JPS6021379A - Vacuum deposition apparatus - Google Patents
Vacuum deposition apparatusInfo
- Publication number
- JPS6021379A JPS6021379A JP12945683A JP12945683A JPS6021379A JP S6021379 A JPS6021379 A JP S6021379A JP 12945683 A JP12945683 A JP 12945683A JP 12945683 A JP12945683 A JP 12945683A JP S6021379 A JPS6021379 A JP S6021379A
- Authority
- JP
- Japan
- Prior art keywords
- vapor
- channel
- plate
- bath
- steam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
の均一化を図９、しかも＃ｉＵ Ｍ制御の容易な真空蒸
着装置に関するものでちる。DETAILED DESCRIPTION OF THE INVENTION The uniformity of #iU is shown in FIG. 9, which relates to a vacuum evaporation apparatus that is easy to control.
従来の連続真空蒸着用の僧の形状１ｒｌｌを第１図←）
〜（Ｃ）に示す。Figure 1 shows the monk shape 1rll for conventional continuous vacuum deposition ←)
- Shown in (C).
蒸着槽は、溶解した金属の蒸気を真空条件下で湯１から
発生させる浴槽２と、その蒸気を板７まで導くダクト（
′ｆチャンネル６から構成されている。板７に蒸着する
蒸気流量は浴槽内のヒーター電力とシャッタ５の開孔面
積で制御している。The vapor deposition tank consists of a bathtub 2 that generates vapor of molten metal from hot water 1 under vacuum conditions, and a duct (
'f channel 6. The flow rate of vapor deposited on the plate 7 is controlled by the heater power in the bathtub and the aperture area of the shutter 5.
チャンネル６は板が垂直に走るか水平に走るかによって
、第１図に）、（Ｂ）に示す垂直ライン、あるいは第１
図（Ｃ）に示す水平ラインという形状になっている。な
お、第１図（Ａ） （ｂ）は第１図（Ａ）（ａ）の斜視
図である。Depending on whether the board runs vertically or horizontally, the channel 6 may be a vertical line as shown in Figure 1) or (B), or a vertical line as shown in Figure 1 (B).
It has the shape of a horizontal line as shown in Figure (C). Note that FIG. 1(A)(b) is a perspective view of FIG. 1(A)(a).
蒸気流量をｉｉＩＩｌ．ｌｉｉｌ−ｊ−るソヤッタ５は
、開孔面積を変えるため、バタフライ弁タイプ〔第１図
に）。The steam flow rate is iiiI. The soyatter 5 has a butterfly valve type (see Figure 1) to change the opening area.
（Ｃ）のシャッタ」あるいはスライド式〔第１図（Ｂ）
）のものが使われている。シャッタの開孔面積の変化は
バタフライ弁タイプでは蝶番形の軸受け６、スライド式
ではビニオンラック式３のもので操作されている。適格
シャッタ５には蒸気の凝固を防ぐためのヒーター４が備
えつけられている。(C) shutter” or sliding type [Figure 1 (B)
) are used. Changes in the aperture area of the shutter are controlled by a hinge-shaped bearing 6 in the butterfly valve type and by a binion rack type 3 in the slide type. The qualified shutter 5 is equipped with a heater 4 to prevent steam from solidifying.
、従来の蒸着槽では次の理由で蒸気の板幅方向の流速分
布（板に蒸着する全屈蒸気の幅方向分布）の制御が峻し
くなることが懸念されていた。In conventional vapor deposition tanks, there has been concern that the control of the flow velocity distribution of steam in the width direction of the plate (widthwise distribution of the total deflection vapor deposited on the plate) will be difficult for the following reasons.
