JPS599543U - ボンデイング装置のワイヤ繰り出し量検出機構 - Google Patents

ボンデイング装置のワイヤ繰り出し量検出機構

Info

Publication number
JPS599543U
JPS599543U JP1982104336U JP10433682U JPS599543U JP S599543 U JPS599543 U JP S599543U JP 1982104336 U JP1982104336 U JP 1982104336U JP 10433682 U JP10433682 U JP 10433682U JP S599543 U JPS599543 U JP S599543U
Authority
JP
Japan
Prior art keywords
wire
detection mechanism
guide members
amount detection
wire feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982104336U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0110929Y2 (cs
Inventor
秀明 三好
干山　政明
忠 高野
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1982104336U priority Critical patent/JPS599543U/ja
Publication of JPS599543U publication Critical patent/JPS599543U/ja
Application granted granted Critical
Publication of JPH0110929Y2 publication Critical patent/JPH0110929Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Unwinding Of Filamentary Materials (AREA)
  • Wire Bonding (AREA)
  • Control Of Stepping Motors (AREA)
JP1982104336U 1982-07-12 1982-07-12 ボンデイング装置のワイヤ繰り出し量検出機構 Granted JPS599543U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982104336U JPS599543U (ja) 1982-07-12 1982-07-12 ボンデイング装置のワイヤ繰り出し量検出機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982104336U JPS599543U (ja) 1982-07-12 1982-07-12 ボンデイング装置のワイヤ繰り出し量検出機構

Publications (2)

Publication Number Publication Date
JPS599543U true JPS599543U (ja) 1984-01-21
JPH0110929Y2 JPH0110929Y2 (cs) 1989-03-29

Family

ID=30245032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982104336U Granted JPS599543U (ja) 1982-07-12 1982-07-12 ボンデイング装置のワイヤ繰り出し量検出機構

Country Status (1)

Country Link
JP (1) JPS599543U (cs)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129868A (cs) * 1974-09-06 1976-03-13 Hitachi Ltd
JPS5572049A (en) * 1978-11-27 1980-05-30 Nec Corp Wire bonding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129868A (cs) * 1974-09-06 1976-03-13 Hitachi Ltd
JPS5572049A (en) * 1978-11-27 1980-05-30 Nec Corp Wire bonding device

Also Published As

Publication number Publication date
JPH0110929Y2 (cs) 1989-03-29

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