JPS59105327A - 半導体素子の半田付け方法 - Google Patents

半導体素子の半田付け方法

Info

Publication number
JPS59105327A
JPS59105327A JP57215003A JP21500382A JPS59105327A JP S59105327 A JPS59105327 A JP S59105327A JP 57215003 A JP57215003 A JP 57215003A JP 21500382 A JP21500382 A JP 21500382A JP S59105327 A JPS59105327 A JP S59105327A
Authority
JP
Japan
Prior art keywords
solder
sheet
soldering
semiconductor
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57215003A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0223024B2 (2
Inventor
Eiji Jimi
自見　栄二
Kisaku Nakamura
中村　喜作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57215003A priority Critical patent/JPS59105327A/ja
Publication of JPS59105327A publication Critical patent/JPS59105327A/ja
Publication of JPH0223024B2 publication Critical patent/JPH0223024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP57215003A 1982-12-08 1982-12-08 半導体素子の半田付け方法 Granted JPS59105327A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57215003A JPS59105327A (ja) 1982-12-08 1982-12-08 半導体素子の半田付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57215003A JPS59105327A (ja) 1982-12-08 1982-12-08 半導体素子の半田付け方法

Publications (2)

Publication Number Publication Date
JPS59105327A true JPS59105327A (ja) 1984-06-18
JPH0223024B2 JPH0223024B2 (2) 1990-05-22

Family

ID=16665090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57215003A Granted JPS59105327A (ja) 1982-12-08 1982-12-08 半導体素子の半田付け方法

Country Status (1)

Country Link
JP (1) JPS59105327A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136331A (ja) * 1983-12-19 1985-07-19 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション ダイシング用フィルムから半導体チップの取外方法
JP2002219594A (ja) * 2001-01-19 2002-08-06 Japan Steel & Tube Constr Co Ltd 大気中接合方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124975A (2) * 1973-04-02 1974-11-29
JPS5617029A (en) * 1979-07-20 1981-02-18 Toshiba Corp Installation of semiconductor pellet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124975A (2) * 1973-04-02 1974-11-29
JPS5617029A (en) * 1979-07-20 1981-02-18 Toshiba Corp Installation of semiconductor pellet

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60136331A (ja) * 1983-12-19 1985-07-19 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション ダイシング用フィルムから半導体チップの取外方法
JP2002219594A (ja) * 2001-01-19 2002-08-06 Japan Steel & Tube Constr Co Ltd 大気中接合方法

Also Published As

Publication number Publication date
JPH0223024B2 (2) 1990-05-22

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