JPS60223687A - 高エネルギビ−ムカツト加工方法 - Google Patents

高エネルギビ−ムカツト加工方法

Info

Publication number
JPS60223687A
JPS60223687A JP59080732A JP8073284A JPS60223687A JP S60223687 A JPS60223687 A JP S60223687A JP 59080732 A JP59080732 A JP 59080732A JP 8073284 A JP8073284 A JP 8073284A JP S60223687 A JPS60223687 A JP S60223687A
Authority
JP
Japan
Prior art keywords
shape
relative movement
energy beam
working
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59080732A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216195B2 (fr
Inventor
Kiyoshi Inoue
潔 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP59080732A priority Critical patent/JPS60223687A/ja
Publication of JPS60223687A publication Critical patent/JPS60223687A/ja
Publication of JPH0216195B2 publication Critical patent/JPH0216195B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
JP59080732A 1984-04-20 1984-04-20 高エネルギビ−ムカツト加工方法 Granted JPS60223687A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59080732A JPS60223687A (ja) 1984-04-20 1984-04-20 高エネルギビ−ムカツト加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59080732A JPS60223687A (ja) 1984-04-20 1984-04-20 高エネルギビ−ムカツト加工方法

Publications (2)

Publication Number Publication Date
JPS60223687A true JPS60223687A (ja) 1985-11-08
JPH0216195B2 JPH0216195B2 (fr) 1990-04-16

Family

ID=13726547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59080732A Granted JPS60223687A (ja) 1984-04-20 1984-04-20 高エネルギビ−ムカツト加工方法

Country Status (1)

Country Link
JP (1) JPS60223687A (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4886466A (fr) * 1972-02-16 1973-11-15
JPS54860A (en) * 1977-06-03 1979-01-06 Nec Home Electronics Ltd Scribing method for semiconductor wafer
JPS57193289A (en) * 1981-05-25 1982-11-27 Toshiba Corp Method and device for cutting of tubular body by laser beam

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4886466A (fr) * 1972-02-16 1973-11-15
JPS54860A (en) * 1977-06-03 1979-01-06 Nec Home Electronics Ltd Scribing method for semiconductor wafer
JPS57193289A (en) * 1981-05-25 1982-11-27 Toshiba Corp Method and device for cutting of tubular body by laser beam

Also Published As

Publication number Publication date
JPH0216195B2 (fr) 1990-04-16

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