JPS595493Y2 - soldering iron - Google Patents
soldering ironInfo
- Publication number
- JPS595493Y2 JPS595493Y2 JP15750580U JP15750580U JPS595493Y2 JP S595493 Y2 JPS595493 Y2 JP S595493Y2 JP 15750580 U JP15750580 U JP 15750580U JP 15750580 U JP15750580 U JP 15750580U JP S595493 Y2 JPS595493 Y2 JP S595493Y2
- Authority
- JP
- Japan
- Prior art keywords
- iron
- tip
- solder
- soldering
- soldering iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims description 54
- 229910052742 iron Inorganic materials 0.000 title claims description 27
- 238000005476 soldering Methods 0.000 title claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 description 5
- 230000002411 adverse Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】 本考案は半田ごてに関するものである。[Detailed explanation of the idea] The present invention relates to a soldering iron.
従来プリント基板へ各種素子のリード端子を半田付けす
る際、たとえば糸半田内に収容されているフラックス(
ペースト)が高温化している半田ごてにより周囲に飛散
し、このためフラックスが周囲のプリント接点に耐着す
るので接点部に悪影響をおよぼしたり、またフラックス
の飛散は不必要なプリント面にまで半田盛りされてプリ
ント配線が短絡したりすることがあった。Conventionally, when soldering the lead terminals of various elements to a printed circuit board, for example, flux (
paste) is scattered around by the hot soldering iron, and as a result, the flux adheres to the surrounding printed contacts, adversely affecting the contacts, and the flux scattering also spreads the solder onto unnecessary printed surfaces. There were cases where the printed wiring could become short-circuited.
本考案の目的は、半田付けの際のフラックスの飛散を防
止して上記接点部への悪影響やプリント配線などの短絡
のない半田付は作業性のよい半田ごてを提供することに
ある。An object of the present invention is to provide a soldering iron that prevents scattering of flux during soldering and has good soldering workability without adversely affecting the contact portions or shorting printed wiring.
以下本考案の実施例を図面に基づいて説明する。Embodiments of the present invention will be described below based on the drawings.
第1,2図において、1は把持部2を有する半田ごて本
体で、この本体1の先端部に先細状のこて真3を挿着し
である。In FIGS. 1 and 2, reference numeral 1 denotes a soldering iron body having a grip portion 2, and a tapered iron stem 3 is inserted into the tip of this body 1.
こて真3に接続している導電線4は本体の中空部5を挿
通して外部へ引出されている。A conductive wire 4 connected to the iron stem 3 is inserted through a hollow portion 5 of the main body and drawn out to the outside.
本体1の先端部には第2,3図に示すようにこて真3を
包囲するようにして、たとえば強化ガラスなどで構成し
た高い耐熱性を有する筒体6を装着′している。As shown in FIGS. 2 and 3, a cylindrical body 6 having high heat resistance and made of, for example, tempered glass is attached to the tip of the main body 1 so as to surround the iron stem 3.
すなわち筒体6の上端内周面にソケット7を挿着してあ
り、このソケットの軸心部には貫通孔7aをあけである
。That is, a socket 7 is inserted into the inner peripheral surface of the upper end of the cylindrical body 6, and a through hole 7a is formed in the axial center of the socket.
貫通孔7aの上端内周には雌ねじ部7bを刻設してあり
、下端部は受部7Cとしである。A female screw portion 7b is formed on the inner periphery of the upper end of the through hole 7a, and a receiving portion 7C is formed on the lower end.
そしてソケット7の雌ねじ7bは本体1の雄ねじと螺合
しており、受部7Cにはこて真3のフランジ部3aが係
合している。The female screw 7b of the socket 7 is screwed into the male screw of the main body 1, and the flange portion 3a of the iron stem 3 is engaged with the receiving portion 7C.
また筒体6の先端部はこて真3の先端より僅かに長く形
威しであるのでこで真の先端部は筒体の先端開口縁部に
より覆われている。The tip of the cylindrical body 6 is slightly longer than the tip of the trowel stem 3, so that the true tip is covered by the edge of the opening at the tip of the cylindrical body.
そして筒体6の先端開口部内には図示の例では仕切板8
を設けて、先端に半田量調整空間9を形成しである。In the illustrated example, a partition plate 8 is provided inside the opening at the tip of the cylinder body 6.
, and a solder amount adjustment space 9 is formed at the tip.
仕切板8の中心に孔8aを設けてあり、この孔をこて真
3の先端部が貫通している。A hole 8a is provided in the center of the partition plate 8, and the tip of the iron bar 3 passes through this hole.
そして筒体6の先端開口縁部に半田挿入孔10を設けて
あり、この挿入孔には半田11を外部から空間9内に挿
入可能である。A solder insertion hole 10 is provided at the edge of the opening at the tip of the cylinder 6, into which solder 11 can be inserted from the outside into the space 9.
第2図において12はプリント基板、13はプリント基
板12の孔12 aにリード端子13 aを挿通してい
る素子である。In FIG. 2, 12 is a printed circuit board, and 13 is an element in which a lead terminal 13a is inserted into a hole 12a of the printed circuit board 12.
