JPS60246584A - Panel heater - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] (Technical field) The present invention relates to a sheet heating element.

(Discretionary technology) Conventionally, as shown in FIG. 3, a heater electrode 2 and a heat-sensitive electrode 3 are formed on the surface of an organic semiconductor 1 made of Norilon or the like using a pattern of metal foil, and a heater electrode 2 is formed on the surface of an organic semiconductor 1 made of Norilon or the like using a pattern of metal foil. Various types of rectangular photothermal bodies have been provided which perform temperature control by detecting changes in impedance between the electrode 2 and the heat-sensitive Ti electrode 3 due to temperature.

In this kind of planar heating element, there is a quality detection resistor Ra (as a commercially available resistor component) between the end of the heater electrode 2 and the end of the heat-sensitive electrode 3, as shown in Figure 4. ”Call connection 17
, depending on the impedance between heater T1 pole 2 and heat-sensitive electrode;
To the first stream, this resistance 1fi'l' is used for temperature detection Li\
It is a sign detected as ゛・]. At this point,
iJ Figure 5 (As you can see, it has a negative characteristic, so the temperature detection voltage +-17 - temperature retention 11 (1 To detect the temperature of the sheet heating element,
i''; i 1 Conductor 1 must be present, and for this reason (5
4-ninno is a relatively small shino.

Therefore, the temperature of the planar heating element Δ′ and the temperature of all electrodes 2
However, the current flowing into the stone increases, and the amount of power consumed by the temperature detection resistor 11a' also increases accordingly, resulting in a problem that constant heat generation occurs locally in the stone.

In particular, when a commercially available resistor component is used as the temperature detection resistor Ra', the heat dissipation efficiency is poor and it adversely affects the temperature control circuit, etc., and the cost is low and the resistor connection work is complicated.
Moreover, the planar heating element A' becomes larger due to an increase in the installation space.

(Objective of the Invention) The present invention has been proposed in view of the above points, and its purpose is to dissipate heat by patterning a temperature detection resistor on the surface of an organic semiconductor together with a heater electrode and a heat-sensitive electrode. To provide a planar heating element which increases the effectiveness, eliminates the need for a separate resistor component, reduces stress and eliminates the work of connecting a resistor, and also allows the planar heating element to be made thinner and smaller. (Disclosure of the Invention) The present invention will be described below with reference to the drawings.

Fig. 1j shows an embodiment of the present invention, and shows the vicinity of the electrical outlet Δ, 17.1 formed at the end of the planar heating element A. tl 1irB
・It is a conductor consisting of (many conductors), and (like the motor, <
) a1 impedance - hot water temperature characteristic] 3, this f] (1 surface of semiconductor 1 and heat-sensitive electrodes 3 are arranged in parallel.

And '! of heater electrode 2! Between one end of the side C connected to the fi source and one end of the heat-sensitive electrode 3 (J, these electric currents If
! 2. IJ patterned at the same time as forming 3
A zigzag-shaped temperature detection resistor Ra is connected.

In addition, there is +! A reflective electrode is provided on the back surface of , i'1 and 1, but its illustration is omitted for convenience.

How to connect to this planar heating element IJ shown in Figure 2? <Substantially the same as the conventional method, the voltage across the temperature detection resistor Ra is detected as the temperature detection voltage Va, and the heater is controlled by a temperature control circuit (not shown). This is to control the temperature by controlling the power supply to Hlfi2.

(Effects of the Invention) As described above, according to the present invention, a rainbow electrode and a heat-sensitive electrode are formed on the surface of an organic semiconductor, and the impedance of the wired conductor between the heater electrode and the heat-sensitive electrode due to temperature changes. In the planar heating element, the temperature detection resistor is connected to the heater electrode and the heat-sensitive electrode, and the temperature detection resistor is connected to the heater electrode and the heat-sensitive electrode. Since a pattern is also formed on the surface of the organic semiconductor, a heat dissipation effect through the surface of the organic semiconductor can be expected compared to a platform that separately uses a commercially available resistor component as a temperature detection resistor. Prevents heat generation and ensures accurate operation of temperature control circuits, etc.
] It has the effect of increasing safety.

Further, since the temperature detection resistor is formed at the same time as the heater electrode and the heat-sensitive electrode, it has the advantage that the cost required for resistor parts can be reduced and the complicated connection work can be eliminated.

Furthermore, since the temperature detection resistor can be built within the thickness of the planar heating element, the space occupied by the temperature detection resistor can be reduced, and the planar heating element can be made thinner and smaller.

[Brief explanation of drawings]

Fig. 1 is a plan view of the main part of an embodiment of the present invention, Fig. 2 is a configuration diagram of a temperature detection circuit, and Fig. 3 is a partial sectional view of the conventional example. Figure (B) is a partially omitted plan view, Figure 4 (ta) is a configuration diagram of a conventional temperature detection circuit, and f! 5
Figure J and Figure 6 are characteristic diagrams of tJ and t, respectively. 1...Organic'-1' conductor, 2...Heater electrode,
3...Thermosensitive electrode, Ra...'A temperature detection resistor△・
・Applicant for revision of sheet heating element: Matsutoden” Stock market split (J or 1 representative Patent attorney: Satoshi Takayama (”C)

Claims (1)

[Claims] Heat-sensitive electrodes are formed on the surface of the organic semiconductor, and changes in the impedance of the semiconductor between the same three electrodes, J and O heat-sensitive electrodes due to temperature changes are detected between each of the electrodes. Jj is connected to a planar heating element which is configured to control the energization to the heater electrode by detecting the temperature with a temperature detecting resistor connected to the heater electrode (the hot stone detecting resistor is connected to the heater electrode and the heat-sensitive electrode, and A planar heating element with a patterned opening on the surface of the conductor and an 8-shape pattern.