JPS6083254U - 半導体素子の冷却構造 - Google Patents

半導体素子の冷却構造

Info

Publication number
JPS6083254U
JPS6083254U JP1983176537U JP17653783U JPS6083254U JP S6083254 U JPS6083254 U JP S6083254U JP 1983176537 U JP1983176537 U JP 1983176537U JP 17653783 U JP17653783 U JP 17653783U JP S6083254 U JPS6083254 U JP S6083254U
Authority
JP
Japan
Prior art keywords
cooling structure
thermally conductive
semiconductor devices
semiconductor device
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983176537U
Other languages
English (en)
Inventor
牧野　好男
正和 北川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1983176537U priority Critical patent/JPS6083254U/ja
Publication of JPS6083254U publication Critical patent/JPS6083254U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１区は従来の半導体素子の冷却構造を示す概略断面図
、第２図はコンパウンド厚さと半導体のジャンクション
温度との関係を示す図（第３図は本考案に係る半導体素
子の冷却構造を示す概略断面図である。 ６・・・・・・熱伝導性セラミック基板、７・・四半導
体素子、８・・・・・・熱伝導性ゴム、８ａ・・面突起
部、　　　−９，１０・・・・・・管路。

Claims (1)

    【実用新案登録請求の範囲】
  1. 熱伝導性セラミック基板上に搭載した半導体素子の上面
    に接して熱伝導性ゴムを載置せしめると共に、この熱伝
    導性ゴムと熱伝導性セラミック基板内部に冷媒の通路を
    設けることにより、上記半導体素子を上下両面から冷却
    するようにしたことを特徴とする半導体素子の冷却構造
    。
JP1983176537U 1983-11-15 1983-11-15 半導体素子の冷却構造 Pending JPS6083254U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983176537U JPS6083254U (ja) 1983-11-15 1983-11-15 半導体素子の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983176537U JPS6083254U (ja) 1983-11-15 1983-11-15 半導体素子の冷却構造

Publications (1)

Publication Number Publication Date
JPS6083254U true JPS6083254U (ja) 1985-06-08

Family

ID=30383790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983176537U Pending JPS6083254U (ja) 1983-11-15 1983-11-15 半導体素子の冷却構造

Country Status (1)

Country Link
JP (1) JPS6083254U (ja)

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