JPS5969990A - Method of forming ultrafine conductor layer - Google Patents
Method of forming ultrafine conductor layerInfo
- Publication number
- JPS5969990A JPS5969990A JP18030882A JP18030882A JPS5969990A JP S5969990 A JPS5969990 A JP S5969990A JP 18030882 A JP18030882 A JP 18030882A JP 18030882 A JP18030882 A JP 18030882A JP S5969990 A JPS5969990 A JP S5969990A
- Authority
- JP
- Japan
- Prior art keywords
- conductor layer
- fine
- forming
- pattern
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 この発明は微糺専体層パターン形成力法に係り。[Detailed description of the invention] This invention relates to a method of forming a fine adhesive layer pattern.
特に形状が円筒である物体の表面に経済的で、かつ簡便
な微細堺体層パターンを形成する方法を提供するもので
ある。In particular, the present invention provides an economical and simple method for forming a fine grain layer pattern on the surface of an object having a cylindrical shape.
従来微細導体層パターンの形成においては、（Ａ）通常
ガラスエボギシ上の銅箔をエツチングするというフリン
ト基板の製造工程で行っている方法。Conventionally, in the formation of fine conductor layer patterns, (A) the method used in the production process of flint substrates, which involves etching the copper foil on the glass enamel.
（ＢｌハイブリッドエＣの製造で用いられる微細パター
ンをスクリーン印刷法で形成し、その後焼成する方法が
ある。(There is a method in which the fine pattern used in the production of Bl Hybrid E-C is formed by screen printing and then fired.
上記（Ａｌの方法ではエツチングすべき導電性の皮膜が
先たって被榛されており、フォトレジスト法で微細なパ
ターンを形成し、上記パターン以外の皮膜をエツチング
により溶解している。この様な形成方法では、形状が円
篇の場合にはフォトレジスト法を適用することは困難で
ある。In the above (Al method), the conductive film to be etched is first exposed, a fine pattern is formed using a photoresist method, and the film other than the above pattern is dissolved by etching. However, when the shape is circular, it is difficult to apply the photoresist method.
一方（Ｂ）の方法では、被加工品とスクリーン版とを位
置合わせし、導電性の被抜剤を圧着しながら塗布するも
のである。On the other hand, in method (B), the workpiece and the screen plate are aligned, and the conductive material to be removed is applied while being pressed.
この方法も、形状が円筒の場合、スクリーン版との位置
合わせがむずがしく、特に寸法精度の厳しい微細パター
ンの場合１位置ずれが起こらないように位置合わせ用の
特殊な設備が必要である。In this method, too, when the shape is cylindrical, alignment with the screen plate is difficult, and in the case of fine patterns with particularly strict dimensional accuracy, special equipment for alignment is required to prevent one positional deviation from occurring.
又１通常カロエ品はスクリーン版の下で、導電性被傑剤
を含んだローラ〜を圧着しながら回転させるのであるが
、加工品が円筒形状の場合上記の組合わせとは逆で、ス
クリーン版の上にカロエ品があり、ローラーの代わりに
回転させることになり。Also, 1. Normally, Caloe products are made by rotating a roller containing a conductive material under a screen plate while pressing it, but if the processed product is cylindrical, the above combination is reversed, and the screen plate is rotated. There is a Kaloe product on top of the , and it will be rotated instead of a roller.
非常に困難である。Very difficult.
この発明は微細導体層パターン形成における上記諸欠点
を改善するもので１Ｍ、済的でかつ簡便な形成方法を提
案するものである。The present invention aims to improve the above-mentioned drawbacks in forming a fine conductor layer pattern, and proposes a 1M, economical and simple forming method.
以下図によってこの発す］Ｋよる方法を説明１゛る。The following figure explains the method using K.
化１図（イ）〜（ホ）はパターン形成プロセスを示すも
ので１円筒形状の素材（？ｌ」：セラミック）ｆｌｌハ
Ｕ浄され１次にその外周面をフォトレジスト法で寸法精
度よく形成された微細パターン板（２１でマスキングし
、その後蒸漸によりメタラづジンクをイボつて、導電性
のよい銅めっきを行って、マスキンク板な除去すること
によって円筒表面上に微細導体層パターン（３）が形成
さノ″Ｌる。Figures 1 (a) to (e) show the pattern forming process. 1. A cylindrical material (?l": ceramic) is cleaned and its outer peripheral surface is formed with high dimensional accuracy using a photoresist method. A fine conductor layer pattern (3) is formed on the cylindrical surface by masking the fine pattern plate (21), then warping metallized zinc by steaming, plating with copper with good conductivity, and removing the masking plate. is formed.
第２図は微細導体層パターン形成後の加工品の断面を示
すもので、（１）は素材（例：セラミック）。Figure 2 shows a cross section of the processed product after the formation of a fine conductor layer pattern, where (1) is the material (eg ceramic).
