JPS60249351A - 沸騰冷却型回路基板と冷媒液中での配置構造 - Google Patents

沸騰冷却型回路基板と冷媒液中での配置構造

Info

Publication number
JPS60249351A
JPS60249351A JP59105889A JP10588984A JPS60249351A JP S60249351 A JPS60249351 A JP S60249351A JP 59105889 A JP59105889 A JP 59105889A JP 10588984 A JP10588984 A JP 10588984A JP S60249351 A JPS60249351 A JP S60249351A
Authority
JP
Japan
Prior art keywords
circuit board
circuit
board
semiconductor element
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59105889A
Other languages
English (en)
Japanese (ja)
Other versions
JPH038587B2 (mo
Inventor
Kishio Yokouchi
貴志男 横内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59105889A priority Critical patent/JPS60249351A/ja
Publication of JPS60249351A publication Critical patent/JPS60249351A/ja
Publication of JPH038587B2 publication Critical patent/JPH038587B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59105889A 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造 Granted JPS60249351A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59105889A JPS60249351A (ja) 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59105889A JPS60249351A (ja) 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造

Publications (2)

Publication Number Publication Date
JPS60249351A true JPS60249351A (ja) 1985-12-10
JPH038587B2 JPH038587B2 (mo) 1991-02-06

Family

ID=14419483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59105889A Granted JPS60249351A (ja) 1984-05-24 1984-05-24 沸騰冷却型回路基板と冷媒液中での配置構造

Country Status (1)

Country Link
JP (1) JPS60249351A (mo)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019175971A (ja) * 2018-03-28 2019-10-10 日本電気株式会社 実装基板、電子機器及び素子冷却方法
WO2022004400A1 (ja) * 2020-07-03 2022-01-06 株式会社オートネットワーク技術研究所 電気機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141462U (mo) * 1975-05-07 1976-11-15
JPS52114271A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Semiconductor pellet mounting structure for substrate
JPS5887836A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 基板およびそれを用いたペレツトボンデイング方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51141462U (mo) * 1975-05-07 1976-11-15
JPS52114271A (en) * 1976-03-22 1977-09-24 Hitachi Ltd Semiconductor pellet mounting structure for substrate
JPS5887836A (ja) * 1981-11-20 1983-05-25 Hitachi Ltd 基板およびそれを用いたペレツトボンデイング方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019175971A (ja) * 2018-03-28 2019-10-10 日本電気株式会社 実装基板、電子機器及び素子冷却方法
WO2022004400A1 (ja) * 2020-07-03 2022-01-06 株式会社オートネットワーク技術研究所 電気機器
JP2022013081A (ja) * 2020-07-03 2022-01-18 株式会社オートネットワーク技術研究所 電気機器
US12484201B2 (en) 2020-07-03 2025-11-25 Autonetworks Technologies, Ltd. Electric device with immersed electronic components and elongated busbar forming an upward flow

Also Published As

Publication number Publication date
JPH038587B2 (mo) 1991-02-06

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