JPS6032507A - Method of forming cable connector shielding layer - Google Patents
Method of forming cable connector shielding layerInfo
- Publication number
- JPS6032507A JPS6032507A JP13906483A JP13906483A JPS6032507A JP S6032507 A JPS6032507 A JP S6032507A JP 13906483 A JP13906483 A JP 13906483A JP 13906483 A JP13906483 A JP 13906483A JP S6032507 A JPS6032507 A JP S6032507A
- Authority
- JP
- Japan
- Prior art keywords
- shielding layer
- uncrosslinked
- cable
- semiconductive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 239000012212 insulator Substances 0.000 claims description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002985 plastic film Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Processing Of Terminals (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［発明の技術分野］
本発明は、特にＣ■ケーブル接続部遮蔽層の形成に適し
た、ケーブル接続部遮蔽層の形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for forming a cable connection part shielding layer, which is particularly suitable for forming a C■ cable connection part shielding layer.
［発明の技術的背頚〕
従来から、例えば第１図に示すようなＣＶケーブル接続
部１における補強絶縁体２端部のテーバ部２ａ上に設け
られる接続部遮蔽層３は、次のようにして形成されてい
た。[Technical Backbone of the Invention] Conventionally, the connecting portion shielding layer 3 provided on the tapered portion 2a at the end portion of the reinforcing insulator 2 in the CV cable connecting portion 1 as shown in FIG. It was formed.
すなわち、補強絶縁体２を常法により成形した後、その
テーパ部２ａ上に未架橋の半導電テープを重ね巻して半
導電層３ａを設ける。この半Ｓ電層３ａは一端がケーブ
ル遮蔽層４に接続きれ、他端が架橋された半導電テープ
３ｂにより包覆された状態とされる。この後、接続部全
体を加熱して未架橋の半導電層３ａを架橋づるとともに
、補強絶縁体２および半導電テープ３ｂに熱融着させる
。That is, after the reinforcing insulator 2 is molded by a conventional method, an uncrosslinked semiconducting tape is wrapped around the tapered portion 2a to form the semiconducting layer 3a. One end of this semi-S conductive layer 3a is connected to the cable shielding layer 4, and the other end is covered with a cross-linked semi-conductive tape 3b. Thereafter, the entire connecting portion is heated to crosslink the uncrosslinked semiconductive layer 3a and to thermally fuse it to the reinforcing insulator 2 and the semiconductive tape 3b.
［背景技術の問題点１
上記のようにして接続部遮蔽層３が形成されるが、これ
には次のような欠点があった。[Problem 1 of Background Art Although the connecting portion shielding layer 3 is formed as described above, this has the following drawbacks.
■ 半導電層３ａと半導電テープ３ｂの、特に補強絶縁
体２と接する側の合せ面３Ｃの接着が、一方の半導電テ
ープ３ｂが架橋されているため、完全に融着一体化し難
い。このため、架橋時に、この合せ面３０間に補強絶縁
体２の一部の溶融物が流入し、テーパ部２ａの表面の平
滑さを損うことがある。(2) It is difficult to completely fuse and integrate the semiconducting layer 3a and the semiconducting tape 3b, especially the mating surface 3C on the side that contacts the reinforcing insulator 2, because one of the semiconducting tapes 3b is crosslinked. Therefore, during crosslinking, a portion of the melted material of the reinforcing insulator 2 flows between the mating surfaces 30, which may impair the smoothness of the surface of the tapered portion 2a.
■ 架橋半導電テープ３ｂの折り返し部３ｄが架橋時に
つぶれて角張り、使用時に電界緩和効果が低減する。(2) The folded portion 3d of the crosslinked semiconductive tape 3b is crushed and angular during crosslinking, reducing the electric field relaxation effect during use.
■ 半導電層３ａと半導電テープ３ｂとが接着し難いこ
とから、架橋時の補強絶縁体２の熱膨張により両者がず
れ易い。(2) Since it is difficult for the semiconductive layer 3a and the semiconductive tape 3b to adhere to each other, they tend to shift due to thermal expansion of the reinforcing insulator 2 during crosslinking.
