JPS60102702A - Thick film resistance layer forming paste - Google Patents
Thick film resistance layer forming pasteInfo
- Publication number
- JPS60102702A JPS60102702A JP58209845A JP20984583A JPS60102702A JP S60102702 A JPS60102702 A JP S60102702A JP 58209845 A JP58209845 A JP 58209845A JP 20984583 A JP20984583 A JP 20984583A JP S60102702 A JPS60102702 A JP S60102702A
- Authority
- JP
- Japan
- Prior art keywords
- resistance layer
- thick film
- paste
- film resistance
- layer forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 150000002902 organometallic compounds Chemical class 0.000 claims description 5
- 229910052770 Uranium Inorganic materials 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229910000510 noble metal Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- 239000010948 rhodium Substances 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims description 4
- 239000010953 base metal Substances 0.000 claims description 3
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 239000010408 film Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 11
- 244000283070 Abies balsamea Species 0.000 description 5
- 235000007173 Abies balsamea Nutrition 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004857 Balsam Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010666 rose oil Substances 0.000 description 2
- 235000019719 rose oil Nutrition 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000000341 volatile oil Substances 0.000 description 2
- 239000004858 Canada balsam Substances 0.000 description 1
- 239000001293 FEMA 3089 Substances 0.000 description 1
- 240000004153 Hibiscus sabdariffa Species 0.000 description 1
- 235000001018 Hibiscus sabdariffa Nutrition 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 241000269821 Scombridae Species 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000010624 camphor oil Substances 0.000 description 1
- 229960000411 camphor oil Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- RXPAJWPEYBDXOG-UHFFFAOYSA-N hydron;methyl 4-methoxypyridine-2-carboxylate;chloride Chemical compound Cl.COC(=O)C1=CC(OC)=CC=N1 RXPAJWPEYBDXOG-UHFFFAOYSA-N 0.000 description 1
- 239000000171 lavandula angustifolia l. flower oil Substances 0.000 description 1
- 235000020640 mackerel Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002304 perfume Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- VXNYVYJABGOSBX-UHFFFAOYSA-N rhodium(3+);trinitrate Chemical compound [Rh+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VXNYVYJABGOSBX-UHFFFAOYSA-N 0.000 description 1
- 239000010668 rosemary oil Substances 0.000 description 1
- 229940058206 rosemary oil Drugs 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 229910002007 uranyl nitrate Inorganic materials 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、例えばチューナ、ホームコンバーター、集積
回路ブロック用などの厚膜抵抗層を形成するためのペー
ストに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a paste for forming thick film resistive layers, for example for tuners, home converters, integrated circuit blocks, etc.
従来の厚膜抵抗層材料としては、カーボンと合成樹脂の
混合物からなる低温用のもの、あるいは酸化ルテニウム
や他のルテニウム化合物とガラス７リツＦとの混合物、
または銀−パラジウム合金とガラス７リツトとの混合物
などからなる高混用のものがある。Conventional thick-film resistance layer materials include low-temperature materials made of a mixture of carbon and synthetic resin, or mixtures of ruthenium oxide or other ruthenium compounds and glass 7R,
Alternatively, there are highly mixed materials such as a mixture of silver-palladium alloy and glass 7 liters.
ところがこれら従来の厚膜抵抗層材料では形成された抵
抗層の寸法精度が低く、特に微細なパターンには不向き
である。寸法精度を高めるためには薄膜形成法を用いる
必要があり、そうすれば製造上のコスト高を招くなどの
欠点を有している。However, these conventional thick film resistance layer materials have low dimensional accuracy of the formed resistance layer, and are not suitable for particularly fine patterns. In order to improve dimensional accuracy, it is necessary to use a thin film formation method, which has drawbacks such as increased manufacturing costs.
本発明の目的は上記従来技術の欠点を解消し、寸法精度
の高い厚膜抵抗層が量産性よく生産できる厚膜抵抗層形
成用ペーストを提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a paste for forming a thick film resistor layer that eliminates the drawbacks of the prior art described above and allows thick film resistor layers with high dimensional accuracy to be mass-produced.
この目的を達成するために、本発明は金、白金、パラジ
ウムおよびロジウムを含む貴金属有機化合物と、ウラン
およびビスマスを含む卑金属有機化合物と、これら有機
化合物を溶解する有機液体とを有することを特徴とする
ものである。To achieve this objective, the invention is characterized in that it comprises noble metal organic compounds containing gold, platinum, palladium and rhodium, base metal organic compounds containing uranium and bismuth, and an organic liquid in which these organic compounds are dissolved. It is something to do.
