JPS60163739U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60163739U
JPS60163739U JP1984050357U JP5035784U JPS60163739U JP S60163739 U JPS60163739 U JP S60163739U JP 1984050357 U JP1984050357 U JP 1984050357U JP 5035784 U JP5035784 U JP 5035784U JP S60163739 U JPS60163739 U JP S60163739U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor element
power semiconductor
semiconductor equipment
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984050357U
Other languages
English (en)
Inventor
磯山　貴久雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1984050357U priority Critical patent/JPS60163739U/ja
Publication of JPS60163739U publication Critical patent/JPS60163739U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図および第２図は従来の半導体装置を説明する断面
図、第３図は本考案の半導体装置を説明する断面図、第
４図は本考案に用いるヒートシンクを説明する上面図で
ある。 １１は固着基板、１２はヒートシンク、１３はパワー半
導体素子、１４は半田層、１５は台地である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 固着基板上に熱伝導性良好なヒートシンクを介してパワ
    ー半導体素子を半田で固着する半導体装置に於いて、上
    記ヒートシンク上面にパワー半導体素子より若干小さい
    台地を設け、前記パワー半導体素子の周辺の半田の厚み
    を中央より厚く形成することを特徴とする半導体装置。
JP1984050357U 1984-04-05 1984-04-05 半導体装置 Pending JPS60163739U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984050357U JPS60163739U (ja) 1984-04-05 1984-04-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984050357U JPS60163739U (ja) 1984-04-05 1984-04-05 半導体装置

Publications (1)

Publication Number Publication Date
JPS60163739U true JPS60163739U (ja) 1985-10-30

Family

ID=30568412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984050357U Pending JPS60163739U (ja) 1984-04-05 1984-04-05 半導体装置

Country Status (1)

Country Link
JP (1) JPS60163739U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5466073A (en) * 1977-11-04 1979-05-28 Nec Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5466073A (en) * 1977-11-04 1979-05-28 Nec Corp Semiconductor device

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