JPS59134834A - 半導体ウエハの洗浄装置 - Google Patents

半導体ウエハの洗浄装置

Info

Publication number
JPS59134834A
JPS59134834A JP58008962A JP896283A JPS59134834A JP S59134834 A JPS59134834 A JP S59134834A JP 58008962 A JP58008962 A JP 58008962A JP 896283 A JP896283 A JP 896283A JP S59134834 A JPS59134834 A JP S59134834A
Authority
JP
Japan
Prior art keywords
receiver
cleaning
carrier
tool
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58008962A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0458179B2 (2
Inventor
Takeshi Sakashita
健 坂下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58008962A priority Critical patent/JPS59134834A/ja
Publication of JPS59134834A publication Critical patent/JPS59134834A/ja
Publication of JPH0458179B2 publication Critical patent/JPH0458179B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP58008962A 1983-01-21 1983-01-21 半導体ウエハの洗浄装置 Granted JPS59134834A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58008962A JPS59134834A (ja) 1983-01-21 1983-01-21 半導体ウエハの洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58008962A JPS59134834A (ja) 1983-01-21 1983-01-21 半導体ウエハの洗浄装置

Publications (2)

Publication Number Publication Date
JPS59134834A true JPS59134834A (ja) 1984-08-02
JPH0458179B2 JPH0458179B2 (2) 1992-09-16

Family

ID=11707292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58008962A Granted JPS59134834A (ja) 1983-01-21 1983-01-21 半導体ウエハの洗浄装置

Country Status (1)

Country Link
JP (1) JPS59134834A (2)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61171244U (2) * 1985-04-12 1986-10-24
JPS62232930A (ja) * 1986-04-02 1987-10-13 Nec Corp 半導体ウエ−ハの浸漬方法
JPH0492632U (2) * 1990-12-28 1992-08-12
JPH05200689A (ja) * 1991-08-30 1993-08-10 Dainippon Screen Mfg Co Ltd ウエハ保持装置およびその保持方法
EP0658923A1 (en) * 1993-12-14 1995-06-21 Shin-Etsu Handotai Company Limited Wafer cleaning tank
US5799678A (en) * 1995-12-19 1998-09-01 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159871A (en) * 1978-06-08 1979-12-18 Mitsubishi Electric Corp Small piece washing method
JPS5594044U (2) * 1978-12-23 1980-06-30
JPS5643718A (en) * 1979-09-17 1981-04-22 Mitsubishi Electric Corp Semiconductor wafer shifting device
JPS56126930A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Washing tank
JPS57128142U (2) * 1981-02-02 1982-08-10

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54159871A (en) * 1978-06-08 1979-12-18 Mitsubishi Electric Corp Small piece washing method
JPS5594044U (2) * 1978-12-23 1980-06-30
JPS5643718A (en) * 1979-09-17 1981-04-22 Mitsubishi Electric Corp Semiconductor wafer shifting device
JPS56126930A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Washing tank
JPS57128142U (2) * 1981-02-02 1982-08-10

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61171244U (2) * 1985-04-12 1986-10-24
JPS62232930A (ja) * 1986-04-02 1987-10-13 Nec Corp 半導体ウエ−ハの浸漬方法
JPH0492632U (2) * 1990-12-28 1992-08-12
JPH05200689A (ja) * 1991-08-30 1993-08-10 Dainippon Screen Mfg Co Ltd ウエハ保持装置およびその保持方法
EP0658923A1 (en) * 1993-12-14 1995-06-21 Shin-Etsu Handotai Company Limited Wafer cleaning tank
US5503173A (en) * 1993-12-14 1996-04-02 Shin-Etsu Handotai Co., Ltd. Wafer cleaning tank
US5799678A (en) * 1995-12-19 1998-09-01 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer

Also Published As

Publication number Publication date
JPH0458179B2 (2) 1992-09-16

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