JPH0533536B2 - - Google Patents

Info

Publication number
JPH0533536B2
JPH0533536B2 JP59092140A JP9214084A JPH0533536B2 JP H0533536 B2 JPH0533536 B2 JP H0533536B2 JP 59092140 A JP59092140 A JP 59092140A JP 9214084 A JP9214084 A JP 9214084A JP H0533536 B2 JPH0533536 B2 JP H0533536B2
Authority
JP
Japan
Prior art keywords
active layer
semiconductor substrate
wiring
vertical wiring
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59092140A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60235446A (ja
Inventor
Masaaki Yasumoto
Tadayoshi Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59092140A priority Critical patent/JPS60235446A/ja
Publication of JPS60235446A publication Critical patent/JPS60235446A/ja
Publication of JPH0533536B2 publication Critical patent/JPH0533536B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP59092140A 1984-05-09 1984-05-09 半導体装置とその製造方法 Granted JPS60235446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59092140A JPS60235446A (ja) 1984-05-09 1984-05-09 半導体装置とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59092140A JPS60235446A (ja) 1984-05-09 1984-05-09 半導体装置とその製造方法

Publications (2)

Publication Number Publication Date
JPS60235446A JPS60235446A (ja) 1985-11-22
JPH0533536B2 true JPH0533536B2 (fr) 1993-05-19

Family

ID=14046128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59092140A Granted JPS60235446A (ja) 1984-05-09 1984-05-09 半導体装置とその製造方法

Country Status (1)

Country Link
JP (1) JPS60235446A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62219954A (ja) * 1986-03-20 1987-09-28 Fujitsu Ltd 三次元ｉｃの製造方法
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
JP4063944B2 (ja) * 1998-03-13 2008-03-19 独立行政法人科学技術振興機構 ３次元半導体集積回路装置の製造方法
JP4110390B2 (ja) * 2002-03-19 2008-07-02 セイコーエプソン株式会社 半導体装置の製造方法
JP5315688B2 (ja) * 2007-12-28 2013-10-16 株式会社ニコン 積層型半導体装置

Also Published As

Publication number Publication date
JPS60235446A (ja) 1985-11-22

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