JPS6322677Y2 - - Google Patents

Info

Publication number
JPS6322677Y2
JPS6322677Y2 JP1983010663U JP1066383U JPS6322677Y2 JP S6322677 Y2 JPS6322677 Y2 JP S6322677Y2 JP 1983010663 U JP1983010663 U JP 1983010663U JP 1066383 U JP1066383 U JP 1066383U JP S6322677 Y2 JPS6322677 Y2 JP S6322677Y2
Authority
JP
Japan
Prior art keywords
heat sink
external
resin body
insulator
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983010663U
Other languages
English (en)
Japanese (ja)
Other versions
JPS59117160U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983010663U priority Critical patent/JPS59117160U/ja
Publication of JPS59117160U publication Critical patent/JPS59117160U/ja
Application granted granted Critical
Publication of JPS6322677Y2 publication Critical patent/JPS6322677Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1983010663U 1983-01-28 1983-01-28 絶縁物封止半導体装置 Granted JPS59117160U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983010663U JPS59117160U (ja) 1983-01-28 1983-01-28 絶縁物封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983010663U JPS59117160U (ja) 1983-01-28 1983-01-28 絶縁物封止半導体装置

Publications (2)

Publication Number Publication Date
JPS59117160U JPS59117160U (ja) 1984-08-07
JPS6322677Y2 true JPS6322677Y2 (mo) 1988-06-22

Family

ID=30142101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983010663U Granted JPS59117160U (ja) 1983-01-28 1983-01-28 絶縁物封止半導体装置

Country Status (1)

Country Link
JP (1) JPS59117160U (mo)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023021938A1 (mo) * 2021-08-18 2023-02-23
US12224218B2 (en) * 2022-02-11 2025-02-11 Wolfspeed, Inc. Semiconductor packages with increased power handling
CN120153478A (zh) * 2022-11-04 2025-06-13 罗姆股份有限公司 半导体装置

Also Published As

Publication number Publication date
JPS59117160U (ja) 1984-08-07

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