本発明で用いられる貴金属有機化合物としては、例えば
全樹脂酸塩、白金樹脂酸塩、パラジウム樹脂酸塩および
ロジウム樹脂酸塩が好適である。これら貴金属樹脂酸塩
は、バルサム、ロジン、テレピン油の混合樹脂にイオウ
を作用して得た硫化樹脂と、塩化金、塩化白金、硝酸パ
ラジウム、硝酸ロジウムをそれぞれ１５０〜１７０℃で
加熱反応させ、これらの樹脂状化合物をターピネオール
、ローズ油などの香油に溶解させることによって得られ
る。前記バルサムとは種々の植物から分泌される粘稠性
の液体で、固形樹脂が揮発油に溶解したものであり、代
表的なものが松脂で、それにはカナダバルサム、ペルー
バルサム、１・−ルバルサムなどがある。As the noble metal organic compound used in the present invention, for example, total resinate, platinum resinate, palladium resinate, and rhodium resinate are suitable. These noble metal resinates are produced by heating and reacting gold chloride, platinum chloride, palladium nitrate, and rhodium nitrate with a sulfurized resin obtained by treating a mixed resin of balsam, rosin, and turpentine with sulfur at 150 to 170°C, respectively. These resinous compounds are obtained by dissolving them in perfume oils such as terpineol and rose oil. The balsam is a viscous liquid secreted by various plants, and is a solid resin dissolved in volatile oil.A typical example is pine resin, which includes Canada balsam, Peruvian balsam, 1-ru balsam, etc. and so on.
一方、卑金属化合物としては、硝酸ビスマスとロジンな
加熱反応して得た樹脂酸ビスマスと、硝酸ウラニルとロ
ジンを加熱反応して得た樹脂酸ウランが好適である。On the other hand, as the base metal compound, bismuth resinate obtained by a heating reaction of bismuth nitrate and rosin, and uranium resinate obtained by a heating reaction of uranyl nitrate and rosin are suitable.
本発明で用いられる有機液体（溶媒）としては、植物精
油（ラベンダー油、樟脳油、ローズマリー油、ローズ油
、テレピン油）、ブチルカルピトール、ブチルアルビト
ールなどがある。Examples of the organic liquid (solvent) used in the present invention include plant essential oils (lavender oil, camphor oil, rosemary oil, rose oil, turpentine oil), butyl carpitol, butyl arbitol, and the like.
本発明に係るペーストの厚膜スクリーン印刷性を向上す
るため二）ロセル四−ズ、ビークルなどを添加するとよ
い。In order to improve the thick film screen printability of the paste according to the present invention, 2) Roselle fours, vehicle, etc. may be added.
次に本発明の実施例について説明する。Next, examples of the present invention will be described.
実施例１
アルミナ基板１上にホウケイ酸ガラスからなるアンダー
グレーズ層２を所定の厚さ形成し、そのアンダーグレー
ズ層２の所定の位置に金電極３を設ける。次に後記組成
ペーストな厚膜スクリーン法で印刷し、１２０℃で１５
分間乾燥したのち、７００〜８００℃で１０〜２０分間
焼成して、その後薄膜抵抗体形成法と同様に７オ） Ｉ
Ｊングラフイー技術な用いてパターンニングすることに
より、所定の形状の厚膜抵抗層４な得る。Example 1 An underglaze layer 2 made of borosilicate glass is formed to a predetermined thickness on an alumina substrate 1, and a gold electrode 3 is provided at a predetermined position on the underglaze layer 2. Next, print with the thick film screen method using the composition paste described below, and
After drying for minutes, baking at 700 to 800°C for 10 to 20 minutes, and then performing the same process as in the thin film resistor forming method (7) I
A thick film resistive layer 4 having a predetermined shape can be obtained by patterning using a graphite technique.
表１ ペースト組成表
前記抵抗層４の平均膜厚は２０００Ａ、面積抵抗値１３
Ω、温度係数ＴＯＲは＋４６６ＰＰＭ／℃であった。第
３図（イ）、（ロ）はこの抵抗層４の任意の個所の表面
状態を示すもので、いずれの個所も表面粗さは約１００
Ａ以下と極めて平滑で寸法精度が高い。Table 1 Paste Composition Table The average film thickness of the resistance layer 4 is 2000A, and the sheet resistance value is 13.
Ω, and the temperature coefficient TOR was +466 PPM/°C. FIGS. 3(a) and 3(b) show the surface condition of arbitrary parts of this resistance layer 4, and the surface roughness of each part is about 100.
It is extremely smooth and has a high dimensional accuracy of A or less.
実施例２
後記組成のペーストを用い、実施例１と同様の厚膜抵抗
層を得た。この抵抗層も高い寸法精度を有している。Example 2 A thick film resistance layer similar to that in Example 1 was obtained using a paste having the composition described below. This resistance layer also has high dimensional accuracy.
表２ ペースト組成表
この抵抗層の平均膜厚は１．８０ＯＡ、表面抵抗値は６
７Ω、温度係数ＴＯＲは＋３７３ＰＰＭ／℃であった。Table 2 Paste composition table The average film thickness of this resistance layer is 1.80OA, and the surface resistance value is 6.
7Ω, and the temperature coefficient TOR was +373 PPM/°C.
実施例３
後記組成のペーストを用い、実施例１と同様の厚膜抵抗
層を得た。この抵抗層も高い寸法精度を有している。Example 3 A thick film resistance layer similar to that in Example 1 was obtained using a paste having the composition described below. This resistance layer also has high dimensional accuracy.
