JPS5970490A - 半導体装置の製造法 - Google Patents

半導体装置の製造法

Info

Publication number
JPS5970490A
JPS5970490A JP57178891A JP17889182A JPS5970490A JP S5970490 A JPS5970490 A JP S5970490A JP 57178891 A JP57178891 A JP 57178891A JP 17889182 A JP17889182 A JP 17889182A JP S5970490 A JPS5970490 A JP S5970490A
Authority
JP
Japan
Prior art keywords
radioactive
brazing material
alloy brazing
semiconductor device
count number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57178891A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254597B2 (fr
Inventor
Naoyuki Hosoda
細田　直之
Naoki Uchiyama
直樹 内山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP57178891A priority Critical patent/JPS5970490A/ja
Publication of JPS5970490A publication Critical patent/JPS5970490A/ja
Publication of JPS6254597B2 publication Critical patent/JPS6254597B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP57178891A 1982-10-12 1982-10-12 半導体装置の製造法 Granted JPS5970490A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57178891A JPS5970490A (ja) 1982-10-12 1982-10-12 半導体装置の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57178891A JPS5970490A (ja) 1982-10-12 1982-10-12 半導体装置の製造法

Publications (2)

Publication Number Publication Date
JPS5970490A true JPS5970490A (ja) 1984-04-20
JPS6254597B2 JPS6254597B2 (fr) 1987-11-16

Family

ID=16056498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57178891A Granted JPS5970490A (ja) 1982-10-12 1982-10-12 半導体装置の製造法

Country Status (1)

Country Link
JP (1) JPS5970490A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869871A (en) * 1988-03-17 1989-09-26 Toyota Motor Corporation Pb-Sn-Sb-In solder alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869871A (en) * 1988-03-17 1989-09-26 Toyota Motor Corporation Pb-Sn-Sb-In solder alloy

Also Published As

Publication number Publication date
JPS6254597B2 (fr) 1987-11-16

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