バタフライ弁タイプあるい祉スライド式のシャッタ両者
ともに、蒸気の流れは蒸Ｍｉ４から垂直に流出しその方
向はチャンネル６内で様々な方向となっている。このた
めに、蒸気の整流効果が十分でなく板７０幅方向に蒸着
量の不均一な分布が出やすいことが（鰻念される。通當
、チ）・ンイ、ル６内での圧力は１０−２’ｌ’ｏｒｒ
〜１０−’ＴｏｒｒとＩ！Ｘ：＜、？Ａ気の平均自由
行程（金属蒸気分子同志が衝突う゛る半均距離）が長く
なるため、チャンネル６内で整流を行うためにはチャン
ネル６の長さを十分に長くとることが必要となる。とこ
ろが、実際問題としてチャンネル６の長さを長ぐするこ
とは材料、ヒータ取付けのためコスト高となるため望ま
しくない。In both the butterfly valve type and the slide type shutter, the steam flow exits the steam Mi4 vertically and its direction varies within the channel 6. For this reason, the steam rectification effect is not sufficient and the amount of vapor deposited tends to be unevenly distributed in the width direction of the plate 70. 10-2'l'orr
~10-'Torr and I! X: <,? Since the mean free path of the A gas (the semiuniform distance along which metal vapor molecules collide with each other) becomes long, it is necessary to make the length of the channel 6 sufficiently long in order to perform rectification within the channel 6. However, as a practical matter, increasing the length of the channel 6 is not desirable because it increases the cost of materials and heater installation.
本発明は、従来の真空蒸着用の槽において、板の１１１
１方向の蒸気流速分布の均一化−−チャンネル内の短か
い距離で整流を行うｍ−の改善を河すること金目的とし
てなされたものである。In the conventional vacuum deposition tank, the present invention provides the following advantages:
This was done for the purpose of improving the uniformity of the steam velocity distribution in one direction--improvement of rectification over a short distance within the channel.
ところで、上述の従来の真空蒸着用の槽では上面８から
の蒸気の拡がり、あるいは縮少が影響して膜厚分布の不
均一を生じることが考えられる。例えば、第２図に）に
示すように蒸着槽の上面８の開孔ａが板７の幅Ｗよフ小
さい場合（ａ （ｗ ）には板７の両端部の膜厚が薄く
なシ、一方第２図の）に示すように逆の場合〔上面８の
開孔ａが板幅Ｗより大きい場合（ａ＞ｗ））には板７の
両端の膜厚が厚くなることが１−念される。By the way, in the above-mentioned conventional vacuum deposition tank, it is conceivable that the spread or contraction of vapor from the upper surface 8 may cause non-uniform film thickness distribution. For example, as shown in Fig. 2), if the aperture a on the top surface 8 of the vapor deposition tank is smaller than the width W of the plate 7 (a (w )), the film thickness at both ends of the plate 7 is thinner. On the other hand, as shown in Fig. 2), in the opposite case [when the aperture a on the top surface 8 is larger than the plate width W (a>w)], the film thickness at both ends of the plate 7 becomes thicker. be done.
ヤこで本発明では、板１酩に応しでチャンネル内で十分
にｍ流を行９ためｌＡｆチャンネル内に蒸気流れ制御用
ガイド【設け０゜カイト出口には可変カイトを設は板幅
に合せてその一度を決めることができるようにする。流
量制御は浴槽の上面にスライド式のンヤツタあるいは回
転角度と流量の関係が把握しやすいバタフライタイプの
ンヤツタを置いて行うようにする真空蒸着装置を提供す
るものである。Therefore, in the present invention, a guide for steam flow control is provided in the lAf channel and a variable kite is provided at the kite outlet to control the steam flow in order to sufficiently generate m flow in the channel according to the plate width. Let's make it possible to decide on that one time together. The purpose of the present invention is to provide a vacuum evaporation apparatus in which the flow rate is controlled by placing a sliding type yatch or a butterfly type yatch on the top surface of the bathtub, which makes it easy to grasp the relationship between the rotation angle and the flow rate.
第６図（４）、＜１３）は本発明装置の一実施態様例を
示す図で、第６図（ト）は断面図、第６１惺）は平面図
である。FIG. 6(4), <13) is a diagram showing an embodiment of the apparatus of the present invention, FIG. 6(g) is a sectional view, and FIG. 61) is a plan view.
