JPS5938008A - Mold-release method of molding foundation of flowerpot, etc. - Google Patents
Mold-release method of molding foundation of flowerpot, etc.Info
- Publication number
- JPS5938008A JPS5938008A JP14861582A JP14861582A JPS5938008A JP S5938008 A JPS5938008 A JP S5938008A JP 14861582 A JP14861582 A JP 14861582A JP 14861582 A JP14861582 A JP 14861582A JP S5938008 A JPS5938008 A JP S5938008A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- upper mold
- molding
- molded
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 6
- 239000000463 material Substances 0.000 claims description 17
- 239000012212 insulator Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 2
- 210000003323 beak Anatomy 0.000 claims 1
- 239000006082 mold release agent Substances 0.000 description 12
- 239000004927 clay Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds, Cores, Or Mandrels (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は湿式画業原料にて成型されゐ植木鉢、鬼瓦等の
深物、凹凸の多い物を離型剤を使用することなく離型せ
しめる様にした植木６本等の成型素地の離型方法に関す
るものでおる。[Detailed Description of the Invention] The present invention is made of six plants, etc. that are molded using wet painting materials and are capable of releasing deep objects such as flowerpots and onigawara roof tiles, and objects with many uneven surfaces without using a mold release agent. This article relates to a method for releasing molded substrates.
従来深物、や凹凸の多い窯業製品は特に型離れ戸惑いた
め成型金型の表面に離型剤を塗布せしめている・が、か
かる製品では成型時の粘土の動きが大であるため塗布さ
れた離型剤を巻き込んで乾燥後皺や切れを生ぜしめ、又
粘土の動きに伴って離型剤の塗布層が剥離して離型効果
を期待出来なくなる等の欠点を有していた。Conventionally, deep or uneven ceramic products are particularly difficult to release from the mold, so a mold release agent is applied to the surface of the mold. The mold release agent was involved, causing wrinkles and cuts after drying, and the mold release agent coating layer peeled off as the clay moved, making it impossible to expect a mold release effect.
例えば笹１図に図示する植木鉢の成型においては粘土が
最後に集まる口縁部において離型剤の巻き込みを生じて
皺、切れが多く発生すると共に周壁面では粘土の伸びに
伴りて離型剤が剥離して粘土が直接金型に張り付いて離
型困難となる。For example, when molding the flower pot shown in Figure 1, the mold release agent gets caught up at the edge where the clay gathers at the end, resulting in many wrinkles and cuts. The clay will peel off and stick directly to the mold, making it difficult to release it.
又第２−乃至第４図に図示する雪止め輸型瓦の成型に幹
いては第８図に示す輸型部への粘土の充填時に離型剤の
巻き込みを生じて輪型部の周辺に切れが発生する。Furthermore, during the molding of the snow protection tiles shown in Figures 2 to 4, when clay is filled into the mold part shown in Figure 8, the mold release agent gets caught up around the ring part. A cut occurs.
又第５図、第６図に図示する鬼瓦の成型においては凹凸
の多い部分、深く成型した部分に離型剤の巻き込みによ
る切れを生じると共に裏板を張り付ける部分は離型剤を
含んでいると裏板が充分張り付かず切れを生じる。更に
第７図に図示する万十唐草瓦、第８図、第９図に図示す
る袖瓦の成型においても同様に粘土の動きの大なる部分
に離型剤の巻き込み、剥離を生じ、皺、切れ等が発生す
る。Furthermore, in the molding of the Onigawara tiles shown in Figures 5 and 6, the parts with many irregularities and deeply molded parts are cut due to the involvement of the mold release agent, and the part where the backing plate is pasted contains the mold release agent. If the back plate does not stick properly, it will break. Furthermore, in the molding of the Manju Arabesque tiles shown in Figure 7 and the sleeve tiles shown in Figures 8 and 9, the release agent is similarly involved in a large part of the movement of the clay, causing peeling, wrinkles, Cuts, etc. occur.
以上の様に成型時の離型剤の使用は離型な容易ならしめ
るため不可欠であったが深物等の成型においては却って
種々のトラブルの原因となるため、離型剤を必要としな
い離型方法の開発が望まれていた。As mentioned above, the use of a mold release agent during molding is indispensable to make mold release easy, but when molding deep objects, etc., it can actually cause various troubles, so a release agent that does not require a mold release agent is essential. The development of a mold method was desired.