（３）は蒸着層、（４）は銅めっき層である。(3) is a vapor deposited layer, and (4) is a copper plating layer.
この発明は以上のようになっているから、揚現性がよく
しかも導電性のよいパターンが得られ。Since the present invention is as described above, a pattern with good embossing properties and good conductivity can be obtained.
しかも安く形成することが可能である。Moreover, it can be formed cheaply.
第１図はこの発明による微細導体層パターンの形成工程
を示す図、第２図はこの発明によって得られた力［１工
品の回向を示す図で１図中（１）は素相。
（２）は微細パターン板、（３）は蒸着層、（４）は銅
めっき層である。
なお図中、同一あるいは相当部分には同一符号を付して
示しである。
代理人葛野信−FIG. 1 is a diagram showing the process of forming a fine conductor layer pattern according to the present invention, and FIG. 2 is a diagram showing the force obtained by the present invention [1] The direction of the workpiece; (1) in FIG. 1 is a prime phase. (2) is a fine pattern plate, (3) is a vapor deposited layer, and (4) is a copper plating layer. In the drawings, the same or corresponding parts are designated by the same reference numerals. Agent Makoto Kuzuno
Claims (1)
法で微細パターンを形成した微細パターン板を張り付け
て導電性の皮膜を上記円筒上に形成し、さらに銅めっき
を何９ことにより微細導体層パターンを上記円筒の外周
部に得るようにしたことを特徴とする微細導体層パター
ン形成力法。 （２１円筒はセラミックによって形成されていることを
特徴とする特許話末の範囲第ｆ１１項記載の微細導体層
パターン形成方法。[Claims] +l'1 A fine pattern plate with a fine pattern formed using a photoresist method is attached to the outer peripheral surface of a cylinder having a desired shape, a conductive film is formed on the cylinder, and copper plating is further applied to the outer peripheral surface of the cylinder. A method for forming a fine conductor layer pattern, characterized in that a fine conductor layer pattern is obtained on the outer periphery of the cylinder. (21) A method for forming a fine conductor layer pattern according to item f11 at the end of the patent, characterized in that the cylinder is made of ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18030882A JPS5969990A (en) | 1982-10-14 | 1982-10-14 | Method of forming ultrafine conductor layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18030882A JPS5969990A (en) | 1982-10-14 | 1982-10-14 | Method of forming ultrafine conductor layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5969990A true JPS5969990A (en) | 1984-04-20 |
Family
ID=16080935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18030882A Pending JPS5969990A (en) | 1982-10-14 | 1982-10-14 | Method of forming ultrafine conductor layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5969990A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03195087A (en) * | 1989-12-25 | 1991-08-26 | Matsushita Electric Works Ltd | Formation of circuit pattern onto metal layer lamination inorganic board |
-
1982
- 1982-10-14 JP JP18030882A patent/JPS5969990A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03195087A (en) * | 1989-12-25 | 1991-08-26 | Matsushita Electric Works Ltd | Formation of circuit pattern onto metal layer lamination inorganic board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1268317A (en) | Improvements in or relating to the manufacture of conductor plates | |
| US2965952A (en) | Method for manufacturing etched circuitry | |
| JPS6235693A (en) | Circuit board | |
| JPS5969990A (en) | Method of forming ultrafine conductor layer | |
| JPS6298795A (en) | Printed wiring board and manufacture of the same | |
| JPS6345888A (en) | Manufacture of wiring board with bumps | |
| JPH01268094A (en) | Electric circuit board manufacturing method | |
| JPS58115885A (en) | Method of producing circuit board | |
| JPS6142192A (en) | Method of producing ceramic substrate | |
| JPS63216398A (en) | Manufacture of circuit board | |
| JPS59197191A (en) | Circuit board and its producing method | |
| JPH11293451A (en) | Vapor deposited film for transfer | |
| JPS62257790A (en) | Manufacture of ceramic circuit board | |
| JPS61194795A (en) | Manufacture of printed wiring board | |
| JPS5996793A (en) | Method of producing printed board | |
| GB795822A (en) | Improvements in or relating to the production of printed electric circuits | |
| JPS6031116B2 (en) | Electric wiring circuit board and its manufacturing method | |
| JP2522968B2 (en) | Printed circuit transfer foil and manufacturing method thereof | |
| JPS58121698A (en) | Multilayer printed board | |
| JPS63291498A (en) | Manufacture of multilayer interconnection circuit board | |
| KR920011306A (en) | Manufacturing method of high density multilayer printed circuit board | |
| JPS63187682A (en) | Printed wiring board and manufacture of the same | |
| JPH04158596A (en) | Electronic parts mounting method and electronic parts mounting board | |
| JPH11168278A5 (en) | ||
| JP2003298208A (en) | Manufacturing method of circuit board |