第６図に）、 （Ｂ）において、蒸発は従来と同じく浴
槽２の湯１の表面から起こる。浴槽２の上面８は従来の
通９となっている。本発明の構成では、タクトのガイド
部９をｅ Ｉｆｆ、し、該ガイド部９に取付けられた可
変ガイド１０がチャンネル内１」１１の外の板７０幅に
対して蒸気を均一に流すことが操作可能に配置されてい
る。蒸気流石： ”ｔ １ｌｉｌｌ （＋！ｉｆ する
ためにバタフライ弁弐ンヤツタ５、該シャッタ５への蒸
気（＝Ｊ着防止のためのヒータ４及びシャックの駆動機
構３が従来通ｐに設置さＪしている。第６図に示すチャ
ンネル６は従来と回じ形状で８９、垂直ラインに対する
ものとなっている。従って、蒸気はチャノ不ル出口１１
を辿υ、板７に蒸／？！ｊされることになる。可変ガイ
ド１０及びシャック５の駆動軸１ ’Ｏａおよび３υは
、手！ＵＩＩ又は適宜手段によυ回動される。In FIGS. 6) and (B), evaporation occurs from the surface of the hot water 1 in the bathtub 2, as in the conventional case. The upper surface 8 of the bathtub 2 has a conventional opening 9. In the configuration of the present invention, the guide part 9 of the tact is set to e If, and the variable guide 10 attached to the guide part 9 allows steam to flow uniformly over the width of the plate 70 outside the channel 1'' 11. placed in an operable manner. As expected of steam: ``t1lill (+!If the butterfly valve 2 Yatsuta 5, the steam to the shutter 5 (= the heater 4 to prevent J adhesion and the drive mechanism 3 of the shack are installed in the conventional p) The channel 6 shown in FIG.
Tracing υ, steaming to board 7/? ! j will be done. The drive shafts 1'Oa and 3υ of the variable guide 10 and the shack 5 are connected by hand! It is rotated υ by UII or appropriate means.
−ｈ記のように４７’）成される本発明装置面において
Ｑ、Ｌ、次の作用がある。Q, L, the following effects are achieved in the apparatus of the present invention as described in 47').
タクトのカイト９とｂＩ変ガイド１０を浴槽２の上面８
に設けでいる／こめに、蒸気の流れは第４図にｌｊ＜ず
ようにすることができる。すなわち、■４図ｅこおいて
、ガイド内でのｚ・（気分子のお互いの衝突の頻度が多
くなり、蒸気の流れの均一化を計る作用ｔもたらすこと
が可能となっている。また、蒸気の出口の幅を板７の幅
と同じくすることがでさ、チャンネル内の圧力が１０−
２〜１０−’ Ｔｏｒｒなのでカイト通過後の流れは均
一化したままに保つことができる。Tact's kite 9 and bI change guide 10 are attached to the top surface 8 of the bathtub 2.
In this case, the flow of steam can be as shown in FIG. In other words, as shown in Fig. 4 (e), the frequency of collisions of gas molecules with each other within the guide increases, and it becomes possible to bring about an effect that equalizes the flow of steam.Also, By making the width of the steam outlet the same as the width of plate 7, the pressure in the channel is 10-
Since it is 2 to 10-' Torr, the flow after passing the kite can be kept uniform.
一方、従来の蒸着槽であれは、例えば第１図に）に示す
シャッタを用いると、開展が小さい場合には本発明と同
じ効果が期待できるが、シャック開度を大きくすると蒸
気の流れはランダムな方向に流れ、特にンヤッタの両→
ノイドがらもれる蒸気址が増えてチャンネル出口方向で
も是流されないまま板に蒸着することになり、膜厚の幅
方向に不均一な分布がでさる恐れがるる。On the other hand, in a conventional vapor deposition tank, if the shutter shown in Fig. 1 is used, the same effect as the present invention can be expected if the opening is small, but if the opening of the shack is large, the flow of steam will be random. It flows in the direction of
The amount of vapor leaking from the noids increases and is deposited on the plate without being flowed away even in the direction of the channel exit, which may result in uneven distribution of film thickness in the width direction.
以上詳述したよりに、不発ゆｊの主旨は、浴槽出口にガ
イドを設けその幅方向を調虹できるようにした点にある
。従って、この主旨に外れない機構、例えば流蓋制岬用
シャッタをスライド式としたもの等も考えられる。As detailed above, the gist of the misfired bathtub is that a guide is provided at the bathtub outlet so that the rainbow can be adjusted in the width direction. Therefore, it is also possible to consider a mechanism that does not deviate from this principle, such as a mechanism in which the shutter for the cape is a sliding type.
