JPS60201910A - Molding die - Google Patents
Molding dieInfo
- Publication number
- JPS60201910A JPS60201910A JP59060251A JP6025184A JPS60201910A JP S60201910 A JPS60201910 A JP S60201910A JP 59060251 A JP59060251 A JP 59060251A JP 6025184 A JP6025184 A JP 6025184A JP S60201910 A JPS60201910 A JP S60201910A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- release agent
- molding die
- molding
- mold releasing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 35
- 239000006082 mold release agent Substances 0.000 claims description 35
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 7
- 238000005323 electroforming Methods 0.000 claims description 5
- 230000007423 decrease Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 12
- 230000003578 releasing effect Effects 0.000 abstract 10
- 238000002386 leaching Methods 0.000 abstract 5
- 238000007747 plating Methods 0.000 description 36
- 239000000243 solution Substances 0.000 description 11
- 239000007788 liquid Substances 0.000 description 4
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
技術分野
この発明は成形用金型に係シ、よシ詳細には成形型に通
孔を設け、同通孔を通して離型剤が成形゛型表面に滲出
され得る成形用金型に関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a mold for molding, and more particularly to a molding tool in which a through hole is provided in the mold, and a mold release agent can be exuded onto the surface of the mold through the through hole. This relates to molds for use.
従来技術
一般に、射出成形は金型内に合成樹脂やゴム等の材料を
注入口て所望の形状に仕上げるものであるが、例えばウ
レタン等、剥離性の悪い材料を使用して成形加工を行う
ときは成形後、被成形物が金型の成形型表面に接着した
状態になＶ、被成形。Conventional technology In general, injection molding involves injecting a material such as synthetic resin or rubber into a mold to form a desired shape. After molding, the object to be molded is in a state in which it is adhered to the mold surface of the mold V, to be molded.
物が金型から取シ外される際に形状が損われることがあ
る。この傾向はリム成形、ブロー成形等、他の成形方法
においても同様である。The shape may be lost when the object is removed from the mold. This tendency is the same in other molding methods such as rim molding and blow molding.
従って、剥離性の悪い材料にて成形加工を行うにあたっ
ては、成形型表面に予め離型剤を塗布しておき、成形後
に被成形物を取り出すことを容易にしておく必要があり
、準備作業が煩雑であるという問題点がある。Therefore, when molding a material with poor releasability, it is necessary to apply a mold release agent to the surface of the mold in advance to make it easier to take out the molded object after molding, which reduces the preparation work. The problem is that it is complicated.
発明の目的
この発明は前記した問題点を解消するためになされたも
のであって、その目的は剥離性の悪い材料を使用して成
形を行う場合でも、まえもって、金型の成形型表面に離
型剤を塗布する必要がなく、従って面倒な準備作業全必
要としない成形用金型全提供するにある。Purpose of the Invention The present invention has been made to solve the above-mentioned problems, and its purpose is to prevent release on the mold surface of the mold in advance even when molding is performed using a material with poor releasability. To provide a complete molding die that does not require the application of a molding agent and therefore does not require any troublesome preparation work.
発明の構成
この発明は上述した目的を連成するために、成形型に多
数個の通孔を透設するとともに１．成形型の裏面には離
型剤供給手段によってｌｌＩ＃型剤が含浸され、かつ通
孔を経て成形型の表面に離型剤を滲出させるための離型
剤滲出部材を設けたものである。Structure of the Invention In order to achieve the above-mentioned objects, the present invention provides a mold with a large number of through holes and 1. The back surface of the mold is impregnated with a lllI# type agent by a mold release agent supply means, and a release agent exuding member is provided for exuding the mold release agent onto the surface of the mold through a through hole.
実施例
以下この発明を具体化した一実施例全図面に従って説明
する。EXAMPLE An example embodying the present invention will be described below with reference to all the drawings.
