JPS5874352U - 回路基板 - Google Patents

回路基板

Info

Publication number
JPS5874352U
JPS5874352U JP1981170172U JP17017281U JPS5874352U JP S5874352 U JPS5874352 U JP S5874352U JP 1981170172 U JP1981170172 U JP 1981170172U JP 17017281 U JP17017281 U JP 17017281U JP S5874352 U JPS5874352 U JP S5874352U
Authority
JP
Japan
Prior art keywords
circuit board
chip
view
accommodated
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981170172U
Other languages
English (en)
Inventor
賀津雄 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Elemex Corp
Original Assignee
Ricoh Elemex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Elemex Corp filed Critical Ricoh Elemex Corp
Priority to JP1981170172U priority Critical patent/JPS5874352U/ja
Publication of JPS5874352U publication Critical patent/JPS5874352U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のテープキャリヤー用回路基板の一例を示
す要部平面図、第２図はその断面図、第３図は本考案の
一実施例を示す要部平面図、第４図はその要部断面図、
第５図は本考案の他の実施例を示す要部平面図、第６図
は本考案のさらに他め実施例を示す要部平面図。、 １１・・・・・・回路基板、１２・・・・・・デバイス
、１３・・・　　　−・・・フィンガー、１４・・・・
・・ＩＣ，１５・・・・・・バンブ、１８・・・・・・
切り欠き。

Claims (1)

    【実用新案登録請求の範囲】
  1. 可撓性フィルム上に選択的に形成された金属配線を施し
    たチーブキャリヤー用回路基板に於いてｉＣチップの収
    まるデバイス孔周辺に複数の切り欠きを設けたことを特
    徴とする回路基板。
JP1981170172U 1981-11-13 1981-11-13 回路基板 Pending JPS5874352U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981170172U JPS5874352U (ja) 1981-11-13 1981-11-13 回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981170172U JPS5874352U (ja) 1981-11-13 1981-11-13 回路基板

Publications (1)

Publication Number Publication Date
JPS5874352U true JPS5874352U (ja) 1983-05-19

Family

ID=29962136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981170172U Pending JPS5874352U (ja) 1981-11-13 1981-11-13 回路基板

Country Status (1)

Country Link
JP (1) JPS5874352U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125637A (en) * 1979-03-20 1980-09-27 Fujitsu Ltd Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55125637A (en) * 1979-03-20 1980-09-27 Fujitsu Ltd Production of semiconductor device

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