第１図（Ａ）〜（（’）は従来装置を示す図、第２図（
イ））。
（Ｂ）は？４１図い）〜（Ｃ）に示す装置の欠点を説明
するための千ｍ模式図、第３図に）、 ｔＪ３）は本発
明装置の一実施態様例を示す図、第４図は第３図に示す
装置の作用効果を説明するための図である。
復代理人 内 １） 明
復代理人 萩 原 亮 −
第１図
第１図
第１頁の続き
０発 明 者 愛甲琢哉
堺市石津西町５番地日新製鋼株
式会社阪神研究所内
■出 願 人 日新製鋼株式会社
東京都千代田区丸の内３丁目４
番１号Figures 1 (A) to ((') are diagrams showing conventional equipment, Figure 2 (
stomach)). What about (B)? 41) to (C) are schematic diagrams for explaining the shortcomings of the apparatus shown in Figure 3) and tJ3) are diagrams showing one embodiment of the apparatus of the present invention, and Figure 4 is a diagram showing an example of the embodiment of the apparatus of the present invention. It is a figure for explaining the effect of the apparatus shown in a figure. Sub-agent 1) Meifu agent Ryo Hagiwara - Figure 1 Figure 1 Continuation of page 1 0 Author Takuya Aiko Nisshin Steel Co., Ltd. Hanshin Research Institute, 5 Ishizu Nishi-cho, Sakai City ■Applicant Date Shin Steel Co., Ltd. 3-4-1 Marunouchi, Chiyoda-ku, Tokyo
Claims (1)
構成されるｔ１９造とし、浴槽とチャンネルとの間にカ
イトを設け、該カイトは板幅に応じて変えることがでさ
るように設置し、蒸気流１ルの調４を用ンヤツクを浴１
凸の上面に設けたことを！１４徴とする兵空蒸治装置。In the vacuum evaporation equipment, the evaporation tank has a T19 structure consisting of a bathtub and a channel, and a kite is installed between the bathtub and the channel, and the kite is installed so that it can be changed according to the width of the plate to control the vapor flow. Using key 4 of 1, bath 1
What is provided on the top surface of the convexity! Military air steaming device with 14 signs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58129456A JPH062942B2 (en) | 1983-07-18 | 1983-07-18 | Vacuum deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58129456A JPH062942B2 (en) | 1983-07-18 | 1983-07-18 | Vacuum deposition equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6021379A true JPS6021379A (en) | 1985-02-02 |
| JPH062942B2 JPH062942B2 (en) | 1994-01-12 |
Family
ID=15009931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58129456A Expired - Lifetime JPH062942B2 (en) | 1983-07-18 | 1983-07-18 | Vacuum deposition equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062942B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6389651A (en) * | 1986-10-03 | 1988-04-20 | Mitsubishi Heavy Ind Ltd | Vacuum deposition apparatus |
| JPS63192859A (en) * | 1987-02-05 | 1988-08-10 | Mitsubishi Heavy Ind Ltd | Continuous vacuum deposition apparatus |
| JP2012510568A (en) * | 2008-12-03 | 2012-05-10 | ファースト ソーラー インコーポレイテッド | Top-down material deposition system and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155369A (en) * | 1981-03-20 | 1982-09-25 | Fuji Photo Film Co Ltd | High vacuum ion plating method and apparatus |
| JPS57174458A (en) * | 1981-04-22 | 1982-10-27 | Mitsubishi Heavy Ind Ltd | Construction of vessel for evaporating source |
| JPS58100675A (en) * | 1981-12-11 | 1983-06-15 | Mitsubishi Heavy Ind Ltd | Method and device for continuous vapor deposition |
-
1983
- 1983-07-18 JP JP58129456A patent/JPH062942B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155369A (en) * | 1981-03-20 | 1982-09-25 | Fuji Photo Film Co Ltd | High vacuum ion plating method and apparatus |
| JPS57174458A (en) * | 1981-04-22 | 1982-10-27 | Mitsubishi Heavy Ind Ltd | Construction of vessel for evaporating source |
| JPS58100675A (en) * | 1981-12-11 | 1983-06-15 | Mitsubishi Heavy Ind Ltd | Method and device for continuous vapor deposition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6389651A (en) * | 1986-10-03 | 1988-04-20 | Mitsubishi Heavy Ind Ltd | Vacuum deposition apparatus |
| JPS63192859A (en) * | 1987-02-05 | 1988-08-10 | Mitsubishi Heavy Ind Ltd | Continuous vacuum deposition apparatus |
| JP2012510568A (en) * | 2008-12-03 | 2012-05-10 | ファースト ソーラー インコーポレイテッド | Top-down material deposition system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062942B2 (en) | 1994-01-12 |
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