１はステアリングホイール成形用の金型全体を示し、上
型本体１ａと下型本体１ｂがらなっている。なお、上型
本体１ａ及び下型本体１ｂＨそれぞれの構成がまったく
同一であるため、本実施例においては便宜上、下型本体
１ｂについてのみ説明する。Reference numeral 1 denotes the entire mold for molding a steering wheel, which consists of an upper mold body 1a and a lower mold body 1b. Note that, since the configurations of the upper mold body 1a and the lower mold body 1bH are completely the same, in this embodiment, for convenience, only the lower mold body 1b will be described.
２は下型本体１ｂの成形型であって、断面形状は半円弧
状（第１図参照）をなすとともに、平面形状は円環状（
第２図参照）をなしている。この成形型２は後記する電
鋳法によって下型本体１ｂとは別体に形成され、その表
面が下型本体１ｂの上面から露出するように下型本体１
ｂに固着されている。３は同成形型２に透設した多数個
の通孔であって、なお、通孔３はその径が、成形型２の
外面から内面に向って徐々に小さくなるように形成され
、その最大径が約０．１〜０．２ ＊ｙ＋’、また最小
径は特に定められるものではなく、後記する離型剤を通
過させる大きさならば細いほど好ましい。Reference numeral 2 designates a mold for the lower mold body 1b, which has a semicircular cross-sectional shape (see Fig. 1) and an annular planar shape (see Fig. 1).
(see Figure 2). This mold 2 is formed separately from the lower mold body 1b by an electroforming method to be described later, and the lower mold body 1 is formed so that its surface is exposed from the upper surface of the lower mold body 1b.
It is fixed to b. Reference numeral 3 indicates a large number of through holes formed through the mold 2, and the diameter of the through holes 3 gradually decreases from the outer surface to the inner surface of the mold 2. The diameter is approximately 0.1 to 0.2 *y+', and the minimum diameter is not particularly determined, but the smaller the diameter is, the more preferable it is, as long as it is large enough to allow the release agent to be described later to pass through.
さらに、この種の金型では通孔３の径を小さくして、個
数を多くすれば成形加工は容易に行われる。Furthermore, in this type of mold, if the diameter of the through holes 3 is made small and the number of through holes 3 is increased, the molding process can be easily performed.
４は下型本体１ｂ内において、成形型２の裏面に沿って
配置し、た離型剤滲出部材であって、スポンジ、海綿等
の吸湿性の高い材料にて形成されている。なお、この離
型剤滲出部材４は後記する離型剤が含浸されるものであ
り、第２図に示すように、金属板等にて円環ドラム状に
形成した保持部Ｕ’５ＦＩＫ収納されている。６は同保
持部制５の上面において成形型２と対応するように円環
状に形成した開口部であって、その両局縁部が成形型２
の両局縁部に固着されておシ、保持部材５は上面が下型
本体１ｂから露出した状態で、成形型２に刻して移動不
能に取シ付けられている。Reference numeral 4 denotes a release agent exuding member disposed along the back surface of the mold 2 in the lower mold body 1b, and is made of a highly hygroscopic material such as sponge or sponge. The release agent exuding member 4 is impregnated with a release agent to be described later, and as shown in FIG. ing. Reference numeral 6 denotes an annular opening formed on the upper surface of the holding member 5 so as to correspond to the mold 2, and both edges thereof
The holding member 5 is immovably attached to the mold 2 with its upper surface exposed from the lower mold body 1b.
γは前記保持部材５から下型本体１ｂを貫通して外方に
延びる供給パイプであって、同供給パイプ７０基端は保
持部材５内において離型剤滲出部材４に連通されるとと
もに、先端は下型本体１１）外において供給ポンプ８を
介して、貯溜槽９に連結されている。γ is a supply pipe extending outward from the holding member 5 through the lower mold main body 1b, the base end of the supply pipe 70 is communicated with the release agent exuding member 4 within the holding member 5, and the tip is connected to a storage tank 9 via a supply pump 8 outside the lower mold body 11).