［発明の目的］
本発明はかかる難点を解消すべくなされたちのぐ、ケー
ブル接続部の補強絶縁体テーパ面の平滑さが保たれ、電
界緩和効果の大ぎいケーブル接続部遮蔽層の形成方法を
提供することを目的とする。[Object of the Invention] The present invention has been devised to overcome these difficulties, and provides a method for forming a shielding layer at a cable connection portion, which maintains the smoothness of the tapered surface of the reinforcing insulator at the cable connection portion and has a large electric field mitigation effect. The purpose is to provide.
［発明の概要］
すなわち本発明のケーブル接続部遮蔽層の形成方法は、
ケーブル接続部の補強絶縁体両端のテーバ部上にケーブ
ル遮蔽層に連なる接続部遮蔽層を形成りるにあたり、未
架橋部と架橋部とに区分された半導電シートを、その未
架橋部側をケーブル遮蔽層に向けて前記テーパ部上に巻
（＝Ｊ（プるとともに、その架橋部の外縁を未架橋の半
導電層を介イ１させて折り返し、前記テーパ部上に前記
ケーブル遮蔽層端部から前記シートの未架橋部上を経て
前記半導電層にわたって未架橋半導電テープを巻（ｑけ
、この後前記したすべての未架橋部分を；Ｊ１１熱架橋
することを特徴としている。[Summary of the invention] That is, the method for forming a cable connection portion shielding layer of the present invention is as follows:
When forming a connection shielding layer that connects to the cable shielding layer on the tapered parts at both ends of the reinforcing insulator of the cable connection part, the semiconductive sheet is divided into an uncrosslinked part and a crosslinked part, and the uncrosslinked part side is Wrap (=J) on the tapered part toward the cable shielding layer, fold the outer edge of the bridged part through the uncrosslinked semiconductive layer, and wrap the end of the cable shielding layer on the tapered part. The method is characterized in that an uncrosslinked semiconductive tape is wound from the top of the sheet over the uncrosslinked part of the sheet over the semiconductive layer (q), and then all the uncrosslinked parts described above are thermally crosslinked.
［発明の実施例コ 以下本発明の実施例について説明する。[Embodiments of the invention] Examples of the present invention will be described below.
第２図および第３図は本発明の一実施例の説明図であり
、Ｍ１図と同一部分には同一符号が何されている。FIGS. 2 and 3 are explanatory diagrams of one embodiment of the present invention, and the same parts as in FIG. M1 are designated by the same reference numerals.
まず、ケーブル接続部における補強絶縁体２のテーパ部
２ａ上に、第３図に示すような半導電プラスチックシー
ト４をリング状に巻付（プ、その両側部を重ね合せて加
熱融着する。上記シー１−４は、予め未架橋部４ａと架
橋部４ｂとに区分された１枚のプラスチックシート、例
えばポリエチレンシートであり、未架橋部４ａ側がケー
ブル遮蔽層４に向くようにされている。次いでシートの
架橋部４ムの外縁を、未架橋の半導電層５を介在させて
折り返す。この半導電層５は直径が約１１Ｉｍの丸紐で
、シート架橋部の外縁を丸く折り返すために配設される
ものである。そして、ケーブル遮蔽層４の端部からシー
ト床架橋部４ａ上を経て前記半導電層５にわたって未架
橋の半導電テープを重ね巻して半導電ｍ３ａを設ける。First, a semiconductive plastic sheet 4 as shown in FIG. 3 is wrapped in a ring shape on the tapered part 2a of the reinforcing insulator 2 at the cable connection part, and the both sides are overlapped and heat-fused. The sheet 1-4 is a single plastic sheet, for example, a polyethylene sheet, which is divided in advance into an uncrosslinked part 4a and a crosslinked part 4b, with the uncrosslinked part 4a facing the cable shielding layer 4. Next, the outer edge of the crosslinked portion 4 of the sheet is folded back with an uncrosslinked semiconductive layer 5 interposed therebetween.The semiconductive layer 5 is a round cord with a diameter of approximately 11 Im, and is arranged to fold back the outer edge of the crosslinked portion of the sheet into a round shape. Then, an uncrosslinked semiconducting tape is wrapped over and over from the end of the cable shielding layer 4 over the sheet floor bridge section 4a and over the semiconducting layer 5 to provide a semiconducting m3a.
