JPH0223024B2 - - Google Patents

Info

Publication number
JPH0223024B2
JPH0223024B2 JP57215003A JP21500382A JPH0223024B2 JP H0223024 B2 JPH0223024 B2 JP H0223024B2 JP 57215003 A JP57215003 A JP 57215003A JP 21500382 A JP21500382 A JP 21500382A JP H0223024 B2 JPH0223024 B2 JP H0223024B2
Authority
JP
Japan
Prior art keywords
solder
semiconductor
sheet
soldering
metal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57215003A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59105327A (ja
Inventor
Eiji Jimi
Kisaku Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57215003A priority Critical patent/JPS59105327A/ja
Publication of JPS59105327A publication Critical patent/JPS59105327A/ja
Publication of JPH0223024B2 publication Critical patent/JPH0223024B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP57215003A 1982-12-08 1982-12-08 半導体素子の半田付け方法 Granted JPS59105327A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57215003A JPS59105327A (ja) 1982-12-08 1982-12-08 半導体素子の半田付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57215003A JPS59105327A (ja) 1982-12-08 1982-12-08 半導体素子の半田付け方法

Publications (2)

Publication Number Publication Date
JPS59105327A JPS59105327A (ja) 1984-06-18
JPH0223024B2 true JPH0223024B2 (2) 1990-05-22

Family

ID=16665090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57215003A Granted JPS59105327A (ja) 1982-12-08 1982-12-08 半導体素子の半田付け方法

Country Status (1)

Country Link
JP (1) JPS59105327A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664739A (en) * 1983-12-19 1987-05-12 Stauffer Chemical Company Removal of semiconductor wafers from dicing film
JP2002219594A (ja) * 2001-01-19 2002-08-06 Japan Steel & Tube Constr Co Ltd 大気中接合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49124975A (2) * 1973-04-02 1974-11-29
JPS5617029A (en) * 1979-07-20 1981-02-18 Toshiba Corp Installation of semiconductor pellet

Also Published As

Publication number Publication date
JPS59105327A (ja) 1984-06-18

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