なお、貯溜槽９内にはシリコンオイル、液状天然ワック
ス、液状合成ワックス等の液状の離型剤が貯溜されてい
る。そして、この貯溜槽９は口１１記供給パイプ７及び
供給ポンプ８とともに、離型剤金離型剤滲出部材４へと
供給するための離型剤供給手段を形成している。Note that a liquid mold release agent such as silicone oil, liquid natural wax, liquid synthetic wax, etc. is stored in the storage tank 9. The storage tank 9, together with the supply pipe 7 and the supply pump 8, form a mold release agent supply means for supplying the mold release agent to the mold release agent exuding member 4.
次に、成形型２を製造する電鋳方法について以下述べる
に先たち、通常の電鋳方法について説明するが、ここで
は電鋳全広義の意味でメッキと称する。Next, the electroforming method for manufacturing the mold 2 will be described below. First, a normal electroforming method will be described, but here, electroforming is referred to as plating in a broad sense.
一般にメッキ方法は、メッキが施されるメッキ累祠に電
導性付与塗膜、例えはベーヌト状−−ラッカーと酢酸ブ
チル用液を混合して形成したスプレー液を噴射してメッ
キ素相に電導性を付与したのち、純水に塩酸、塩化第１
スズを混入して形成した前処理液をはけ等にて塗布し、
メッキ素材の表面を活性化させてピンホールの発生を防
止するための前処理を行っている。In general, the plating method involves spraying a coating film that imparts electrical conductivity, for example a spray solution formed by mixing a lacquer and a butyl acetate solution, onto the plating layer to make the plating element conductive. After adding hydrochloric acid to pure water,
Apply a pre-treatment liquid mixed with tin with a brush, etc.
Pretreatment is performed to activate the surface of the plating material and prevent pinholes from forming.
また、メッキ液はヌルファミン酸ニッケル液、Ｂ’ｆＪ
酸を混合したのち、表面活性添加剤として、例えば少量
のラウリル硫酸ナトリウムを添加して形成している。こ
のラウリル硫酸ナトリウムはメッキ加工時において、メ
ッキ素材表面上のメッキ層にピンホールが発生すること
を防止するものである。In addition, the plating solution is nickel nurfamate solution, B'fJ
After mixing the acids, a surface-active additive, for example a small amount of sodium lauryl sulfate, is added. This sodium lauryl sulfate prevents pinholes from forming in the plating layer on the surface of the plating material during plating.
このあと、メッキ液槽内に貯留したメッキ液中にメッキ
材料及びメッキ素材を浸し、メッキ液を循環させるとと
もにカソードロッカー全作動させ、さらにメッキ素材を
メッキ液中で移動させてピンホールの発生を防止しなが
らメッキ材料及びメッキ素材の間に、メッキ素材１００
ｃｄについて０．６Ａの電流を３〜４時間流してメッキ
素材の表面全体にメッキ層が付着するようにしている。After this, the plating material and the plating material are immersed in the plating solution stored in the plating solution tank, the plating solution is circulated, the cathode locker is fully activated, and the plating material is moved in the plating solution to prevent pinholes from forming. Plating material 100 between the plating material and the plating material while preventing
For cd, a current of 0.6 A is passed for 3 to 4 hours so that a plating layer is deposited on the entire surface of the plating material.
メッキ層が付着されたのを確認したのち、電流をメッキ
素材１００ｏＪ［プいて１〜２人に変換して、メッキ層
が平滑になるようにメッキ加工を続けて、所望の形状に
仕上げ、さら゛にメッキ素材とメッキ層とを分離して成
形型２が形成される。なお、電流を上記の値Ｉよシ強く
するとメッキ素材の表面にはピンホールが発生する。After confirming that the plating layer has been deposited, apply a current of 100oJ to the plating material and use one or two people to continue plating so that the plating layer is smooth, finish it in the desired shape, and then Then, a mold 2 is formed by separating the plating material and the plating layer. Note that if the current is made stronger than the above value I, pinholes will be generated on the surface of the plating material.
