JPS60130170A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60130170A
JPS60130170A JP58238320A JP23832083A JPS60130170A JP S60130170 A JPS60130170 A JP S60130170A JP 58238320 A JP58238320 A JP 58238320A JP 23832083 A JP23832083 A JP 23832083A JP S60130170 A JPS60130170 A JP S60130170A
Authority
JP
Japan
Prior art keywords
semiconductor
support plate
polycrystalline silicon
alloy
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58238320A
Other languages
English (en)
Japanese (ja)
Inventor
Masaaki Sadamori
貞森　將昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58238320A priority Critical patent/JPS60130170A/ja
Priority to CA000470319A priority patent/CA1222576A/fr
Publication of JPS60130170A publication Critical patent/JPS60130170A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H10W70/26—Semiconductor materials

Landscapes

  • Thyristors (AREA)
JP58238320A 1983-12-16 1983-12-16 半導体装置 Pending JPS60130170A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58238320A JPS60130170A (ja) 1983-12-16 1983-12-16 半導体装置
CA000470319A CA1222576A (fr) 1983-12-16 1984-12-17 Dispositif semiconducteur a support perfectionne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58238320A JPS60130170A (ja) 1983-12-16 1983-12-16 半導体装置

Publications (1)

Publication Number Publication Date
JPS60130170A true JPS60130170A (ja) 1985-07-11

Family

ID=17028453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58238320A Pending JPS60130170A (ja) 1983-12-16 1983-12-16 半導体装置

Country Status (2)

Country Link
JP (1) JPS60130170A (fr)
CA (1) CA1222576A (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762540A (en) * 1980-10-02 1982-04-15 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762540A (en) * 1980-10-02 1982-04-15 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
CA1222576A (fr) 1987-06-02

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