JPS59207635A - Resin sealing device for semiconductor - Google Patents

Abstract

PURPOSE:To make the device compact and to enhance accuracy and quality, by using molds for a small number of patterns, and providing the respective molds for a plurality of press mechanism parts. CONSTITUTION:In the main body of a device, which performs the resin sealing of a semiconductor, transfer mold press mechanism parts P1 and P2 constituted by clamping cylinders 1, projecting cylinders 2, platens 3, and the like are provided. Individually separated special molds 4 and 4 are set to the platens 3 and 3 of the mechanism parts P1 and P2. At this time the size of the mold 4 is determined so that one or two sheets of lead frames can be molded. In each of the mechanism parts P1 and P2, the set mold 4 is clamped, compressed, and held by the cylinder 1. A resin is injected into the mold 4 by the cylinder 2. The semiconductor element of the lead frame is sealed with the resin by each mold 4. Thus a few number of patterns are obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for resin-sealing a semiconductor element.

Conventionally, this type of resin encapsulation equipment molds a semiconductor element insulated from the outside air, and includes a molding die that gives the external shape of the semiconductor device, and a molding die that is clamped and held under pressure.
It consists of a transfer mold press mechanism section that injects resin into the mold. As a recent trend, these two mechanical parts are becoming larger in order to increase the number of operations per shot.

With this increase in size, various problems described below have arisen. That is, in the case of a mold, it is required to ensure higher mold processing accuracy than before, and to select and process high-quality mold materials, resulting in high costs. Furthermore, resin sealing conditions vary depending on the position within the mold, leading to molding defects such as filling defects, voids, and thin flashes, resulting in variations in quality.

Furthermore, the increased weight makes handling difficult and makes it difficult to ensure safety.

On the other hand, with the increase in the size of the mold in transfer mold presses, it is necessary to increase the size of the mounting portion (platen) of the mold and increase the mold clamping pressure. Furthermore, due to the expansion of the platen area, it is necessary to install multiple mold clamping cylinders in order to uniformly distribute mold clamping pressure and prevent mold burrs, which causes the same problems as with molds. There were drawbacks.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin sealing device for semiconductor elements that is small and lightweight and has less variation in quality. That is, the resin encapsulation apparatus for semiconductor devices of the present invention is equipped with a plurality of transfer mold press mechanisms, each of which is equipped with a relatively small number of units, such as one or two lead frames for semiconductor devices. This is characterized by the fact that the molds are individually separated.

Next, one embodiment of the present invention will be described using the drawings.

FIG. 1 shows an embodiment of a resin sealing device for a semiconductor element according to the present invention. In FIG. 1, a mold clamping cylinder 1 is attached to a main body M of an apparatus for resin-sealing semiconductor elements.
, an injection cylinder 2, a platen 3, etc., and a transfer mold press mechanism section p1. Equipped with two units of p2, each mechanism part p1. Separate dedicated molds 4, 4 are set on the platens 3, 3 of p2, respectively. The dedicated molding die 4 is of a size capable of molding one or two lead frames for semiconductor devices, as shown in FIGS. 2 and 3.

A workpiece supply section 5 still stocks lead frames for semiconductor devices before being resin-sealed around the mechanism section and places them in the alignment section, and loads the workpieces from the alignment section into the mold section and places the resin-sealed workpieces into the mold. Work loader 6 that takes out the work from the section to the discharge section
, a tablet loader that loads resin tablets into molds.
7. A workpiece storage section 8 is installed to remove unnecessary resin from the workpieces discharged from the mold section and take out and store only the workpieces, and a cleaning unit 9 is installed to periodically clean the mold surface.

Each press mechanism part p1. In p, the dedicated mold 4 installed is clamped and pressurized by the mold clamping cylinder 1, resin is injected into the mold 4 by the injection cylinder 2, and each mold 4 is used as shown in Figs. 2 and 3. As shown in the figure, a semiconductor element 10 of a lead frame 11 for a semiconductor device is sealed with resin 12, and a small number of molds are made.

As explained above, the present invention has a plurality of press mechanisms installed in the main body of the apparatus, and each mechanism has its own separate dedicated mold die, so that the mold die can be replaced with a conventional multi-piece mold. (larger size) to fewer pieces (smaller size),
For example, by using one or two molds, the entire device can be made smaller and lighter, handling is easier and safer, and mold processing accuracy can be easily ensured. It is possible to reduce manufacturing costs by almost eliminating differences in sealing conditions and minimizing the occurrence of thin flakes due to variations in board thickness between lead frames for semiconductor devices, while producing high-precision, high-quality equipment and equipment. This has the effect that semiconductor devices can be manufactured. In addition, the decrease in productivity due to downsizing of molds (fewer molds) can be solved by using multiple molds and presses, and by effectively linking peripheral automation equipment groups.

It goes without saying that the present invention is not limited to the above-described embodiments, and can be implemented by increasing the number of transfer mold press mechanisms and molds, or by changing the arrangement of these and other automated equipment groups. do not have.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a resin-sealing device for a semiconductor element according to an embodiment of the present invention, FIG. 2 is a perspective view of the internal structure of a resin-sealed semiconductor device, and FIG. 3 is a perspective view of a resin-sealed semiconductor device. FIG. 1... mold clamping cylinder, 2... injection cylinder,
3...Platen, 4...Mold die, 5...Work supply section, 6...Work loader-17...Tablet loader-18...Work storage section, 9...Cleaning unit , 10... Semiconductor element, 11... Lead frame for semiconductor device, 12... Resin patent applicant Kyushu NEC Co., Ltd.

Claims (1)

[Claims] (1) A semiconductor device consisting of a mold that molds a semiconductor device while shielding it from outside air, and a transfer mold press mechanism that clamps and pressurizes the mold and injects resin into the core mold. A resin sealing device for a semiconductor device, characterized in that a plurality of the transfer mold press mechanisms are installed in the device body, and each mechanism has its own separate dedicated mold die. Stop device.