上記したメッキ法においては成形型２にピンホールの発
生を防止しているがこの発明では、下記の方法によって
、ピンホールの発生を促進して、このピンホール全通孔
３へと成長させるようにしたものである。すなわち、
（１） メッキ液に、例えばラウリル硫酸ナトリウム等
の表面活性添加剤を添加しない。In the above-mentioned plating method, the generation of pinholes in the mold 2 is prevented, but in this invention, the generation of pinholes is promoted by the method described below, and the pinholes grow into full-through holes 3. This is what I did. That is, (1) Do not add surface active additives such as sodium lauryl sulfate to the plating solution.
（２）メッキ加工前に、メッキ素材に対して塩化ビニル
等の絶縁物質を混入したラッカー液を噴射して約１５μ
ｍＯり層を形成し、メッキ累材表面の通電性を低下させ
る。(2) Before plating, spray a lacquer solution mixed with an insulating material such as vinyl chloride onto the plating material to approximately 15 μm.
Forms a mO layer and reduces the electrical conductivity of the surface of the plated composite material.
（３） メッキ素材：、の前処理において、前処ｌＢ１
！数を使用しない。(3) Plating material: In the pretreatment of , pretreatment lB1
! Don't use numbers.
（４） メッキ時において、メッキ液 を循環させず、
さらにカソードロッカー４も静圧状態にしておく。(4) During plating, do not circulate the plating solution.
Further, the cathode locker 4 is also kept in a static pressure state.
（５） メッキ時に通常よシ強い電流を流す。(5) A stronger current than usual is passed during plating.
ことによって行なわれるが、このうち少なくとも１つの
方法のみによって、成形型２に通孔３を形成することは
可能である。However, it is possible to form the through hole 3 in the mold 2 using at least one of these methods.
さて、上記のように構成した成形用金型の使用方法を以
下に述べる。Now, how to use the molding die configured as described above will be described below.
まず、供給ポンプ８を作動させ、貯溜槽９内のＫＷ型剤
を供給パイプ７を経て離型剤滲出部材４へ送シ、同離型
剤滲出部材４に離型剤を保持し得るだけ含浸させる。次
に、再び供給ポンプ８を弱く作動させて、微量の離型剤
金離型剤滲出部材４に送ると同時に、離型剤滲出部材４
に含浸された離型剤に微圧を加えると離型剤は離型剤滲
出部材４から滲み出る。この滲み出た離型剤は成形型２
の通孔３内へ上官現象及びこれを促す圧力によって進入
し、成形型２０表面に達する。従って、成形型２の表面
は離型剤が塗布されたのと同じ状態となる。なお、前述
したように通孔３は成形型の外面はど径が大きくなって
いるので、離型剤が通孔３内に進入するとき受ける流動
抵抗は非ｗＪに小さい。First, the supply pump 8 is activated to send the KW molding agent in the storage tank 9 to the mold release agent exuding member 4 through the supply pipe 7, and the mold release agent exuding member 4 is impregnated with enough mold release agent to hold the mold release agent. let Next, the supply pump 8 is operated weakly again to send a small amount of the mold release agent to the mold release agent exuding member 4.
When a slight pressure is applied to the mold release agent impregnated with the mold release agent, the mold release agent oozes out from the mold release agent exuding member 4. This oozing mold release agent is applied to the mold 2.
The mold enters into the through hole 3 due to the superior phenomenon and the pressure that promotes this, and reaches the surface of the mold 20. Therefore, the surface of the mold 2 is in the same state as if the mold release agent had been applied. Note that, as described above, since the diameter of the through hole 3 on the outer surface of the mold is large, the flow resistance that the mold release agent receives when it enters the through hole 3 is extremely small.
