JPS60229352A - 樹脂封止形半導体装置および樹脂封止方法 - Google Patents

樹脂封止形半導体装置および樹脂封止方法

Info

Publication number
JPS60229352A
JPS60229352A JP59084898A JP8489884A JPS60229352A JP S60229352 A JPS60229352 A JP S60229352A JP 59084898 A JP59084898 A JP 59084898A JP 8489884 A JP8489884 A JP 8489884A JP S60229352 A JPS60229352 A JP S60229352A
Authority
JP
Japan
Prior art keywords
heat sink
resin
semiconductor device
heat radiating
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59084898A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0318741B2 (fr
Inventor
Shiyuuichirou Kuneta
久祢田　修一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP59084898A priority Critical patent/JPS60229352A/ja
Publication of JPS60229352A publication Critical patent/JPS60229352A/ja
Publication of JPH0318741B2 publication Critical patent/JPH0318741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59084898A 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法 Granted JPS60229352A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59084898A JPS60229352A (ja) 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59084898A JPS60229352A (ja) 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法

Publications (2)

Publication Number Publication Date
JPS60229352A true JPS60229352A (ja) 1985-11-14
JPH0318741B2 JPH0318741B2 (fr) 1991-03-13

Family

ID=13843554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59084898A Granted JPS60229352A (ja) 1984-04-26 1984-04-26 樹脂封止形半導体装置および樹脂封止方法

Country Status (1)

Country Link
JP (1) JPS60229352A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750030A (en) * 1983-01-17 1988-06-07 Nec Corporation Resin-molded semiconductor device having heat radiating plate embedded in the resin
JPH07130915A (ja) * 1993-11-04 1995-05-19 Goto Seisakusho:Kk 半導体装置用放熱板及びその製造方法
JP2018117019A (ja) * 2017-01-17 2018-07-26 三菱電機株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4750030A (en) * 1983-01-17 1988-06-07 Nec Corporation Resin-molded semiconductor device having heat radiating plate embedded in the resin
JPH07130915A (ja) * 1993-11-04 1995-05-19 Goto Seisakusho:Kk 半導体装置用放熱板及びその製造方法
JP2018117019A (ja) * 2017-01-17 2018-07-26 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0318741B2 (fr) 1991-03-13

Similar Documents

Publication Publication Date Title
JP2509607B2 (ja) 樹脂封止型半導体装置
US6437429B1 (en) Semiconductor package with metal pads
US5989941A (en) Encapsulated integrated circuit packaging
US5679975A (en) Conductive encapsulating shield for an integrated circuit
US20180233438A1 (en) Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package
US20260053003A1 (en) Method of producing substrates for semiconductor devices, corresponding substrate and semiconductor device
US4981776A (en) Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink
JPS6150387B2 (fr)
JPS60229352A (ja) 樹脂封止形半導体装置および樹脂封止方法
JP2001118961A (ja) 樹脂封止型電力用半導体装置及びその製造方法
US20010040300A1 (en) Semiconductor package with heat dissipation opening
JP2850462B2 (ja) 半導体装置及びその製造方法
TW201308548A (zh) 小基板多晶片記憶體封裝構造
EP4125125A1 (fr) Procédé de fabrication de substrats pour dispositifs à semiconducteur, substrat correspondant et dispositif à semiconducteur
EP2545584B1 (fr) Enrobage comportant un dissipateur de chaleur espacé
JP2532826B2 (ja) 樹脂封止型半導体装置の製造方法
JPS6223097Y2 (fr)
JPH0254665B2 (fr)
JPH06295971A (ja) 半導体装置及びそのリードフレーム
CN223928816U (zh) 一种半导体封装结构
CN112151513A (zh) 功率管芯封装
CN222813597U (zh) 一种引线框架、引线框架阵列及封装体
CN214898401U (zh) 一种功率器件全包封结构
JP2939094B2 (ja) 電力用半導体装置の製造方法
JPH05206319A (ja) 半導体装置およびその製造方法