本発明はかかる欠点に鑑み、上型、下型、受型相互間に
直流電流を作用せしめて電気浸透作用によシ負電極側に
成型素地中の水分を集めると共に電気離型のされない部
分には圧搾空気を供給せしめて離型剤を使用することな
く成型素地の離型を行わしめる様にして上記欠点を解消
せんとしたものにして、
以下本発明の一実施例を図面に基づいて説明すると、
第１０図は植木鉢の成型状態を示し、（１）はプレス成
型機のプレスラム（２）に取付けた上型、（８）はベッ
ド（４）に増付けた下型でおり、下型（３）に対する上
型（１）の接合部（６）から成型素地（Ｗ）の口縁成型
部（６）に渉って石膏等の通気性を有する絶縁物（））
を介入せしめて上型（１）と下型１８）を絶縁分離せし
め、絶縁物（７）には圧搾空気を供給せしめる空気供給
口（８）を連通せしめている。尚絶縁物（））は口縁成
型部（６）において圧搾空気による強制離型を要しない
場合はベークライト等にて形成して亀よい。In view of these drawbacks, the present invention applies a direct current between the upper mold, the lower mold, and the receiving mold to collect moisture in the molded material on the negative electrode side by electroosmotic action, and at the same time to collect the moisture in the molded material in the areas that are not electrolytically released. attempts to solve the above drawbacks by supplying compressed air and releasing the molded material without using a mold release agent.One embodiment of the present invention will be described below with reference to the drawings. Then, Fig. 10 shows the molding state of the flower pot, where (1) is the upper mold attached to the press ram (2) of the press molding machine, and (8) is the lower mold added to the bed (4). (3) An air permeable insulator such as plaster () extending from the joint (6) of the upper mold (1) to the edge molding part (6) of the molding base (W)
The upper die (1) and the lower die 18) are insulated and separated by interposition, and the insulator (7) is communicated with an air supply port (8) through which compressed air is supplied. The insulator ( ) may be formed of Bakelite or the like if forced mold release using compressed air is not required in the lip molding part (6).
（９）は上型（１）と下型（８）の接合部（５）に形成
せしめた余剰粘土の溜り部、（１（＋１はＯリングであ
る。(9) is a pool of excess clay formed at the joint (5) of the upper mold (1) and lower mold (8), (1 (+1 is an O-ring).
（ロ）は第１直流電源部であり、その正電極を上型（１
）Ｋ接続せしめると共に負電極を下型（８）に接続せし
め、又別途第２流電源部（１ｍを設けてその正電極を成
型素地へ■を受承する受型（旧に接続せしめると共に負
電極を上型（１）に接続せしめている〇
次に作用について説明すると、上型（１）を下降せしめ
て下型（８）との間で成型素地へ■を圧縮成型せしめる
と、第１直流Ｗ、源部口りによυ上型（１）と下型（８
）との間に成型素地■を介して電流が流れ、電気浸透作
用によυ負￥Ｌ極側である下型（８）の表面に成型素地
（□□□中の水分が集まるため下型（’８１と成型素地
糊との間で離型容易な状態となる。(b) is the first DC power supply section, whose positive electrode is connected to the upper mold (1
) K connection and connect the negative electrode to the lower mold (8), and also provide a separate second current power source section (1 m) and connect the positive electrode to the molding base (2) and connect the negative electrode to the lower mold (8). The electrode is connected to the upper mold (1) 〇Next, to explain the operation, when the upper mold (1) is lowered and compression molded into the molding base between it and the lower mold (8), the first Direct current W, υ upper mold (1) and lower mold (8
) through the molding base ■, and due to electroosmotic action, water in the molding base (□□□ collects on the surface of the lower mold (8) on the υ negative ￥ L pole side, so the lower mold (The mold becomes easy to release between '81 and the molding base glue.
そして上型（１）を上昇せしめて成型素地（劫を下型（
８）よシ離型せしめ、しかる後上型（１）を取出し位置
で待機している受型０３）に嵌入せしめると、第２直流
電源部（功により上型（１）と受型０飴との間に成型素
地醐を介して電流が流れ、今度は上型（１）側が負電極
となるため成型素地尚中の水分は上型（１）の表面に集
まって離型容易外状態とな９、又絶縁物（７）の介在に
より電気的に離型されない口縁部では空気供給口〈８）
より圧入された圧搾空気が絶縁物（テ）を通して口縁成
型部（６）から噴出するため容易に離型出来る状態とな
り、しかる後上型（１）を上昇せしめることにより成型
票地糊を受型０Ｂ）上に取出すのである。Then, raise the upper mold (1) and lower the molding base (kalpa) to the lower mold (
8) After releasing the mold, insert the upper mold (1) into the receiving mold 03) waiting at the take-out position. A current flows through the molded material between the molded material and the upper mold (1) side becomes the negative electrode, so the moisture in the molded material gathers on the surface of the upper molded material and becomes easy to release. 9, and an air supply port <8) at the edge where the mold is not electrically released due to the presence of the insulator (7).