離型剤が成形型２の表面全体に滲み出たら、剥離性の悪
い材料にて成形加工を行っても被成形物は成形型２から
容易に剥離される。このように金型１を使用すれば、被
成形物の材質に応じて所望量の離型剤を成形型２に滲出
させることが可能である。Once the mold release agent oozes out over the entire surface of the mold 2, the molded object can be easily peeled off from the mold 2 even if molding is performed using a material with poor releasability. By using the mold 1 in this way, it is possible to exude a desired amount of mold release agent into the mold 2 depending on the material of the object to be molded.
なお、この金型１にて一度成形加工を行ったあとは、微
量の離型剤を離型剤滲出部材４に送れば、離型剤が成形
型２の表面に滲み出るため、金型１の再度の使用に備え
ることができる。Note that once the molding process is performed using this mold 1, if a small amount of mold release agent is sent to the mold release agent exuding member 4, the mold release agent oozes out onto the surface of the mold 2, so that the mold 1 can be prepared for reuse.
また、図面においては、供給パイプ８を１個のみ図示し
たが、離型剤滲出部材４に離型剤が均等に含浸されるた
めには、供給パイプ８は等距離を置いて複数本配設され
ることが望ましい。In addition, although only one supply pipe 8 is shown in the drawing, in order to uniformly impregnate the release agent into the release agent exuding member 4, a plurality of supply pipes 8 are arranged at equal distances. It is desirable that
また、前述したように、金型１の上型本体１ａと下型本
体１ｂとは全く同一の構成であるため、上型本体１ａも
下型本体１ｂと同じ方法で使用されるものである。Further, as described above, the upper mold body 1a and the lower mold body 1b of the mold 1 have exactly the same configuration, so the upper mold body 1a is used in the same manner as the lower mold body 1b.
なお、この発明は前記実施例に拘束されるものではなく
、例えば成形型２を被成形物の形状に応じて他の形にし
たり、成形型２を鋳造、切削加工等にて形成したシ、通
孔３をレーザー光線、先端の直径が細い錐等で穿孔する
か、又はポーラス生成法等によって透設するなど、発明
の趣旨から逸脱しない限りにおいて任意の変更は可能で
ある。It should be noted that the present invention is not limited to the above-mentioned embodiments; for example, the mold 2 may be formed into a different shape depending on the shape of the object to be molded, or the mold 2 may be formed by casting, cutting, etc. Any changes can be made without departing from the spirit of the invention, such as by drilling the through hole 3 with a laser beam, a cone with a narrow tip diameter, or by creating a porosity.
発明の効果
以上詳述したように、この発明は成形型に複数個の通孔
を透設するとともに、成形型の裏面には離型剤供給手段
によって離型剤を含浸し、かつ通孔全組て成形型の表面
に離型剤を滲出させるための離型剤滲出部杓を設けたこ
とによって、剥離性の悪い材料を使用して成形を行う時
でも、まえもって、金型の成形型表面に離型剤を壁布す
る必要がなく、従って面倒な準備作業を必要としないと
いう優れた効果を奏する。Effects of the Invention As detailed above, this invention provides a mold with a plurality of through holes, the back surface of the mold is impregnated with a mold release agent by a mold release agent supplying means, and all of the through holes are impregnated with a mold release agent. By providing a mold release agent exuding part ladle for exuding mold release agent on the surface of the assembled mold, even when molding is performed using a material with poor releasability, the mold surface of the mold can be removed in advance. There is no need to apply a mold release agent to the surface of the mold, and therefore there is no need for troublesome preparation work, which is an excellent effect.