図示を省略しＩこが、上記と同様のことが補強絶縁体２
の他端のテーパ部においても行なわれる。Although illustration is omitted, the same thing as above applies to the reinforcing insulator 2.
This is also done at the tapered portion at the other end.
この後、接続部全体を耐熱テープで包覆し、その外側か
ら適当な加熱手段をもって加熱し、未架橋部分、すなわ
ち半導電層３ａ、シート４の未架橋部４ａおよび半Ｓ電
紐５を架橋するとともに、各接触面を加温融着させる。After that, the entire connection part is covered with heat-resistant tape, and heated from the outside with a suitable heating means to cross-link the uncrosslinked parts, that is, the semiconductive layer 3a, the uncrosslinked part 4a of the sheet 4, and the semi-S electric cord 5. At the same time, each contact surface is heated and fused.
このようにして接続部遮蔽層が形成される。In this way, the connection portion shielding layer is formed.
［発明の効果］
以上説明したように本発明の方法によれば、半導電層３
ａの端部に配置されるプラスチックシート４に未架橋部
４ａを設けたことにより、この未架橋部４ａが架橋され
たとき半導電層３ａとよく接着し、補強絶縁体２の一部
の溶融物が流入づることかない。従って、テーパ部２ａ
の表面の４’ ？ｆＪさが損われることがない。[Effects of the Invention] As explained above, according to the method of the present invention, the semiconducting layer 3
By providing an uncrosslinked portion 4a on the plastic sheet 4 disposed at the end of a, when the uncrosslinked portion 4a is crosslinked, it adheres well to the semiconductive layer 3a, preventing a portion of the reinforcing insulator 2 from melting. There is no flow of goods. Therefore, the tapered portion 2a
4' on the surface of ? fJ is not impaired.
また、プラスチックシート４の折り返し部にミ１′導電
紐５を介在させたから、その折り返し部の折り返し面が
角張らず使用時に良好な電界緩和効果を奏する。In addition, since the conductive string 5 is interposed in the folded portion of the plastic sheet 4, the folded surface of the folded portion does not have an angular shape and exhibits a good electric field relaxation effect during use.
さらにまた半導電層３ａとプラスチックシー１−４とは
よく接着するので、架橋時両者のずれが起こるようなこ
とはない。Furthermore, since the semiconductive layer 3a and the plastic sheet 1-4 are well adhered to each other, there is no possibility that the two will be misaligned during crosslinking.
第１図は従来のケーブル接続部遮蔽層の形成方法を説明
するための概略図、第２図は本発明方法の一実施例を説
明するための概略図、第３図は同実施例の要部の拡大平
面図Ｃある。
２・・・・・・・・・・・・補強絶縁体２ａ・・・・・
・・・・テーパ部
３・・・・・・・・・・・・接続部遮蔽層３ａ・・・・
・・・・・半導電層
４・・・・・・・・・・・・プラスチックシート５・・
・・・・・・・・・・半導電紐
代理人弁理士 煩 山 佐 −
（ほか１名）FIG. 1 is a schematic diagram for explaining a conventional method of forming a shielding layer for a cable connection part, FIG. 2 is a schematic diagram for explaining an embodiment of the method of the present invention, and FIG. 3 is a schematic diagram of the same embodiment. There is an enlarged plan view C of the section. 2...Reinforcement insulator 2a...
