JPS60235446A - 半導体装置とその製造方法 - Google Patents

半導体装置とその製造方法

Info

Publication number
JPS60235446A
JPS60235446A JP59092140A JP9214084A JPS60235446A JP S60235446 A JPS60235446 A JP S60235446A JP 59092140 A JP59092140 A JP 59092140A JP 9214084 A JP9214084 A JP 9214084A JP S60235446 A JPS60235446 A JP S60235446A
Authority
JP
Japan
Prior art keywords
active layer
semiconductor substrate
vertical wiring
wiring
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59092140A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533536B2 (fr
Inventor
Masaaki Yasumoto
安本　雅昭
Tadayoshi Enomoto
榎本　忠儀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP59092140A priority Critical patent/JPS60235446A/ja
Publication of JPS60235446A publication Critical patent/JPS60235446A/ja
Publication of JPH0533536B2 publication Critical patent/JPH0533536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP59092140A 1984-05-09 1984-05-09 半導体装置とその製造方法 Granted JPS60235446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59092140A JPS60235446A (ja) 1984-05-09 1984-05-09 半導体装置とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59092140A JPS60235446A (ja) 1984-05-09 1984-05-09 半導体装置とその製造方法

Publications (2)

Publication Number Publication Date
JPS60235446A true JPS60235446A (ja) 1985-11-22
JPH0533536B2 JPH0533536B2 (fr) 1993-05-19

Family

ID=14046128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59092140A Granted JPS60235446A (ja) 1984-05-09 1984-05-09 半導体装置とその製造方法

Country Status (1)

Country Link
JP (1) JPS60235446A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219954A (ja) * 1986-03-20 1987-09-28 Fujitsu Ltd 三次元ｉｃの製造方法
JPH11261001A (ja) * 1998-03-13 1999-09-24 Japan Science & Technology Corp ３次元半導体集積回路装置の製造方法
US7029937B2 (en) * 2002-03-19 2006-04-18 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
JP2008270797A (ja) * 1992-04-08 2008-11-06 Glenn J Leedy 絶縁膜層分離ｉｃ製造
JP2009164152A (ja) * 2007-12-28 2009-07-23 Nikon Corp 積層型半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219954A (ja) * 1986-03-20 1987-09-28 Fujitsu Ltd 三次元ｉｃの製造方法
JP2008270797A (ja) * 1992-04-08 2008-11-06 Glenn J Leedy 絶縁膜層分離ｉｃ製造
JP2009218606A (ja) * 1992-04-08 2009-09-24 Taiwan Semiconductor Manufacturing Co Ltd 絶縁膜層分離ｉｃ製造
JPH11261001A (ja) * 1998-03-13 1999-09-24 Japan Science & Technology Corp ３次元半導体集積回路装置の製造方法
US7029937B2 (en) * 2002-03-19 2006-04-18 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
JP2009164152A (ja) * 2007-12-28 2009-07-23 Nikon Corp 積層型半導体装置

Also Published As

Publication number Publication date
JPH0533536B2 (fr) 1993-05-19

Similar Documents

Publication Publication Date Title
US7405138B2 (en) Manufacturing method of stack-type semiconductor device
TW417232B (en) Semiconductor device and process for producing the same
JPH05109813A (ja) 半導体装置
JP3387478B2 (ja) 半導体装置およびその製造方法
JPH05267563A (ja) 半導体装置およびその製造方法
JPH04356956A (ja) 半導体装置及びその製造方法
US9941236B2 (en) Semiconductor device having wire bonding connection and method for manufacturing the same
JPS6248892B2 (fr)
JPH0533536B2 (fr)
JP2005109171A (ja) 半導体装置およびその製造方法
JP3296344B2 (ja) 半導体装置およびその製造方法
JP2001015556A (ja) 半導体装置及びその製造方法並びにその実装構造
JP3752829B2 (ja) 液晶表示パネルと半導体チップとの接合方法
JP2863426B2 (ja) 半導体装置の実装構造及びその実装方法
JPS6151863A (ja) 半導体装置
CN223181138U (zh) 半导体衬底的无源器件及半导体器件
JP2002246411A (ja) 半導体装置及びその製造方法
JP2770390B2 (ja) 半導体装置
JPH0479333A (ja) 半導体集積回路
JP2659285B2 (ja) 半導体装置の製造方法
JPH0786281A (ja) 半導体装置および半導体装置の製造方法
JPS6091660A (ja) 半導体装置の製造方法
JP2003031722A (ja) 半導体装置およびその製造方法
JPS6153730A (ja) 半導体装置の製造方法
JP2005302816A (ja) 半導体装置及びその製造方法