つぎに半田ごての使用方法について説明すると、第2図
に示すように、プリント基板12に対してこで真3を垂
直にして半田付は個所に位置合せしながら筒体6の先端
部をプリント基板12に当接させ、筒体6でリード端子
13Hの先端部を覆う。Next, to explain how to use the soldering iron, as shown in Fig. 2, with the soldering iron 3 perpendicular to the printed circuit board 12, and while positioning the soldering iron at the soldering point, print the tip of the cylinder 6. The lead terminal 13H is brought into contact with the substrate 12, and the cylindrical body 6 covers the tip of the lead terminal 13H.
半田挿入孔10より糸半田などの半田11を挿入してこ
て真3で溶融すると、プリント基板のプノント面と素子
13のリード端子13aとの半田付けが行える。By inserting solder 11 such as thread solder through the solder insertion hole 10 and melting it with the iron shank 3, soldering can be performed between the solder surface of the printed circuit board and the lead terminal 13a of the element 13.
半田付は作業のとき、半田11の溶融時に飛散するフラ
ッフ又は、こて真3を包囲している筒体6で遮断されて
他のプリント面への飛散や耐着はない。During soldering, the solder 11 is blocked by the fluff that scatters when it melts or by the cylinder 6 surrounding the iron shank 3, so that it does not scatter or adhere to other printed surfaces.
また溶融した半田は筒体6で囲まれた範囲内にその広が
りが規制され、さらに半田量は仕切板8により規制され
ることになり、換言すれば空間9により充填される半田
量が調整され半田の盛りすぎや半田不良を回避すること
ができる。Further, the spread of the molten solder is regulated within the area surrounded by the cylinder 6, and the amount of solder is further regulated by the partition plate 8. In other words, the amount of solder filled in the space 9 is regulated. Excessive solder and solder defects can be avoided.
なお筒体6をたとえば透明ガラス部材で製作すれば、こ
て真3による半田付は作業の状況が筒体6外から目視す
ることができるので作業の能率向上を計ることができる
。Note that if the cylinder 6 is made of, for example, a transparent glass member, the soldering process using the iron stem 3 can be visually observed from outside the cylinder 6, thereby improving work efficiency.
以上のように本考案によれば、こて真を包囲する筒体を
設け、かつ筒体の先端開口縁部に半田挿入孔を形成した
ことにより、半田付は作業の際のフラックスの飛散を防
止して接点部への悪影響やプリント配線などの短絡を回
避し、また筒体の先端かこて真の先端より長いので、溶
融した半田は筒体に囲まれた面より広く広がることがな
く、隣接するプリント配線との短絡が阻止でき、半田付
は作業を効果的に行うことができる。As described above, according to the present invention, the cylindrical body surrounding the iron stem is provided, and the solder insertion hole is formed at the edge of the tip opening of the cylindrical body, thereby preventing flux from scattering during soldering. This prevents adverse effects on the contacts and short circuits in printed wiring, etc., and since the tip of the cylinder is longer than the true tip of the iron, the molten solder does not spread wider than the surface surrounded by the cylinder. Short circuits with adjacent printed wiring can be prevented, and soldering work can be performed effectively.
第1図は半田ごて要部の正面図、第2図は第1図II−
II線断面図、第3図は第2図のIII −III線断
面図である。
1・・・・・・半田ごて本体、3・・・・・・こて真、
6・・・・・・筒体、7・・・・・・ソケット、8・・
・・・・仕切板、9・・・・・・半田量調整空間、10
・・・・・・半田挿入孔。Figure 1 is a front view of the main parts of the soldering iron, Figure 2 is Figure 1 II-
FIG. 3 is a sectional view taken along line III--III in FIG. 2. 1... Soldering iron body, 3... Iron stem,
6...Cylinder, 7...Socket, 8...
...Partition plate, 9...Solder amount adjustment space, 10
...Solder insertion hole.
Claims (1)
このこて真先端よりも軸方向に長い耐熱性の筒体と、 この筒体の先端開口縁部に設けである半田挿入孔と を具備している半田ごて。 2、実用新案登録請求の範囲第1項において、筒体の先
端開口部内に仕切板を設けて半田量調整空間を形成した
ことを特徴とする半田ごて。1. A iron stem attached to the tip of the soldering iron body, and a heat-resistant cylindrical body that is attached to the soldering iron body, surrounds the iron stem, and is longer in the axial direction than the true tip of the iron. and a solder insertion hole provided at the edge of the opening at the tip of the cylindrical body. 2. Utility Model Registration The soldering iron according to claim 1, characterized in that a partition plate is provided in the opening at the tip of the cylindrical body to form a solder amount adjustment space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15750580U JPS595493Y2 (en) | 1980-11-04 | 1980-11-04 | soldering iron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15750580U JPS595493Y2 (en) | 1980-11-04 | 1980-11-04 | soldering iron |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5782473U JPS5782473U (en) | 1982-05-21 |
| JPS595493Y2 true JPS595493Y2 (en) | 1984-02-18 |
Family
ID=29516614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15750580U Expired JPS595493Y2 (en) | 1980-11-04 | 1980-11-04 | soldering iron |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS595493Y2 (en) |
-
1980
- 1980-11-04 JP JP15750580U patent/JPS595493Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5782473U (en) | 1982-05-21 |
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