JPS5878657U - 絶縁型半導体装置 - Google Patents

絶縁型半導体装置

Info

Publication number
JPS5878657U
JPS5878657U JP1981174407U JP17440781U JPS5878657U JP S5878657 U JPS5878657 U JP S5878657U JP 1981174407 U JP1981174407 U JP 1981174407U JP 17440781 U JP17440781 U JP 17440781U JP S5878657 U JPS5878657 U JP S5878657U
Authority
JP
Japan
Prior art keywords
semiconductor device
isolated semiconductor
heat sink
insulated
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981174407U
Other languages
English (en)
Inventor
澤島　一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981174407U priority Critical patent/JPS5878657U/ja
Publication of JPS5878657U publication Critical patent/JPS5878657U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
なお第１図において、１・・・・・・半導体素子、２゜
４．６・・・・・・ろう材、３・・・・・・ストレス緩
衝板、５・・・・・・導電体、７・・・・・・絶縁体、
８・・・・・・良熱伝導樹脂接着剤、９・・・・・・放
熱体、である。 補正　昭５７．　４．２’２ 図面の簡単な説明を次のように補正する。 明細書箱６頁１５行目の［なお第１図において、」の前
に［第１図は、絶縁型トランジスタ装置の本考案を用い
た実施例であり、」を挿入する。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個の電極端子を有し、該端子のすべてが放熱体より
    電気的に絶縁されている、絶縁型半導体装置において、
    該放熱体と電気的絶縁物との接続を、柔軟性のある熱伝
    導良好な樹脂接着剤を用いた事を特徴とする絶縁型半導
    体装置。
JP1981174407U 1981-11-24 1981-11-24 絶縁型半導体装置 Pending JPS5878657U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981174407U JPS5878657U (ja) 1981-11-24 1981-11-24 絶縁型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981174407U JPS5878657U (ja) 1981-11-24 1981-11-24 絶縁型半導体装置

Publications (1)

Publication Number Publication Date
JPS5878657U true JPS5878657U (ja) 1983-05-27

Family

ID=29966405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981174407U Pending JPS5878657U (ja) 1981-11-24 1981-11-24 絶縁型半導体装置

Country Status (1)

Country Link
JP (1) JPS5878657U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685665A (en) * 1979-12-13 1981-07-11 Osaka Gas Co Ltd Absorption type cooling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685665A (en) * 1979-12-13 1981-07-11 Osaka Gas Co Ltd Absorption type cooling device

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