JPS603145A - Lead soldering process - Google Patents
Lead soldering processInfo
- Publication number
- JPS603145A JPS603145A JP58111438A JP11143883A JPS603145A JP S603145 A JPS603145 A JP S603145A JP 58111438 A JP58111438 A JP 58111438A JP 11143883 A JP11143883 A JP 11143883A JP S603145 A JPS603145 A JP S603145A
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead frame
- soldering
- terminal
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（イ）産業上の利用分野
本発明は、バイブリソＩ” Ｉ Ｃや抵抗アレイ等に用
いられる基板の端子にリードフレームを半田イ」けする
方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method of soldering a lead frame to a terminal of a substrate used in a vibrator IC, a resistor array, or the like.
（ロ）従来技術
第１図は従来技術を説明するための説明図である。基板
１の上に基板搭載部品２ （例えばチップ部品）を半田
付けする際には、噴流半田槽を用いて、半田の噴流に基
板表面を接触させて基板表面の全面を半田付けする方法
を用いている。(b) Prior Art FIG. 1 is an explanatory diagram for explaining the prior art. When soldering a board-mounted component 2 (for example, a chip component) onto a board 1, a method is used in which a jet soldering tank is used and the entire surface of the board is soldered by bringing the board surface into contact with a jet of solder. ing.
そのため、基板端子３をむき出しにしたままこれを行う
と、基板端子３にも半Ｄ」が被着してしまい、この部分
にリードフレーム先端を挿入することが困難となる。Therefore, if this is done with the board terminals 3 exposed, the half D' will also adhere to the board terminals 3, making it difficult to insert the tip of the lead frame into this part.
そのため従来は噴流半田槽を通してもこの基板端子に半
田が被着しないように基板端子に予めマスキング等の処
理を施す。そののち、噴流半田槽により半田付けを行い
そのあと、前記マスキングを除去する。マスキングの除
去後、基板端子３にリードフレーム先端４を挿入し、再
びこの部分に半田付けを行ってリード付けを完了する。For this reason, conventionally, the board terminals are subjected to a process such as masking in advance so that solder does not adhere to the board terminals even when the board terminals are passed through a jet soldering tank. After that, soldering is performed using a jet soldering bath, and then the masking is removed. After removing the masking, the lead frame tip 4 is inserted into the board terminal 3, and this portion is soldered again to complete the lead attachment.
このように、従来のリード付は方法の工程は煩雑であり
、ひいては電子部品の製造コストが高くなるという欠点
があった。As described above, the conventional method of attaching leads has the drawback that the process steps are complicated and the manufacturing cost of the electronic component increases.
（ハ）目的
本発明は基板端子をリードフレームに半田イ」けをする
作業を簡単化し、製造コストを低減しうるリード付は方
法を提供することを目的としている。(C) Objective The present invention aims to provide a lead attaching method that simplifies the work of soldering a board terminal to a lead frame and reduces manufacturing costs.
（ニ）構成
本発明は基板端子にリードフレームを半田付けする際に
、基板に基板搭載部品の半田イ」げを行うときに基板端
子にも半田を被着させたあと、前記基板端子及びリード
フレームの先端を加熱し前記基板端子に被着した半田を
溶融状態にして基板端子にリードフレームを挿入するこ
とにより半田付けをするようにしたリード付は方法であ
る。(D) Structure When soldering a lead frame to a board terminal, the present invention applies solder to the board terminals when soldering parts mounted on the board to the board, and then solder is applied to the board terminals and the leads. Lead attachment is a method in which soldering is performed by heating the tip of the frame to melt the solder applied to the board terminal and inserting the lead frame into the board terminal.
（ホ）実施例
第２図は本発明に係るリード付は方法の一実施例を示す
説明図である。同図において１は基板、２は基板搭載部
品、３は基板端子、４はリードフレームの先端、５はリ
ードフレーム、６は前記基板端子に被着した半田、７は
半田６の両側にこれを挟むように位置せしめた加熱ガス
噴出パイプである。(E) Embodiment FIG. 2 is an explanatory diagram showing an embodiment of the lead attachment method according to the present invention. In the figure, 1 is a board, 2 is a component mounted on the board, 3 is a board terminal, 4 is the tip of a lead frame, 5 is a lead frame, 6 is solder attached to the board terminal, and 7 is solder on both sides of 6. These are heated gas ejection pipes placed between the two.
つぎに、作業の手順について以−ト説明する。Next, the work procedure will be explained below.
