JPS5840843U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS5840843U
JPS5840843U JP1981135012U JP13501281U JPS5840843U JP S5840843 U JPS5840843 U JP S5840843U JP 1981135012 U JP1981135012 U JP 1981135012U JP 13501281 U JP13501281 U JP 13501281U JP S5840843 U JPS5840843 U JP S5840843U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
encapsulated semiconductor
semiconductor element
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981135012U
Other languages
English (en)
Inventor
谷浦　隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981135012U priority Critical patent/JPS5840843U/ja
Publication of JPS5840843U publication Critical patent/JPS5840843U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す樹脂封止型半導体集積
回路装置の平面図を示す。 １・・・・・・外部引出しリード、２・・・・・・半導
体素子搭載部（グイ装着部）、３・・・・・・半導体素
子、４・・・・・・封止樹脂、５・・・・・・半導体素
子の内部回路部、６・・・・・・半導体素子の電極、７
・・・・・・半導体素子の電極の周囲に構成した金属配
線部、８・・・・・・半導体素子の内部回路の周囲に構
成した金属配線部、９・・・・・・ボンディング線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止型半導体装置において、半導体素子が形成され
    た領域とボンディング線接続用パッドとの間に前記領域
    を取り囲こむ様に金属層を設けたことを神徴とする樹脂
    封止型半導体装置。
JP1981135012U 1981-09-11 1981-09-11 樹脂封止型半導体装置 Pending JPS5840843U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981135012U JPS5840843U (ja) 1981-09-11 1981-09-11 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981135012U JPS5840843U (ja) 1981-09-11 1981-09-11 樹脂封止型半導体装置

Publications (1)

Publication Number Publication Date
JPS5840843U true JPS5840843U (ja) 1983-03-17

Family

ID=29928406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981135012U Pending JPS5840843U (ja) 1981-09-11 1981-09-11 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS5840843U (ja)

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