The compressed air that has been injected further passes through the insulator (TE) and blows out from the rim molding part (6), making it easy to release the mold.Then, by raising the upper mold (1), the molded label paste is received. It is taken out onto mold 0B).
又第１８図は袖瓦の電気離型に供する成型金型を示し、
上型ａ−の上面部及び側面部に絶縁物（１５） ０５）
’・・・を取付けて下型０６）と絶縁分離せしめている
０尚上型（ロ）の側面部における下！ｌν（１６）との
摺接部は絶縁物α７）を介して金属製の面板０８ノにて
構成し□てもよい。そして成型時には前記植木鉢の例と
同様に第１直流電源部品の正電極を下型θ６）に接続せ
しめると共に負↑Ｉ極を・上型（１４）に接続せしめれ
ば同様に電気離型を行わしめることが出来るのである。Also, Figure 18 shows a molding die used for electrical release of sleeve tiles.
Insulators (15) 05) on the top and side surfaces of upper mold a-
``Bottom side of the upper mold (b) that is insulated and isolated from the lower mold 06) by attaching...'...! The sliding contact portion with lν (16) may be formed of a metal face plate 08 via an insulator α7). Then, during molding, the positive electrode of the first DC power supply component is connected to the lower mold θ6), and the negative ↑ I pole is connected to the upper mold (14) in the same way as in the example of the flowerpot, and electrical mold release is performed in the same way. It is possible to tighten it.
□要するに本発明は、植木鉢等の成型用の上型（１）に
第１直流電源部（６）の正電極を接続せしめると共に下
型（８）に負電極番接続せしめて上型（１）と置型（８
）とめ間で成型素地（４）を成型し、上型（１）を上昇
せしめて下型（３）から成型素地（４）を離型せしめた
後第２直流電源部（撮の正ｘｉを受型Ｃ１３）に接め、
且つ成型素地醐の口縁部に対応する上型（１）の口縁成
型部（６）に介入せしめた通気性を有する絶縁物（７）
を通して圧搾空気を噴出せしめ、しかる後上型（１）を
上昇せしめて成型素地■を受型（国内に取出す様にした
ので、成型抜上型（１）の上昇時には上型（１）と下型
（８）との間における電気浸透作用により負電極側の下
型（８）の表面に成型素地−中の水分が集まって下型１
８１からの離型を容易ならしめることが出来、又受型ａ
Ｓ＞への取出時には上型（１）と受型（崩との間におけ
る電気浸透作用により今度は負電極側の受型Ｏｍの表面
に水分が集まって離型状態となり、而も通気性を有する
絶縁物（７）を通して電気離型のされない成型素地（４
）の口縁部に圧搾空気が供給されるため受型（ＩＢ）へ
の成型素地■の取出しを円滑に行わしめることが出来、
よって上型（１）、下型（３）の表面に離型剤を塗布せ
しめる必要がないためコストダウン及び品質の向上を図
らしめることが出来ると共に作業環境の改善にも貢献出
来る等その実用的効果甚だ大なるものである＠□In short, the present invention connects the positive electrode of the first DC power source (6) to the upper mold (1) for molding flower pots, etc., and connects the negative electrode number to the lower mold (8) to form the upper mold (1). and stationary type (8
) The molding base material (4) is molded between the joints, and the upper mold (1) is raised to release the molding material (4) from the lower mold (3). Contact mold C13),
In addition, an insulator (7) having air permeability is inserted into the rim molding part (6) of the upper mold (1) corresponding to the rim of the molded base material.
After that, the upper mold (1) was raised to receive the molding material (to be taken out into Japan), so when the upper mold (1) was raised, the upper mold (1) and the lower mold were raised. Moisture in the molding base gathers on the surface of the lower mold (8) on the negative electrode side due to electroosmotic action between the mold (8) and the lower mold 1.
81 can be easily released from the mold, and the receiving mold a
When taken out to S>, moisture collects on the surface of the receiving mold Om on the negative electrode side due to the electroosmotic action between the upper mold (1) and the receiving mold (receiving mold), resulting in a release state, which also improves air permeability. The molded base material (4) which is not subjected to electrical release through the insulator (7)
) Since compressed air is supplied to the edge of the mold, the molded material ■ can be smoothly removed from the mold (IB).
