JPS601895A - Electronic part and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 9 of B Ming - This invention provides an electronic component in which internal elements such as piezoelectric elements and thermistors are housed in a case and sealed with resin (2), and a manufacturing method thereof. Regarding.

Figure 1 is an r1 view showing an example of a conventional electronic component that formed the basis of this invention, and Figure 2 is a view from n-r of Figure 1.
It is an r-line sectional view. Referring to FIG. 2, the electronic component 1 is
In other words, the internal element 2 such as a pressure N element and the case 3 that houses this internal element 2 are replaced. Internal element 2 has terminal 4
．． The terminals 4 and 5 are led out from the opening 6 of the case 3. Incidentally, this type of electronic component requires perfect sealing performance in order to improve the reliability of its operating characteristics, and therefore the case opening 6 is sealed with a sealing resin 7.

The electronic component 1 is manufactured by first arranging the internal element 2 and the terminals 4 and 5 in a case 3 (in the example shown in FIG. 12, the case 3 consists of an inner case 3a and an outer case 3b). It is manufactured by filling the case opening 6 with resin 7. However, as the resin 7, a thermosetting resin is used in order to obtain more reliable contact with the case 3;
When filling the case opening 6, heat is applied to the inside of the case 3, so the pressure inside the case increases, and the air inside is taken into the molten resin 7 or is blown out from the resin 7. There was a problem. For this reason, there was a problem in that reliable sealing could not be achieved. In order to solve this problem, a through hole 8 with a relatively small diameter is conventionally formed in a part of the case 3 as shown in FIG. 2, and the air expanded when the resin 7 is sealed is directed outside. Attempts have been made to allow the through hole 8 to escape and then seal the through hole 8 with a resin 9 that hardens at room temperature.

However, since the through hole 8 has a relatively small diameter, there is a drawback that the sealing resin 9 filled in the n through hole 8 is trapped due to a slight change in the air pressure inside the case 3. That is, in the examples shown in FIG. 163 and FIG. 2, it was also impossible to achieve complete sealing of the d3-electrode component 1.

Therefore, the purpose of the invention of mouth is to eliminate the above-mentioned drawbacks,
Our goal is to provide small parts with excellent sealing performance and high reliability.

B. Shell-on-claw - To summarize, the present invention has a resin portion to be welded formed near the r through hole for preventing internal pressure fluctuations during resin sealing of the case opening, and a resin portion to be welded. It is an electronic component whose through hole is sealed by welding the resin part.
and a step of housing the internal element in a case formed with an opening for housing the internal element and a through hole having a portion to be attached near the opening, and sealing this opening with resin.
This is a method of manufacturing an electronic component, which includes a step of sealing the through hole by thermally welding a portion to be welded adjacent to the through hole.

Other features of the invention will become clear from the following description of embodiments with reference to the drawings.

-IJ Rokidan- Figures 3 and 4 are a sectional view and a bottom view for explaining an embodiment of the present invention, and Figure 3 is a view corresponding to Figure 2.

Manufacturing of the electronic component 1 of this embodiment is started by first housing the internal element 2 and the terminals 4, 5 in the case 3 consisting of an inner case 3a and an outer case 3b. A frontage 6 is formed in the outer case 3b to accommodate the internal element 2, and a through hole 8 is formed in the inner case 3a to prevent internal pressure fluctuations when the case frontage 6 is sealed with resin. has been done. A resin portion 11 to be welded is formed in the vicinity of the through hole 8, here around the through hole 8, and is of #R construction characteristic of the present invention. In addition, this part 1 to be welded
1 is formed in a shape that protrudes outward from the inner case 3a and surrounds the through hole 8 in the example shown in FIG. It does not matter, for example, it may be a protrusion C that contacts only a part of the N through hole 8.

Next, i? 7.Protruding end 118 of IF-Zubesa portion 11
Fill the space between the cases D 6 with the first sealing U (fat 7a) to the extent that the surface does not overlap. By heating and curing the sealing resin 7a, the sealing resin 7a and the outer case 3b are sealed. At this time, even if the pressure inside the case 3 increases due to the heating of the seal 11 and the fat 7a, the air inside the case 3 will easily flow out from the through hole 8 (C). Therefore, the first sealing resin 7a reliably comes into close contact with the outer case 3b, forming a complete seal.

Next, the protruding end portion 11a of the welded portion 11 is heated,
'rFJ'4 The through hole 8 is sealed by sealing the through hole 8. Since the through hole 8 is sealed integrally with the inner case 3a, the sealing strength of the through hole 80 is as shown in FIG. This is much larger than the conventional resin encapsulation shown in .

Next, as shown in FIG. 3, the second sealing resin 7b is filled into the case opening 6, that is, outside the first sealing resin 7a, and heated and heated. Thereby, the case opening 6 can be completely sealed, and the part 11 to be welded is hidden, so that the electronic component 1 with excellent appearance can be obtained.

In the manner described above, an electronic component 1, which is an example of the present invention, can be obtained, but the present invention is not limited to the embodiments described above. That is, the case 3 does not necessarily need to be composed of the inner case 3at3 and the outer case 3b, and can also be applied to a sealed electronic component consisting only of a heavy case. Further, the n-hole 8 and the portion 11 to be welded may be formed at any position on the case.

According to the present invention, a melting hole is provided near the through hole to prevent internal pressure fluctuations when sealing the front of the case with resin.
Since the resin part to be melted is formed and the through hole is sealed by welding of this resin part to be melted, the resin that seals the n through hole as in the past is sucked into the case or the case. It is possible to eliminate the bad shadows and poor appearance of internal elements caused by ejection to the outside. Also, V
Since each hole is sealed by thermal welding of 4] fat, it is extremely easy to create a strong seal. All the sealing resins you can use! ! ! 1lili
Since the molding process is carried out in a similar manner, a more reliable seal can be achieved and a highly reliable salt 7-1'II product can be obtained. It should be pointed out that all electronic components are required to be housed in a case and hermetically sealed.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an example of a conventional electronic component on which the present invention is based. FIG. 2 shows n − of FIG. 1.
It is a nm cross-sectional view. Figure 3 shows one example of this invention 11I.
I! 2 is a side view for explaining an example, and is a diagram corresponding to FIG. 2. FIG. Figure 4 shows the actual tI! shown in Figure 3! It is a bottom view of one example. DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Internal element, 3... Case, 6... Case opening, 7... Resin for sealing the case opening, 8... Through hole, 11... ...Fi should be served. -4: Figure 1 Figure 3 Figure 2 Centroid 4

Claims (2)

[Claims] (1) Comprising an internal element and a case having a frontage for housing the internal element, the case opening is sealed with resin, and a part of the case is provided with a case for sealing the case frontage with resin. A through hole is formed to prevent internal fluctuation, and the through hole is sealed after the case opening is sealed. A resin portion to be attached is formed, and the through hole is sealed by welding the resin portion to be attached. electronic components. (2) accommodating the internal element in a case formed with six holes having an opening for accommodating the internal element and a portion to be welded near the opening; sealing the opening with resin; and a step of welding a portion to be welded near the through hole to seal the n through hole.
Method of manufacturing electronic components.