ−ジ Granted JPS5868954A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56169058A JPS5868954A (ja) 1981-10-20 1981-10-20 高周波トランジスタのパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56169058A JPS5868954A (ja) 1981-10-20 1981-10-20 高周波トランジスタのパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5868954A true JPS5868954A (ja) 1983-04-25
JPS6255721B2 JPS6255721B2 (2) 1987-11-20

Family

ID=15879556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56169058A Granted JPS5868954A (ja) 1981-10-20 1981-10-20 高周波トランジスタのパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS5868954A (2)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JP2010205772A (ja) * 2009-02-27 2010-09-16 Denso Corp Ｉｃ搭載基板、プリント配線板、及び製造方法
JP2013501362A (ja) * 2009-08-04 2013-01-10 ジーエーエヌ システムズ インコーポレイテッド アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ
US9818857B2 (en) 2009-08-04 2017-11-14 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
WO2020100219A1 (ja) 2018-11-13 2020-05-22 三菱電機株式会社 高周波増幅器および高周波増幅器モジュール

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JP2010205772A (ja) * 2009-02-27 2010-09-16 Denso Corp Ｉｃ搭載基板、プリント配線板、及び製造方法
US8247702B2 (en) 2009-02-27 2012-08-21 Denso Corporation Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
DE102010002050B4 (de) * 2009-02-27 2026-02-05 Denso Corporation Leiterplatte mit daran befestigtem IC, Leiterplatte und Verfahren zur Fertigung der Leiterplatte mit daran befestigtem IC
JP2013501362A (ja) * 2009-08-04 2013-01-10 ジーエーエヌ システムズ インコーポレイテッド アイランドマトリックス化窒化ガリウムマイクロ波トランジスタおよびパワースイッチングトランジスタ
US9818857B2 (en) 2009-08-04 2017-11-14 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
WO2020100219A1 (ja) 2018-11-13 2020-05-22 三菱電機株式会社 高周波増幅器および高周波増幅器モジュール

Also Published As

Publication number Publication date
JPS6255721B2 (2) 1987-11-20

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