JPS5976251A - Manufacture of metallic foil lined laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing metal foil-clad laminates with improved adhesive strength of metal foil to the laminate.In recent years, metal foil-clad laminates have been widely used in the industry. has been done. As parts of electronic devices become more densely packaged, there is a trend toward narrower circuit patterns and smaller land areas obtained by processing metal foil-covered laminates, and at the same time, these circuit boards are being manufactured using automatic assembly equipment. Since the metal foil is often assembled by mounting, there is a tendency for many defects to occur due to the weak adhesive strength of the metal foil to the laminate. For example, when processing an old circuit board with a metal foil conductor width of 0.2 to 0.5 mm in an automatic melting line process, the number of metal foil peeling defects can reach several percent. The object of the present invention is to overcome such a situation and obtain a metal foil-clad laminate 4) free from metal foil peeling defects.

In order to improve the adhesive strength of the metal foil to the laminate, in step 1 of manufacturing the laminate, titanate cups are added to the prepreg obtained by impregnating and drying the base material with thermosetting resin varnish. The prepreg is treated with a ring agent, and the prepreg is laminated at least at a position in contact with the metal foil, and then heat-processed and formed.

The ditanate cuffling agent is a monofunctional ti-mer which has a moiety bonding to metal foil, such as an alkoxy group, and a moiety having good affinity with thermosetting resins in its molecule.

That is, in the present invention, when prepregs are laminated and heat-processed and molded, the thermosetting resin mixed with the titanate coupling agent of the prepreg upper melts and flows, uniformly wets the metal foil, and then hardens. Therefore, when the resin melts and flows, it exhibits interfacial activity with the metal foil, and the viscosity at the interface is significantly reduced, allowing the resin to reach even the finer details of the surface of the metal foil, which is usually roughened before use. Furthermore, in addition to acting as a surfactant, a bridging structure is created between the alkoxy group and the metal foil through a strong chemical bond, making it possible to obtain a metal foil-clad laminate with strong adhesive strength. In addition, a method of modifying the thermosetting resin varnish by adding a titanate-based coupling agent in advance has been considered11, but it has been experimentally confirmed that such a method has no effect on improving adhesive strength. There is.

In the present invention, the method of treating prepreg with a titanate coupling agent is to impregnate the base material with a thermosetting resin varnish and apply a solution of a titanate coupling agent dissolved in turquoise or the like to the prepreg that comes out of the drying stage. After applying the streak 1 method and the D2 method 7 method, dry it at around 100°C for a few seconds. Regarding the introduction of the titanate coupling agent into the prepreg, it was found that a coefficient of about 05 was most effective for the 1'rImI of the prepreg, and there is no particular limitation on IJ.

Next, all organic titanates can be used for the titanate-based force/tub link cutting that can be used in the present invention, but if the thermosetting resin is an epoxy resin or a phenol resin, isoprobil triisostearoyl titanate, inbrovir Tridodecylbenzenesulfonyl titanate and the like were effective. In both cases, it is often affected by the condition of the metal foil surface, such as moisture, so it cannot be selected experimentally.

Next, examples of the present invention will be described.

'Example Epoquin resin EPOhl-1001 (Shell Chemical Co., Ltd.) 1
A prepreg was obtained by impregnating a glass cloth with an epoxy resin varnish consisting of 0.00 parts of heavy acid, 4 parts of curing agent dianediamide, and 0.5 parts of benzyldimethylamine as an accelerator to a resin thickness of 40 parts and drying. A +4 (river!i1.)h ruene solution of the titanate coupling agent isobrobil tridodenolbenosene sulfonyl difluoride was added to the prepreg to give r'i'+, 0.5'%. After spraying, dry at +00'C for 30 seconds. Seven prepregs treated with the titanium-1 type coupling agent were laminated, 35μ thick copper foil was placed on both sides, and the temperature was 160°C.
A double-sided copper foil-covered laminate with a thickness of 16 mm was prepared by heating at 6° C. (147° C.) for 30 minutes (invention product).

Conventional Example 1 A double-sided copper foil-clad laminate with a thickness of 16 mm was made using a prepreg with the same 13'/J as in the example, but without the present invention Q) Tita-auto-based strength, and no bubbling agent treatment. Got (1)
Kurushima 1).

Conventional Example 2 A similar titanate coupling agent was added in advance to Poquin resin/nonis as in Example 05 with a weight of 111%.
A prepreg was obtained by impregnating 1 L of this into a glass cloth with 40% L of resin and drying. 7 of the prepreg
A copper foil-clad laminate with a thickness of 16 cm was obtained by placing copper foil on both sides and using the same molding method as in the example (conventional product 2).
).

Next, Table 1 shows the results of measuring the copper foil peel strength of the invented product and the conventional product 1.2 according to the JIS method, and the practical patterns with conductor widths 03 and 31 obtained from each of the above-mentioned laminates. One line for automatic melting of circuit boards with a single opening (lower opening 11A degrees 250°C,
Table 2 shows the failure rate of copper foil peeling when treated with Ta (line speed (zm/min)).

In the -1Z period embodiment, blib l/g treated with a titanate coupling agent was used throughout, or it was not necessarily necessary to use blib l/g at least at the position where it was in contact with the metal foil.

Table 1 (Units: KP/K) Table 2 (Units) As is clear from Tables 1 and 2, the present invention has a high metal foil peel strength, which has helped the high quality of parts used in recent electronic devices. The ability to obtain metal foil-clad laminates that are fully compatible with high-density packaging and automated production lines - The commercial value is extremely high.

patent applicant 239-

Claims (1)

[Claims] When a predetermined number of prepregs obtained by impregnating and drying a thermosetting resin varnish on a base material are placed on both sides or one side and heat-processed and formed, at least the surface in contact with the metal foil is coated with titanate in the prepreg. A method for producing a metal χ1-clad laminate, characterized by using a laminate treated with a coupling agent.