JPS6010756Y2 - ロ−ルフィ−ド装置 - Google Patents

ロ−ルフィ−ド装置

Info

Publication number
JPS6010756Y2
JPS6010756Y2 JP7953979U JP7953979U JPS6010756Y2 JP S6010756 Y2 JPS6010756 Y2 JP S6010756Y2 JP 7953979 U JP7953979 U JP 7953979U JP 7953979 U JP7953979 U JP 7953979U JP S6010756 Y2 JPS6010756 Y2 JP S6010756Y2
Authority
JP
Japan
Prior art keywords
roll
feed
idle
bearing
friction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7953979U
Other languages
English (en)
Other versions
JPS561744U (ja
Inventor
悠 高橋
豊 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aida Engineering Ltd
Original Assignee
Aida Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aida Engineering Ltd filed Critical Aida Engineering Ltd
Priority to JP7953979U priority Critical patent/JPS6010756Y2/ja
Publication of JPS561744U publication Critical patent/JPS561744U/ja
Application granted granted Critical
Publication of JPS6010756Y2 publication Critical patent/JPS6010756Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Advancing Webs (AREA)

Description

【考案の詳細な説明】 本考案はプレスに用いられるロールフィード装置に関す
るものである。
ロールフィードには種々の構造のものがあるが、本考案
は回転カムとカムホロアを用いたカムトロール式のロー
ルフィードに関するものである。
カムトロール式は送り精度の点、高速運転に向く点ては
優れているが、送り量の調整において、問題がある。
従来、この種のロールフィードにおいてはギヤーを交換
する、ロールフィードのフィードロールを交換する、な
どの手段によりその送り長さの調整をしているので送り
長さを変える場合には前もって所望のギヤーなどを用意
すること、ギヤーの交換には時間と労力を必要とするこ
となどの欠点があった。
本考案はこれらの問題を解決するためになされたもので
ある。
以下、本考案の一実施例である図面に基づいて詳説する
。
第1図において、割出カムユニット11はプレスの回転
軸に連結されている軸を入力軸10としている。
割出カムユニット11は回転カム11aとこれにならっ
て駆動されるローラをもった出力軸11bを有している
。
フリクションロール1は出力軸11bに固設さし、他方
、ロールフィードのフィードロール6の軸には、フリク
ションロール2が固設されている。
軸受9は機体14に可動に設けられている。
スライダ7は軸受9の長大に適合され、サポートピン8
で回転自在に保持され、このサポートピン8は機体14
に固設されている。
(第3図)流体圧シリンダ12,13は機体14に、ト
ラニオン状(回転できる状態)に設けられ、そのピスト
ンロッドは軸受9の両端部に夫々回転自在に接続されて
いる。
アイドルロール3,4は軸受9に回転自在に保持されて
いる軸15に固設され、アイドルロール3はフリクショ
ンロール1と、アイドルロール4はフリクションロール
2と夫々接している。
他方、アイドルロール3’、4’を固設した軸15′は
軸受9に前述のアイドルロール3,4と同様に組付けら
れている。
第4図において、軸受9はアイドルロール3゜4.3’
、4’を固設している軸15.15’を保持している部
分がアイドルロール3,4.3’。
4′を交換するために、分割できる構造となっている。
以下、作用について説明する。
入力軸10はプレスと同期して連続的に回転し、割出カ
ムユニット11の出力軸11bはバレルカム機構により
間欠回転運動をする。
この間欠回転運動は、フリクションロール1、アイドル
ロール3、軸15、アイドルロール4、フリクションロ
ール2を介して、ロールフィードのフィードロール6に
伝達される。
第5図において、送り長さを変えるときには流体圧シリ
ンダ12.13を作用させることにより軸受9を移動さ
せてあらかじめ軸受9に組付されているアイドルロール
3’、4’を夫々フリクションロール1とフリクション
ロール2に押しつける。
割出カムユニット11の出力軸11bの間欠回転はフリ
クションロール1、アイドルロール3′、軸15′、ア
イドルロール4′、フリクションロール2を介してロー
ルフィードのフィードロール6に伝達される。
アイドルロール3とアイドルロール4との外径の比とア
イドルロール3′とアイドルロール4′の外径の比を変
えることによりロールフィードの送り量は変わる。
すなわち、送り量はアイドルロールの外径寸法を適宜選
択することにより任意に変えることができる。
本考案は以上のような構成であるのでプレス運転中に、
次に行なうプレス作業に合わせたロールフィードの送り
量を得るために、次に使用すべきアイドルロールを軸受
9に組付ける作業ができる。
したがって次のプレス作業に入るときは、ロールフィー
ドの送り長さを迅速に変えることができる。
【図面の簡単な説明】
第1図は側面図、第2図は縦断面図、第3図は第1図に
おける■−■断面図、第4図は説明図、第5図は作動説
明図。 1はフリクションロール、2はフリクションロール、3
はアイドルロール、4はアイドルロール、5はフィード
ロール、6はフィードロール、7はスライダ、8はサポ
ートピン、9は軸受、10は入力軸、11は割出カムユ
ニット、11aはカム、11bは出力軸、12はシリン
ダ、13はシリンダ、14は機体、15は軸である。

Claims (1)

    【実用新案登録請求の範囲】
  1. プレスの回転と同期して回転するその入力軸10の回転
    を、その出力軸11bの間欠回転に変換する割出カムユ
    ニット11と、出力軸11bに固設されたフリクション
    ロール1と、ロールフィードのフィードロールの軸に固
    設されたフリクションロール2と、機体により案内され
    、可動の軸受9と、軸受9の両端部に回転自在でフリク
    ションロール1とフリクションロール2とに夫々接触す
    るアイドルロール3,4又は3’、4’を具え、軸受9
    を移動させることによりフリクションロール1.2とア
    イドルロール3,4又は3’、4’とを選択的に接触さ
    せて用いることを特徴とするロールフィード装置。
JP7953979U 1979-06-13 1979-06-13 ロ−ルフィ−ド装置 Expired JPS6010756Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7953979U JPS6010756Y2 (ja) 1979-06-13 1979-06-13 ロ−ルフィ−ド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7953979U JPS6010756Y2 (ja) 1979-06-13 1979-06-13 ロ−ルフィ−ド装置

Publications (2)

Publication Number Publication Date
JPS561744U JPS561744U (ja) 1981-01-09
JPS6010756Y2 true JPS6010756Y2 (ja) 1985-04-11

Family

ID=29312938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7953979U Expired JPS6010756Y2 (ja) 1979-06-13 1979-06-13 ロ−ルフィ−ド装置

Country Status (1)

Country Link
JP (1) JPS6010756Y2 (ja)

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US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US6965159B1 (en) 2001-09-19 2005-11-15 Amkor Technology, Inc. Reinforced lead-frame assembly for interconnecting circuits within a circuit module
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US6995459B2 (en) 2002-09-09 2006-02-07 Amkor Technology, Inc. Semiconductor package with increased number of input and output pins
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US7045396B2 (en) 1999-12-16 2006-05-16 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7183630B1 (en) 2002-04-15 2007-02-27 Amkor Technology, Inc. Lead frame with plated end leads
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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596029U (ja) * 1982-07-02 1984-01-14 アイダエンジニアリング株式会社 ロ−ルフイ−ドの送り長さ切換装置

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US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7115445B2 (en) 1999-10-15 2006-10-03 Amkor Technology, Inc. Semiconductor package having reduced thickness
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US9508631B1 (en) 2011-01-27 2016-11-29 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
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