...Tapered part 3... Connection part shielding layer 3a...
...Semi-conductive layer 4...Plastic sheet 5...
・・・・・・・・・Patent attorney representing semi-conducting cord Yamasa Fuu - (1 other person)
Claims (1)
、ケーブル遮蔽層に連なる接続部遮蔽層を形成するにあ
たり、未架橋部と架橋部とに区分された半導電シートを
、その未架橋部側をケーブル遮蔽層に向けて前記テーパ
部上に巻付けるとともに、その架橋部の外縁を、未架橋
の半導電層を介在させて折り返し、前記テーパ部上に、
前記ケーブル遮蔽層端部から前記シートの未架橋部上を
経て前記半導電層にわたって未架橋半導電テープを巻（
＝ｌけ、この後前記したすべての未架橋部分を加熱架橋
することを特徴とするケーブル接続部遮蔽層の形成方法
。(1) When forming a connecting portion shielding layer connected to the cable shielding layer on the tapered portions at both ends of the reinforcing insulator of the cable connecting portion, the semiconducting sheet divided into the uncrosslinked portion and the crosslinked portion is Wrap it around the tapered part with the lower side facing the cable shielding layer, and fold back the outer edge of the bridged part with an uncrosslinked semiconductive layer interposed therebetween, and wrap it around the tapered part,
Wrapping an uncrosslinked semiconductive tape from the end of the cable shielding layer over the uncrosslinked part of the sheet and over the semiconductive layer (
A method for forming a shielding layer for a cable connection portion, which is characterized in that all the uncrosslinked portions described above are then crosslinked by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13906483A JPS6032507A (en) | 1983-07-29 | 1983-07-29 | Method of forming cable connector shielding layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13906483A JPS6032507A (en) | 1983-07-29 | 1983-07-29 | Method of forming cable connector shielding layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6032507A true JPS6032507A (en) | 1985-02-19 |
Family
ID=15236649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13906483A Pending JPS6032507A (en) | 1983-07-29 | 1983-07-29 | Method of forming cable connector shielding layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032507A (en) |
-
1983
- 1983-07-29 JP JP13906483A patent/JPS6032507A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4528419A (en) | Forming of cable splice closures | |
| JP3691740B2 (en) | Cable connecting portion and manufacturing method thereof | |
| JPS59198817A (en) | Crosslinked rubber and plastic insulated cable connector | |
| JPS6176005A (en) | Method of connecting cable | |
| JPS5925511A (en) | Method of connecting intermediate of rubber, plastic cable | |
| JP2789583B2 (en) | Forming method of cable connection | |
| WO1987007095A1 (en) | A method of re-establishing semi-conducting layers around a cable splice, and a sleeve for use in the performance of the method | |
| JPS6318132Y2 (en) | ||
| JPS6026409A (en) | Sleeve for protecting joint | |
| JPS6116754Y2 (en) | ||
| JPH0116346Y2 (en) | ||
| JPS5932967B2 (en) | Waterproofing method for cable terminals | |
| JPS61128712A (en) | Formation for cable insulated connection | |
| JPS5832214Y2 (en) | Connection part of cross-linked polyethylene insulated cable | |
| JPS6030039Y2 (en) | Heat-shrinkable polyethylene sleeve | |
| JPH01186112A (en) | Formation of cable insulation and connection part | |
| JPS6122531B2 (en) | ||
| JPS6029288Y2 (en) | Auxiliary pipe for connecting plastic cable | |
| JPS6125136Y2 (en) | ||
| JPH1118271A (en) | Cable with dam | |
| JPS59148509A (en) | Method of forming molded stress cone | |
| JPS60200480A (en) | Method of molding cable connector | |
| JPS6038837B2 (en) | Method for forming molded connections for rubber and plastic cables | |
| JPS62232875A (en) | Formation of external semiconductor layer in cable joint | |
| JPS59177879A (en) | Method of forming insulator of rubber and plastic insulated cable connector |