JPS6024465U - Preliminary soldering processing equipment - Google Patents
Preliminary soldering processing equipmentInfo
- Publication number
- JPS6024465U JPS6024465U JP11427883U JP11427883U JPS6024465U JP S6024465 U JPS6024465 U JP S6024465U JP 11427883 U JP11427883 U JP 11427883U JP 11427883 U JP11427883 U JP 11427883U JP S6024465 U JPS6024465 U JP S6024465U
- Authority
- JP
- Japan
- Prior art keywords
- processing equipment
- chip carrier
- soldering
- soldering processing
- preliminary soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例のり一ドレス・チップキャリ
ヤ予備はんだ付は処理装置の斜視図、第２図は本考案の
治具の断面図、第３図は本考案治具の押えばね取り付は
部の斜視図、第４図は予備加熱板の取り付は部の斜視図
である。
１・・・本体つり下げ金具、２・・・チップキャリヤ取
り付は板、３・・・着脱式チップキャリヤ押えばね、５
・・・予備加熱板、６・・・はんだ浴、１ｏ・・・予備
加熱板取りつけ金具。Fig. 1 is a perspective view of a processing device for pre-soldering a glue dress chip carrier according to an embodiment of the present invention, Fig. 2 is a sectional view of the jig of the present invention, and Fig. 3 is a presser spring of the jig of the present invention. FIG. 4 is a perspective view of the mounting section, and FIG. 4 is a perspective view of the mounting section of the preheating plate. 1... Body hanging bracket, 2... Chip carrier mounting plate, 3... Removable chip carrier presser, 5
... Preheating plate, 6... Solder bath, 1o... Preheating plate mounting fittings.
Claims (1)
チップキャリヤ押えばね、着脱式予備加熱板よりなるリ
ードレスチップキャリヤ予備はんだ付は処理装置におい
て、 はんだ浴の熱を利用しはんだ付は前に予備加熱する手段
を設けたことを特徴とする予備はんだ付は処理装置。[Scope of Claim for Utility Model Registration] Pre-soldering of a leadless chip carrier consisting of a main body hanging bracket, a plate for attaching the chip carrier, a removable chip carrier presser spring, and a removable pre-heating plate is carried out using the heat of the solder bath in the processing equipment. A pre-soldering processing device characterized by having a means for pre-heating before soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11427883U JPS6024465U (en) | 1983-07-25 | 1983-07-25 | Preliminary soldering processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11427883U JPS6024465U (en) | 1983-07-25 | 1983-07-25 | Preliminary soldering processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6024465U true JPS6024465U (en) | 1985-02-19 |
Family
ID=30264224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11427883U Pending JPS6024465U (en) | 1983-07-25 | 1983-07-25 | Preliminary soldering processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6024465U (en) |
-
1983
- 1983-07-25 JP JP11427883U patent/JPS6024465U/en active Pending
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