Therefore, there is no need to apply a mold release agent to the surfaces of the upper mold (1) and lower mold (3), which makes it possible to reduce costs and improve quality, as well as contribute to improving the working environment. The effect is huge @
図は本発明の一実施例を示すものにして、第１図乃至第
９図は従来の離型方法による不良品の例を示す図、第１
０図乃至第１２図は本発明に係る植木鉢等の成型素地の
離型方法を示す図、第１８図は袖瓦の成型用の上型及び
下型を示す図である。 （リ Ｊ：ｙ （３）
ト“シ１コー以 上
曝、５＠Ｉ 第６図
−・
ｍ９ｖ。The figure shows one embodiment of the present invention, and Figures 1 to 9 are diagrams showing examples of defective products produced by the conventional mold release method.
0 to 12 are diagrams showing a method of releasing a molded base material for a flower pot or the like according to the present invention, and FIG. 18 is a diagram showing an upper mold and a lower mold for molding a sleeve tile. (Re J:y (3)
Exposure to more than 1 kore, 5@I Figure 6 - m9v.
Claims (1)
続せしめると共に下型に負１極を接続せ４しめて上型と
下型との間で横肴嘴鴫傘成型素地を成型し、上型を上昇
せしめて下１型から成型素地を離型せしめた後４ｉｉ１
２直流電一部、の正電極を受型に接続せしめると共に負
電極、を上型に接続せしめて成型素地を上型と共に受型
内に嵌゛入せしめ、且つ成型素地の口縁部に対応する上
型の口縁成型部に介入せしめた通気性を有する絶縁物を
通して圧搾空気を噴出せしめ、しかる後上型を上昇せし
めて成型素地を受型内に取出す様にしたことを特徴とす
る植木鉢等の成型素地の離型方法。Connect the positive electrode of the first DC power supply section to the upper mold for molding a flower pot, etc., connect the negative electrode to the lower mold, and then form the base for molding a horizontal beak umbrella between the upper mold and the lower mold. After raising the upper mold and releasing the molded material from the lower mold 1, 4ii1
2. Connect the positive electrode of the direct current part to the mold, and connect the negative electrode to the upper mold, and fit the molded material into the mold together with the upper mold, and correspond to the mouth edge of the molded material. A flowerpot, etc., characterized in that compressed air is blown out through a breathable insulator interposed in the mouth rim molding part of the upper mold, and then the upper mold is raised to take out the molded material into the receiving mold. A method for releasing molded substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14861582A JPS5938008A (en) | 1982-08-26 | 1982-08-26 | Mold-release method of molding foundation of flowerpot, etc. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14861582A JPS5938008A (en) | 1982-08-26 | 1982-08-26 | Mold-release method of molding foundation of flowerpot, etc. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5938008A true JPS5938008A (en) | 1984-03-01 |
| JPS6128491B2 JPS6128491B2 (en) | 1986-06-30 |
Family
ID=15456740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14861582A Granted JPS5938008A (en) | 1982-08-26 | 1982-08-26 | Mold-release method of molding foundation of flowerpot, etc. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5938008A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212208A (en) * | 1975-07-21 | 1977-01-29 | Ikuyo Tetsukoujiyo Goushi | Molding of ceramic vessels |
| JPS5257217A (en) * | 1975-11-05 | 1977-05-11 | Noboru Nagase | Method of relaeasing ceramic products |
| JPS52108254U (en) * | 1976-02-12 | 1977-08-17 | ||
| JPS5312927A (en) * | 1976-07-19 | 1978-02-06 | Little Inc A | Production method of filled inorganic resin cement |
| JPS5345201A (en) * | 1976-10-05 | 1978-04-22 | Nippon Hoso Kyokai <Nhk> | Program sound model signal generator |
| JPS5416518A (en) * | 1977-07-08 | 1979-02-07 | Nippon Koushitsu Touki Kk | Method for rapidly molding and demolding green ceramic materials |
-
1982
- 1982-08-26 JP JP14861582A patent/JPS5938008A/en active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5212208A (en) * | 1975-07-21 | 1977-01-29 | Ikuyo Tetsukoujiyo Goushi | Molding of ceramic vessels |
| JPS5257217A (en) * | 1975-11-05 | 1977-05-11 | Noboru Nagase | Method of relaeasing ceramic products |
| JPS52108254U (en) * | 1976-02-12 | 1977-08-17 | ||
| JPS5312927A (en) * | 1976-07-19 | 1978-02-06 | Little Inc A | Production method of filled inorganic resin cement |
| JPS5345201A (en) * | 1976-10-05 | 1978-04-22 | Nippon Hoso Kyokai <Nhk> | Program sound model signal generator |
| JPS5416518A (en) * | 1977-07-08 | 1979-02-07 | Nippon Koushitsu Touki Kk | Method for rapidly molding and demolding green ceramic materials |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6128491B2 (en) | 1986-06-30 |
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