JPS5984595A - Method of producing printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a method for manufacturing printed wiring boards, and to an improvement in the photoresist stripping process in circuit formation of printed wiring boards.

Generally, the circuit forming process for printed wiring boards is used for both inner and outer layer boards, but in both cases, photosensitive resin film (photosensitive photoresist) is used for f''i+ density printed wiring boards. The manufacturing process is completed by laminating the copper plate on a laminated board, forming an etching resist corresponding to the circuit pattern by photoprinting, and etching to form the circuit pattern.Excluding etching resist that is incomplete after etching. (Photosensitive dry film) is peeled off using a solvent such as methylene chloride, but generally, peeling is done by dipping or spraying, and then left to stand naturally to vaporize the bath agent.Meanwhile, steel cladding Laminated resin is manufactured by impregnating glass cloth with a resin such as phenol, epoxy, polyimide, etc., or this resin is used for long-term exposure to MJ MQ K such as methylene chloride used for removing etching resist (dry film). If the inner layer plate is heated, the physical properties of the resin will deteriorate.In the case of an inner layer plate, this step is followed by a pre-contact treatment. When stacking layers, the soldering heat resistance often deteriorated due to delamination, measling, etc. Also for the outer layer, the same jMK etching resist was spontaneously released after peeling, and the peeling solution completely deteriorated the properties of the resin of the copper-clad laminate. This caused a decrease in solder heat resistance.

Particularly in recent years, lines have become automated, and after passing through the peeling process in the peeling process Vζ, the substrate is often pinched and bent, so there is a delay in the vaporization of the peeling liquid > Deterioration of the laminate I listen to people iv.

The present invention has been made in view of the above points, and consists of laminating a copper-clad layered layer 1/i' photosensitive resin film, and
In the manufacturing method of printed wiring boards in which an etching resist corresponding to a circuit pattern is formed by the current U method, etched, and removed with an etching resist stripping solution, the etching resist is removed using a stripping solution. Kai1
．． It is a special feature to do this.

In other words, the etching resist (
In the step of peeling off the dry film (Vt), it was treated with a bath agent such as methylene chloride (Vl) or a spray method,
'e' and immediately heated with hot air to vaporize and remove the cloves, methylene chloride, and other additives. By this method, it is possible to use the entire conventional etching SJ1+ line to produce heat-resistant printed wiring boards.

is a simplified cross-sectional view of an apparatus for carrying out the entire printed wiring board manufacturing method of the present invention; +ttS;
Resist stripping device garden, 2 is stripping island W7 spray nozzle,
3 is a hot air dryer.

The solder heat resistance test results of the printed wiring board when processed using the uninvented peeling line γ on the multilayer printing and engraving JI&'s P' 3-layer board are as shown in the following table when compared with all conventional methods.

As explained above, etching regimen 11: Immediately peel off the liquid by vaporizing it with hot air, etc. Conventionally, it lasted only about 50 seconds in the Ushida test at 260°C, but it lasted for more than 1 minute. Due to its durability and non-explosion, it was possible to improve the solder heat resistance of printed wiring boards by a width of π.

[Brief explanation of drawings]

The drawing is a simple method for not carrying out the method ``1.
It is a river map. Explanation of symbols 1, resist stripping device + fi 2, stripping liquid spray nozzle 6, heat, J) ξ) - drying 1

Claims (1)

[Claims] 1. A printed wiring board production method in which a single-layer photosensitive resin film laminate is formed into an etching resist corresponding to a circuit pattern using a photoprinting method, etched, and removed using an etching resist stripping solution. A method for manufacturing a printed wiring board, in which after removing the etching resist with a stripping solution, the printed wiring board is heated to a temperature of 7 JIl to make it moldy.