図面中、第１図はこの発明の成形用金型を具体化して示
す断Ｉｊ図、第２図は下型の要部を示す斜視図である。
成形型２、通孔３、離型剤滲出ｇ１５月４、供給パイプ
７、供給ポンプ８、貯溜槽９（前記供給パイプ７、供給
ポンプ８及び貯溜槽９によって前型剤供給手段が形成さ
れている）。
特許出願人 江南特殊産業株式会社
代 理 人 弁理士 恩 １）傅 宣In the drawings, FIG. 1 is a cross-sectional view Ij showing an embodiment of the molding die of the present invention, and FIG. 2 is a perspective view showing the main parts of the lower mold. Molding mold 2, through hole 3, release agent exudation month 4, supply pipe 7, supply pump 8, storage tank 9 (the supply pipe 7, supply pump 8, and storage tank 9 form a mold agent supply means) ). Patent applicant: Jiangnan Special Industries Co., Ltd. Agent: Patent attorney Un 1) Fu Xuan
Claims (1)
もに、成形型（２）の裏面には離型剤供給手段（７，８
，９）によって離型剤が含浸され、かつ通孔（３）を経
て成形型（２）の表面に離型剤を滲出させるための離型
剤滲出部材（４）を設けた。ことを特徴とする成形用金
型。 ２、ＷＵ記離型剤滲出部材（４）は吸湿性の高い側斜に
て形成されていることを特徴とする特許請求の範囲第１
項に記載の成形用金型。 ３、前記離型剤滲出部材（４）は金属板等にてほば環状
に形成した保持部材（５）Ｆ’ｊに収納されていること
を特徴とする特許請求の範囲第１項もしくは第２項に記
載の成形用金型。 ４ 前記離型剤供給手段はａ型剤滲出部材（４）に連通
された供給パイプ（７）と、同供給パイプ（７）に取シ
付けられた供給ポンプ（８）と、同供給ポンプ（８）を
介して供給パイプ（７）に連給された離型剤を貯溜する
ための貯溜槽（９）とからなることを特徴とする特許請
求の範囲第１項に記載の゛成形用金型。 ５、前記成形型（２）は電鋳にて形成されていることを
特徴とする特許請求の範囲第１項に記載の成形用金型。 ６、 前記通孔（３）はその径が、成形型（２）の外面
から内面に向って漸減していることを特徴とする特許請
求の範囲第１項に記載の成形用金型。[Claims] 1. A large number of through holes (3) are provided in the mold (2), and release agent supply means (7, 8) are provided on the back surface of the mold (2).
. A mold for molding characterized by: 2. Claim 1, characterized in that the WU mold release agent exuding member (4) is formed with side slopes having high hygroscopicity.
The mold for molding described in section. 3. The release agent exuding member (4) is housed in a holding member (5) F'j formed of a metal plate or the like in a nearly annular shape. The mold for forming according to item 2. 4. The release agent supply means includes a supply pipe (7) connected to the A-type agent exuding member (4), a supply pump (8) attached to the supply pipe (7), and a supply pump ( 8), and a storage tank (9) for storing a mold release agent continuously supplied to the supply pipe (7) through a mold release agent. Type. 5. The molding die according to claim 1, wherein the molding die (2) is formed by electroforming. 6. The molding die according to claim 1, wherein the diameter of the through hole (3) gradually decreases from the outer surface to the inner surface of the mold (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59060251A JPS60201910A (en) | 1984-03-27 | 1984-03-27 | Molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59060251A JPS60201910A (en) | 1984-03-27 | 1984-03-27 | Molding die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201910A true JPS60201910A (en) | 1985-10-12 |
| JPH0232125B2 JPH0232125B2 (en) | 1990-07-18 |
Family
ID=13136767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59060251A Granted JPS60201910A (en) | 1984-03-27 | 1984-03-27 | Molding die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201910A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01216380A (en) * | 1988-02-24 | 1989-08-30 | Nec Corp | Electrophotographic recorder |
| JPH01145412U (en) * | 1988-03-30 | 1989-10-05 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5712607A (en) * | 1980-06-27 | 1982-01-22 | Hitachi Ltd | Metallic mold for resin |
-
1984
- 1984-03-27 JP JP59060251A patent/JPS60201910A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5712607A (en) * | 1980-06-27 | 1982-01-22 | Hitachi Ltd | Metallic mold for resin |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01216380A (en) * | 1988-02-24 | 1989-08-30 | Nec Corp | Electrophotographic recorder |
| JPH01145412U (en) * | 1988-03-30 | 1989-10-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0232125B2 (en) | 1990-07-18 |
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