表３ ペースト組成表
この抵抗層の平均膜厚はｉ、９ｏｏＸ、表面抵抗値は２
５０Ω、温度係数ＴＯＲは＋ａｏＯＰＰＭ／℃であった
。Table 3 Paste composition table The average film thickness of this resistance layer is i, 9ooX, and the surface resistance value is 2
50Ω, and the temperature coefficient TOR was +aoOPPM/°C.
実施例４
後記組成のペーストを用い、実施例１と同様の厚膜抵抗
層を得た。この抵抗層も高い寸法精度を有している。Example 4 A thick film resistance layer similar to that in Example 1 was obtained using a paste having the composition described below. This resistance layer also has high dimensional accuracy.
この抵抗層の平均膜厚は１，８００Ａ、表面抵抗値は７
００Ω、温度係数ＴＣＲは＋２２０ＰＰＭ／℃であった
。The average thickness of this resistance layer is 1,800A, and the surface resistance value is 7.
00Ω, and the temperature coefficient TCR was +220 PPM/°C.
前記の各実施例から明らかなように、ペースト組成を若
干変更することにより、各特性の厚膜抵抗層が得られる
。なお、本発明に係るペーストにおいては、ペースト中
の金属含有率は金が約２゜３〜２．９重量％、パラジウ
ムが約０．２〜０４重量％白金が約０２〜０．４重Ｈｓ
、ロジウムが約００４〜００８重量ヂ、ビスマスが約０
３〜０．８重量％、ウランが約０．２〜０．６重量％が
好適である。またペースト中のニトロセルｐ−ス含有率
は約２〜５重量％が好適である。As is clear from the examples described above, by slightly changing the paste composition, thick film resistive layers with various characteristics can be obtained. In addition, in the paste according to the present invention, the metal content in the paste is approximately 2.3 to 2.9% by weight of gold, approximately 0.2 to 0.4% by weight of palladium, and approximately 0.2 to 0.4% by weight of platinum.
, rhodium weighs about 0.04~0.08%, bismuth weighs about 0.
3 to 0.8% by weight, preferably about 0.2 to 0.6% uranium. Further, the content of nitrocellulose in the paste is preferably about 2 to 5% by weight.
本発明は前述のような構成になっており、寸法精度の高
い厚ｊ換抵抗層が鑓産性よく生産できる厚膜抵抗層形成
用ペーストを提供することができる。The present invention has the above-described configuration, and can provide a paste for forming a thick film resistance layer that can produce a thick resistance layer with high dimensional accuracy and high productivity.
第１図および第２図は本発明の実施例に係るサーマルヘ
ッド用厚膜抵抗層の平面図および断面図、第３図は抵抗
層の任意の個所の表面状態を示す説明図である。
■・・・・・・アルミナ基板、３・・・・・・金電極、
４・・・・・・厚膜抵抗層。
〜）
、鰍1 and 2 are a plan view and a sectional view of a thick film resistive layer for a thermal head according to an embodiment of the present invention, and FIG. 3 is an explanatory diagram showing the surface condition of an arbitrary part of the resistive layer. ■...Alumina substrate, 3...Gold electrode,
4... Thick film resistance layer. ~) , Mackerel
Claims (1)
化合物と、ウランおよびビスマスを含む卑金属有機化合
物と、これら有機化合物を溶解する有機液体とを有する
厚膜抵抗層形成用ペースト。A paste for forming a thick film resistance layer, comprising a noble metal organic compound containing gold, platinum, palladium, and rhodium, a base metal organic compound containing uranium and bismuth, and an organic liquid that dissolves these organic compounds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58209845A JPS60102702A (en) | 1983-11-10 | 1983-11-10 | Thick film resistance layer forming paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58209845A JPS60102702A (en) | 1983-11-10 | 1983-11-10 | Thick film resistance layer forming paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60102702A true JPS60102702A (en) | 1985-06-06 |
| JPH023523B2 JPH023523B2 (en) | 1990-01-24 |
Family
ID=16579568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58209845A Granted JPS60102702A (en) | 1983-11-10 | 1983-11-10 | Thick film resistance layer forming paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60102702A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01286401A (en) * | 1988-05-13 | 1989-11-17 | Fuji Xerox Co Ltd | Thermal head |
| US5510823A (en) * | 1991-03-07 | 1996-04-23 | Fuji Xerox Co., Ltd. | Paste for resistive element film |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104246479B (en) | 2012-04-18 | 2016-10-19 | 奥林巴斯株式会社 | Single particle detection device using optical analysis, single particle detection method, and computer program for single particle detection |
-
1983
- 1983-11-10 JP JP58209845A patent/JPS60102702A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01286401A (en) * | 1988-05-13 | 1989-11-17 | Fuji Xerox Co Ltd | Thermal head |
| US5510823A (en) * | 1991-03-07 | 1996-04-23 | Fuji Xerox Co., Ltd. | Paste for resistive element film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH023523B2 (en) | 1990-01-24 |
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