JPS60200544A - Hybrid integrated circuit element - Google Patents

Abstract

PURPOSE:To increase the bonding strength of leads for externally connecting and to enhance the reliability of a hermetical seal by burying the lead in a part placing substrate to set the upper ends of the lead in the same surface as the substrate, and forming a structure that the surface of the part placing surface and the surface of the cap are bonded on the plane surface. CONSTITUTION:Externally connecting leads 3 are buried in a part placing substrate surface 12S, the upper end of the leads 3 is disposed in the same surface as the substrate 12, and the surface 12S and a cap 14 are planely bonded in the structure. As a method of forming such a substrate 12 has laminating many sheets formed with holes for burying the leads, a metallized layer of Mo-Mn is coated and annealed in the recess surface. Then, the leads 3 are brazed, and the entire surface is plated. Thus, since the leads 3 are brazed with the insulating substrate in three directions, the strength of the leads is remarkably increased, and hermetical sealing with high reliability can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a hybrid integrated circuit device, and particularly to a structure for making the circuit device highly reliable.

(bl Conventional technology and problems) Hybrid integrated circuit (hybrid IC) devices have a large number of active and passive elements arranged on an insulating substrate, and hybrid integrated circuits make up electronic circuits that are difficult to create using monolithic ICs. For example, high frequency amplification circuits such as microwaves and high frequency high output circuits are made of hybrid integrated circuits.

FIG. 1 shows an exploded perspective view of a high-frequency, high-output hybrid integrated circuit element, in which 1 is a copper plate for heat dissipation, 2 is a ceramic insulating substrate, 3 is an external connection lead, and 4 is a plastic cap. FIG. 1 shows the cap 4 immediately before it is bonded to the insulating substrate 2, and the periphery of the bottom surface of the cap 4 and the periphery of the surface of the insulating substrate 2 are bonded together with an adhesive to form an airtight seal. FIG. 2 shows a completed view of the cap 4 adhesively sealed with adhesive 5, and the diagram is cut along the edge 3 of FIG. 1.
FIG. Incidentally, the surface 2S of the insulating substrate 2 is the component mounting substrate surface, and the surface 2S is the component mounting substrate surface, and the surface 2S is the component mounting board surface.

Although many resistors are formed, these elements are not shown in the figure.

By the way, as shown in the figure, since the external connection lead 3 is soldered in a convex shape on the insulating substrate 2, a concave part is formed in the camp 4 to prevent the protrusion and the concavity. The structure is such that the mating parts are interlocked and the mating parts are glued together.

However, it is very difficult to bring such complex interlocking parts into contact and adhere them with an adhesive to hermetically seal and maintain the interior airtight for a long period of time. In addition, the camp required for this purpose requires complicated processing. Furthermore, since the external connection leads 3 are soldered only on the bottom surface, there is a drawback that the adhesive strength is weak and they are easily peeled off.

(C1 Object of the Invention) The present invention eliminates these drawbacks and proposes a hybrid integrated circuit element having a structure in which the adhesive strength of the leads is strong and the reliability of hermetic sealing is high.

(dl) Structure of the Invention The object is that an external connection lead is buried in the component mounting board surface, the upper end of the external connection lead is on the same surface as the component mounting board, and the component mounting board surface and the camping surface are connected to each other. This is accomplished by a hybrid integrated circuit element with a planar bonded structure.

tel　Embodiments of the invention An embodiment will be described in detail below with reference to one drawing.

FIG. 3 shows an exploded perspective view of the high-frequency, high-output hybrid integrated circuit element according to the present invention, in which 1 is a copper plate for heat dissipation, 12 is a ceramic insulating substrate, 3 is a lead for external connection, and 14 is a camp. This figure shows the state immediately before adhesion as in FIG. 1, and FIG. 4 shows the BB sectional view of FIG. 3 after adhesive sealing. Note that the surface 1 of the insulating substrate 12
2S is the component mounting board surface.

As shown in the figure, the external connection lead 3 is buried in the ceramic insulating substrate 12, the top surface of the external connection lead 3 is on the same plane as the insulating substrate 12, and the bonding surface is flattened. Therefore, the bottom surface of the camper 4 is also flat so that both can come into contact with each other in a flat manner. Therefore, the adhesive 5
When bonded, the contact condition of the contact surfaces is extremely good, the adhesive force is strong, the hermetic seal can be maintained for a long period of time, and its reliability can be improved.

The method for forming such a ceramic insulating substrate 12 is to stack a number of sheets in which holes are formed to fill the leads in advance when creating a green sheet (green sheet), and then apply a metallized layer such as Mo-Mn to the inner surface of the recess. and fire. Next, external connection leads 3 are brazed and the entire surface is plated. The firing and plating of this metallized layer are performed at the same time as the metallized layer (conductor layer) on the surface of the insulating substrate 12 and its plating.

In this way, the external connection leads 3 are brazed to the insulating substrate on three sides, so that the strength of the leads is significantly strengthened.

Moreover, as described above, highly reliable hermetic sealing is achieved.

Figure 5 is a partial view showing another example of the shape of the external connection lead to further strengthen the lead strength.
This is an example of a lead 23 that is strong against pulling force.

(fl Effects of the Invention As is clear from the above explanation, according to the present invention, a highly reliable hermetic seal can be obtained, and the strength of the external connection lead is extremely strong, improving the quality of the hybrid integrated circuit element. There is a noticeable improvement effect.

Although the above example has been explained using a hybrid integrated circuit element for a high-frequency, high-output circuit, it is of course applicable to other types of integrated circuit elements.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a conventional high-frequency, high-output hybrid integrated circuit device, FIG. 2 is an AA sectional view after sealing, FIG. 3 is an exploded perspective view of a hybrid integrated circuit device according to the present invention, and FIG. The figure is a BB sectional view after sealing, and FIG. 5 is a partial view showing another lead shape according to the present invention. In the figure, 1 is a copper plate, 2.12 is an insulating substrate, 3.13°23
1 is a lead for external connection, 4.14 is a cap, 5 is an adhesive, 2S, and 125 is a component mounting board surface.

Claims (1)

[Claims] The external connection lead is buried in the surface of the component mounting board, the upper end of the external connection lead is on the same surface as the component mounting board, and the component mounting board surface and the cap surface are bonded together in a plane. A hybrid integrated circuit device comprising: