JPS6027458U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6027458U
JPS6027458U JP1983119758U JP11975883U JPS6027458U JP S6027458 U JPS6027458 U JP S6027458U JP 1983119758 U JP1983119758 U JP 1983119758U JP 11975883 U JP11975883 U JP 11975883U JP S6027458 U JPS6027458 U JP S6027458U
Authority
JP
Japan
Prior art keywords
conductor pattern
recess
ceramic layer
semiconductor element
semiconductor equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983119758U
Other languages
English (en)
Inventor
横川　俊樹
豊 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1983119758U priority Critical patent/JPS6027458U/ja
Publication of JPS6027458U publication Critical patent/JPS6027458U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図および第２図は従来の光結合半導体装置を示す断
面図、第３図はこの考案の半導体装置の第１の実施例を
示す断面図、第４図はこの考案の第２の実施例を示す断
面図、第５図はこの考案の第３の実施例を示す斜視図で
ある。 ２１・・・セラミック層、２２・・・凹部、２３・・・
半導体発光素子用導体パターン、２４・・・絶縁層、２
５・・・半導体受光素子用導体パターン、２６・・・半
導体発光素子、２７・・・ワイヤ、２８・・・半導体受
光素子、２９・・・ワイヤ、３０・・・バンプ電極。

Claims (1)

    【実用新案登録請求の範囲】
  1. 側面が斜面の凹部を所定部分に加工した１層のセラミッ
    ク層からなるセラミックパッケージと、前記凹部内から
    それ以外の平坦部表面に延びて前記セラミック層に形成
    された第１の導体パターンと、この第１の導体パターン
    と絶縁して前記セラミック層の平坦部表面に形成された
    第２の導体パターンと、前記第１の導体パターンに電気
    的に接続されて前記セラミック層の凹部内に設けられた
    第１の半導体素子と、この第１の半導体素子と対向する
    ように前記凹部の開口部上に設けられ、前記第２の導体
    パターンと電気的に接続される第２の半導体素子とを具
    備してなる半導体装置。
JP1983119758U 1983-08-02 1983-08-02 半導体装置 Pending JPS6027458U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983119758U JPS6027458U (ja) 1983-08-02 1983-08-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983119758U JPS6027458U (ja) 1983-08-02 1983-08-02 半導体装置

Publications (1)

Publication Number Publication Date
JPS6027458U true JPS6027458U (ja) 1985-02-25

Family

ID=30274724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983119758U Pending JPS6027458U (ja) 1983-08-02 1983-08-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS6027458U (ja)

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