JPS60245257A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS60245257A
JPS60245257A JP59100586A JP10058684A JPS60245257A JP S60245257 A JPS60245257 A JP S60245257A JP 59100586 A JP59100586 A JP 59100586A JP 10058684 A JP10058684 A JP 10058684A JP S60245257 A JPS60245257 A JP S60245257A
Authority
JP
Japan
Prior art keywords
heat treatment
semiconductor substrate
cracks
layer
passivation film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59100586A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0224021B2 (fr
Inventor
Norio Totsuka
戸塚　憲男
Yasumitsu Sugawara
菅原　安光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP59100586A priority Critical patent/JPS60245257A/ja
Publication of JPS60245257A publication Critical patent/JPS60245257A/ja
Publication of JPH0224021B2 publication Critical patent/JPH0224021B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP59100586A 1984-05-21 1984-05-21 半導体装置の製造方法 Granted JPS60245257A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59100586A JPS60245257A (ja) 1984-05-21 1984-05-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59100586A JPS60245257A (ja) 1984-05-21 1984-05-21 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60245257A true JPS60245257A (ja) 1985-12-05
JPH0224021B2 JPH0224021B2 (fr) 1990-05-28

Family

ID=14277984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59100586A Granted JPS60245257A (ja) 1984-05-21 1984-05-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60245257A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121456A (ja) * 1984-11-19 1986-06-09 Nippon Denso Co Ltd 半導体素子の突起電極の形成方法
US5393696A (en) * 1990-12-03 1995-02-28 Grumman Aerosace Corp. Method for forming multilayer indium bump contacts

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5133562A (en) * 1974-09-17 1976-03-22 Tokyo Shibaura Electric Co Handotaisochi no seizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5133562A (en) * 1974-09-17 1976-03-22 Tokyo Shibaura Electric Co Handotaisochi no seizohoho

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121456A (ja) * 1984-11-19 1986-06-09 Nippon Denso Co Ltd 半導体素子の突起電極の形成方法
US5393696A (en) * 1990-12-03 1995-02-28 Grumman Aerosace Corp. Method for forming multilayer indium bump contacts

Also Published As

Publication number Publication date
JPH0224021B2 (fr) 1990-05-28

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