JPS6042742U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6042742U
JPS6042742U JP1983134711U JP13471183U JPS6042742U JP S6042742 U JPS6042742 U JP S6042742U JP 1983134711 U JP1983134711 U JP 1983134711U JP 13471183 U JP13471183 U JP 13471183U JP S6042742 U JPS6042742 U JP S6042742U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
semiconductor element
semiconductor
abstract
embedding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983134711U
Other languages
English (en)
Inventor
藤根　信彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983134711U priority Critical patent/JPS6042742U/ja
Publication of JPS6042742U publication Critical patent/JPS6042742U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体束子搭載構造例の断伍図、第２図
は本考案で使用される複合材料ブロックの構造例を示す
。第３図は本考案になる半導体（素子搭載構造の一実施
例の断面図である。 １・・・・・・半導体素子、２・・・・・・銅ブロック
、３・・曲ソフトソルダー、４・・・・・・半導体装置
本体、５・・・・・・フレーム、６・・・・・・高熱伝
導体、７・・・・・・ハードツルｉ　　ダー、１０・・
・・・・複合材料ブロワ、り。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と熱膨張率の近い基板に高熱伝導綿体を埋め
    込んでなる放熱体に半導体素子を接着したことを特徴と
    する半導体装置。
JP1983134711U 1983-08-31 1983-08-31 半導体装置 Pending JPS6042742U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983134711U JPS6042742U (ja) 1983-08-31 1983-08-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983134711U JPS6042742U (ja) 1983-08-31 1983-08-31 半導体装置

Publications (1)

Publication Number Publication Date
JPS6042742U true JPS6042742U (ja) 1985-03-26

Family

ID=30303457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983134711U Pending JPS6042742U (ja) 1983-08-31 1983-08-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS6042742U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237429A (ja) * 2005-02-28 2006-09-07 Okutekku:Kk 半導体装置、電極用部材および電極用部材の製造方法
JP2010062310A (ja) * 2008-09-03 2010-03-18 Allied Material Corp ヒートスプレッダおよびその製造方法
JP2010268011A (ja) * 2010-09-01 2010-11-25 Okutekku:Kk 半導体装置、電極用部材および電極用部材の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237429A (ja) * 2005-02-28 2006-09-07 Okutekku:Kk 半導体装置、電極用部材および電極用部材の製造方法
JP2010062310A (ja) * 2008-09-03 2010-03-18 Allied Material Corp ヒートスプレッダおよびその製造方法
JP2010268011A (ja) * 2010-09-01 2010-11-25 Okutekku:Kk 半導体装置、電極用部材および電極用部材の製造方法

Similar Documents

Publication Publication Date Title
JPS58189593U (ja) 回路素子集合体
JPS59117164U (ja) 平形半導体冷却装置
JPS5822746U (ja) 半導体装置
JPS6090862U (ja) 半導体レ−ザ装置
JPS6037248U (ja) 混成集積回路
JPS5944052U (ja) 半導体装置
JPS5929048U (ja) 半導体部品の放熱器取付構造
JPS602848U (ja) 半導体装置
JPS6079752U (ja) 電力用半導体スタツク
JPS6130252U (ja) 半導体装置
JPS6096827U (ja) 熱伝導性半導体装置
JPS60101742U (ja) 半導体装置
JPS59192838U (ja) 半導体装置
JPS59121847U (ja) 半導体装置
JPS593550U (ja) 大電力半導体用ステム
JPS5811254U (ja) 集積回路装置用基板
JPS58168135U (ja) 半導体装置
JPS5961544U (ja) 発熱部品への放熱板の取付構造
JPS5929046U (ja) 半導体冷却装置
JPS60103860U (ja) 半導体レ−ザ装置
JPS6094836U (ja) 半導体装置
JPS5911451U (ja) 放熱器
JPS5895655U (ja) 半導体装置
JPS5877058U (ja) 半導体装置
JPS6018549U (ja) Ｉｃペレツト