JPS59117160U - 絶縁物封止半導体装置 - Google Patents

絶縁物封止半導体装置

Info

Publication number
JPS59117160U
JPS59117160U JP1983010663U JP1066383U JPS59117160U JP S59117160 U JPS59117160 U JP S59117160U JP 1983010663 U JP1983010663 U JP 1983010663U JP 1066383 U JP1066383 U JP 1066383U JP S59117160 U JPS59117160 U JP S59117160U
Authority
JP
Japan
Prior art keywords
heat sink
insulator
sealed
semiconductor element
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983010663U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322677Y2 (mo
Inventor
都外川　峯秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1983010663U priority Critical patent/JPS59117160U/ja
Publication of JPS59117160U publication Critical patent/JPS59117160U/ja
Application granted granted Critical
Publication of JPS6322677Y2 publication Critical patent/JPS6322677Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983010663U 1983-01-28 1983-01-28 絶縁物封止半導体装置 Granted JPS59117160U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983010663U JPS59117160U (ja) 1983-01-28 1983-01-28 絶縁物封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983010663U JPS59117160U (ja) 1983-01-28 1983-01-28 絶縁物封止半導体装置

Publications (2)

Publication Number Publication Date
JPS59117160U true JPS59117160U (ja) 1984-08-07
JPS6322677Y2 JPS6322677Y2 (mo) 1988-06-22

Family

ID=30142101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983010663U Granted JPS59117160U (ja) 1983-01-28 1983-01-28 絶縁物封止半導体装置

Country Status (1)

Country Link
JP (1) JPS59117160U (mo)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023021938A1 (ja) * 2021-08-18 2023-02-23 ローム株式会社 半導体装置
WO2024095788A1 (ja) * 2022-11-04 2024-05-10 ローム株式会社 半導体装置
JP2025505247A (ja) * 2022-02-11 2025-02-21 ウルフスピード インコーポレイテッド クリープ延伸構造体を有する半導体パッケージ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023021938A1 (ja) * 2021-08-18 2023-02-23 ローム株式会社 半導体装置
JP2025505247A (ja) * 2022-02-11 2025-02-21 ウルフスピード インコーポレイテッド クリープ延伸構造体を有する半導体パッケージ
WO2024095788A1 (ja) * 2022-11-04 2024-05-10 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
JPS6322677Y2 (mo) 1988-06-22

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