JPS603785B2 - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor deviceInfo
- Publication number
- JPS603785B2 JPS603785B2 JP58040158A JP4015883A JPS603785B2 JP S603785 B2 JPS603785 B2 JP S603785B2 JP 58040158 A JP58040158 A JP 58040158A JP 4015883 A JP4015883 A JP 4015883A JP S603785 B2 JPS603785 B2 JP S603785B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- semiconductor device
- manufacturing
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07178—Means for aligning
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 この発明は半導体装置の製造方法に関するものである。[Detailed description of the invention] The present invention relates to a method for manufacturing a semiconductor device.
′ 従来、一般的な内部接続時のりードフレームの加熱
部への固定方法は第１図ａ，ｂに示すように平面板によ
って行なっていた。すなわちアイランドつりリード５に
接地したアイランド４上に半導体素子３を設け、リード
６、リード５を平面的にリードフレーム押え板１で押え
ていた。しかしながら、この方法によれば、第１図ｃに
示すようにリードフレームのリード厚みのバラツキを吸
収できず、全部のリード‘こは、圧力を加えることがで
きない。すなわち第１図ｃに示すようにアイランドつり
リード以外の複数のリード６には加圧されないリードが
存在する。したがって本発明の目的はかかる欠点を除去
した有効な半導体装置の製造方法を提供するもので、そ
の特徴は、加熱部上にリードフレームを搭載し該リード
フレームをリードフレーム押えで押える方法において、
複数のリードのそれぞれに加圧できるごとくリードの厚
さに応じて個別に弾性変形をする弾性材料で該複数のリ
ードを押えた半導体装置の製造方法にある。' Conventionally, the common method for fixing the lead frame to the heating part during internal connection was to use a flat plate as shown in FIGS. 1a and 1b. That is, the semiconductor element 3 is provided on the island 4 which is grounded to the island suspension lead 5, and the leads 6 and 5 are held down by the lead frame holding plate 1 in a two-dimensional manner. However, according to this method, as shown in FIG. 1c, it is not possible to absorb variations in the lead thickness of the lead frame, and pressure cannot be applied to all the leads. That is, as shown in FIG. 1c, there are leads 6 other than the island suspension leads that are not pressurized. Therefore, an object of the present invention is to provide an effective method for manufacturing a semiconductor device that eliminates such drawbacks, and is characterized by the following steps:
The present invention provides a method for manufacturing a semiconductor device in which a plurality of leads are held down by an elastic material that is elastically deformed individually according to the thickness of the leads so that pressure can be applied to each of the leads.
次に、この発明の実施例を図面を用いて説明する。Next, embodiments of the present invention will be described using the drawings.
この発明の実施例構成は、第２図ａに示すように剛性材
料で作られた突起７を有する２カ所の部分と、この部分
を除く全周にあたり設定されたパイプ状の弾性材料で作
られた部分から成っている。As shown in FIG. 2a, the embodiment of the present invention has two parts having protrusions 7 made of a rigid material, and a pipe-shaped elastic material made of a pipe-shaped elastic material around the entire circumference except for these parts. It consists of two parts.
・この機構としては、第２図ｂに示すように２カ所の
重要個所であるアイランドつりリード５を剛性材料部分
７で押え、他のりード部６は、弾性材タ料の加圧時のニ
ゲ９を利用してリード部厚さのバラッキを吸収すること
で全リー日こ圧力を加える。・As shown in Fig. 2b, this mechanism is such that the island hanging leads 5, which are two important parts, are held down by the rigid material parts 7, and the other lead parts 6 are held down when the elastic material is pressurized. By using Nige 9 to absorb variations in the thickness of the lead part, pressure is applied to the entire lead.
従って、各リードは加圧内に多少の相違はあるが圧力を
加えられて加熱部に固定される。Therefore, each lead is fixed to the heating part by applying pressure, although there are some differences in the pressure applied.
０ なお、第２図ａ，ｃから明らかなようにパイプに斜
めのスリットを入れているのは、スリットのスキマにリ
ードがはいり込むのを防ぐためであり、さらにスリット
を入れることでパイプを網分化した弾性独立部品とする
ためである。0 As is clear from Figures 2a and c, the purpose of making diagonal slits in the pipe is to prevent the lead from getting into the gap between the slits. This is to create differentiated elastic independent parts.
タ この発明によれば、重要な２ヵ所を剛性材料にて固
定できるので、アイランドが動くことがなく、安定な組
み立てを行なうことができる。According to this invention, since two important locations can be fixed with rigid material, the island will not move and stable assembly can be performed.
第１図ａは従来技術のリードフレーム押えを示す平面図
、第１図ｂは第１図ａの断面図、第１図ｃは従来技術に
よるリードの押えの状態を示す断面図、第２図ａはこの
発明の実施例によるリードフレーム押えを示す平面図、
第２図ｂは第２図ａの断面図、第２図ｃは本実施例にお
けるリードの押えの状態を示す断面図である。
尚、図において、１……リードフレーム押え板、２・・
・・・・加熱部、３……半導体素子、４・・・・・・ア
イランド、５……アイランドつりリード、６……リード
、７・・・・・・剛・隆材料リードフレーム押え突起部
、８…・・・弾性材料のパイプ、９・・・・・・パイプ
のスリット、である。
弟ノ図
弟ｚ図FIG. 1a is a plan view showing a lead frame presser according to the prior art, FIG. 1b is a sectional view of FIG. 1a, FIG. a is a plan view showing a lead frame presser according to an embodiment of the present invention;
FIG. 2b is a cross-sectional view of FIG. 2a, and FIG. 2c is a cross-sectional view showing the state of holding the lead in this embodiment. In the figure, 1...lead frame holding plate, 2...
...Heating part, 3...Semiconductor element, 4...Island, 5...Island suspension lead, 6...Lead, 7...Rigid/ridged material lead frame presser protrusion , 8... A pipe made of an elastic material, 9... A slit in the pipe. Younger brother's drawing Younger brother's drawing
Claims (1)
ムをリードフレーム押えで押える方法において、該リー
ドフレーム押えの該リードフレームと接する部分はパイ
プ状の弾性材料で作られており、該パイプ状の弾性材料
には該リードフレームと接する側から中央部に向って斜
めに複数のスリツトが設けられていることを特徴とする
半導体装置の製造方法。1. In a method in which a lead frame is mounted on a heating section and the lead frame is pressed by a lead frame holder, the part of the lead frame holder that comes into contact with the lead frame is made of a pipe-shaped elastic material, and the pipe-shaped elastic material 1. A method of manufacturing a semiconductor device, characterized in that a plurality of slits are provided in the material diagonally from the side in contact with the lead frame toward the center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58040158A JPS603785B2 (en) | 1983-03-11 | 1983-03-11 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58040158A JPS603785B2 (en) | 1983-03-11 | 1983-03-11 | Manufacturing method of semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58040157A Division JPS5936421B2 (en) | 1983-03-11 | 1983-03-11 | Semiconductor internal connection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58175841A JPS58175841A (en) | 1983-10-15 |
| JPS603785B2 true JPS603785B2 (en) | 1985-01-30 |
Family
ID=12572951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58040158A Expired JPS603785B2 (en) | 1983-03-11 | 1983-03-11 | Manufacturing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS603785B2 (en) |
-
1983
- 1983-03-11 JP JP58040158A patent/JPS603785B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58175841A (en) | 1983-10-15 |
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