■ まづ、基板１上に搭載された基板搭載部品２は噴流
半田槽を通って半田イ］けされ、基板端子３にも半田６
が被着される。■ First, the board-mounted components 2 mounted on the board 1 are soldered through a jet solder bath, and the board terminals 3 are also soldered with solder 6.
is deposited.
■ 前記加熱ガス噴出パイプ７を用いて、基板１’１Ｔ
１１子３の両側より基板端子３及びリードフレーム先端
４に向かって、約３００〜４００度Ｃに加；：ハされた
窒素ガスを噴出させることにより、前記半田６を溶融せ
しめる。■ Using the heating gas jetting pipe 7, the substrate 1'1T
The solder 6 is melted by blowing out nitrogen gas heated to approximately 300 to 400 degrees Celsius from both sides of the element 3 toward the board terminal 3 and lead frame tip 4.
■ そののち、リードフレーム先端４を基板端子３に挿
入し、引続き加熱するごとによってリードフレーム先端
４は基板端子３に半田イマ１けされる。(2) Thereafter, the lead frame tip 4 is inserted into the board terminal 3, and each time the lead frame is heated, the lead frame tip 4 is soldered to the board terminal 3.
なお、第２図に示した実施例では基板端子の加熱方法と
して高温の窒素ガスを使用したが、これは例えば赤外線
を照射する方法であってもよい。In the embodiment shown in FIG. 2, high-temperature nitrogen gas was used to heat the board terminals, but this may also be done by, for example, irradiating infrared rays.
また、上記実施例では、基板の片面のみ半田付けをおこ
なっているがこれに限定されず、基板の、両面に基板搭
載部品をとりつける場合であってもよい。Further, in the above embodiment, soldering is performed only on one side of the board, but the present invention is not limited to this, and board-mounted components may be attached to both sides of the board.
（へ）効果
本発明に係るリード付は方法によれば、基板端子のマス
キングや、それを取り除く工程及びそののちのリードフ
レーＪ・先端を別途基板端子に半田付けする工程を省く
ことができるので、工程数が減少し、製造コストを低減
させることができる。(f) Effects According to the method of attaching leads according to the present invention, it is possible to omit the process of masking and removing the board terminals, and the subsequent process of separately soldering the lead flake J/tip to the board terminals. , the number of steps is reduced, and manufacturing costs can be reduced.
第１図は従来のリード付は方法の説明図、第２図は本発
明のリード付は方法の一実施例の説明図である。
■・・・基板、２・・・基板搭載部品、３・・・基板端
子、４・・・リードフレーム先端、５・・・リードフレ
ーム、６・・・半田、７・・・加熱ガス噴出パイプ。
特許出願人 ローム株式会社
代理人 弁理士 大 西 孝 治
第１図FIG. 1 is an explanatory diagram of a conventional lead attachment method, and FIG. 2 is an explanatory diagram of an embodiment of the lead attachment method of the present invention. ■... Board, 2... Board mounted components, 3... Board terminal, 4... Lead frame tip, 5... Lead frame, 6... Solder, 7... Heated gas jet pipe . Patent Applicant: ROHM Co., Ltd. Agent, Patent Attorney: Takaharu Ohnishi Figure 1
Claims (1)
おいて、基板に基板搭載部品の半田イ」けを行う際に半
田を被着させたあと、前記基板端子及びリードフレーム
の先端を加熱し前記基板端子に被着した半田を溶融状態
にして基板端子にリード・フレームを挿入することによ
り半田伺けをすることを特徴とするリード付は方法。(1) In the method of soldering a lead frame to a board terminal, after applying solder when soldering components mounted on a board to a board, the tips of the board terminal and lead frame are heated and the board is heated. A method for attaching leads that is characterized by applying solder by melting the solder applied to the terminal and inserting a lead frame into the terminal on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58111438A JPS603145A (en) | 1983-06-20 | 1983-06-20 | Lead soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58111438A JPS603145A (en) | 1983-06-20 | 1983-06-20 | Lead soldering process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS603145A true JPS603145A (en) | 1985-01-09 |
| JPS6353698B2 JPS6353698B2 (en) | 1988-10-25 |
Family
ID=14561197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58111438A Granted JPS603145A (en) | 1983-06-20 | 1983-06-20 | Lead soldering process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603145A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166059A (en) * | 1981-04-06 | 1982-10-13 | Murata Mfg Co Ltd | Manufacture of electronic part |
-
1983
- 1983-06-20 JP JP58111438A patent/JPS603145A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57166059A (en) * | 1981-04-06 | 1982-10-13 | Murata Mfg Co Ltd | Manufacture of electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6353698B2 (en) | 1988-10-25 |
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