JPS6039272U - 厚膜回路基板 - Google Patents

厚膜回路基板

Info

Publication number
JPS6039272U
JPS6039272U JP13162383U JP13162383U JPS6039272U JP S6039272 U JPS6039272 U JP S6039272U JP 13162383 U JP13162383 U JP 13162383U JP 13162383 U JP13162383 U JP 13162383U JP S6039272 U JPS6039272 U JP S6039272U
Authority
JP
Japan
Prior art keywords
circuit board
thick film
film circuit
groove
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13162383U
Other languages
English (en)
Inventor
岡村 文男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Victor Company of Japan Ltd
Original Assignee
Victor Company of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company of Japan Ltd filed Critical Victor Company of Japan Ltd
Priority to JP13162383U priority Critical patent/JPS6039272U/ja
Publication of JPS6039272U publication Critical patent/JPS6039272U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第1図a、 b、 cは従来の厚膜回路基板の製造過程
を示す各側断面図、第2図a、 b、 cはこの考案に
なる厚膜回路基板の実施例を示す製造過程の各側断面図
である。 5・・・誘電体基板、6,6′・・・凹溝、7,8・・
・導体パターン、9・・・抵抗体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 誘電体基板上に、予め導体パターンと同形状の凹溝を形
    成して、この凹溝内に導体パターンを充填形成させ、さ
    らに、その上面に抵抗体を形成させたことを特徴とする
    厚膜回路基板。
JP13162383U 1983-08-25 1983-08-25 厚膜回路基板 Pending JPS6039272U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13162383U JPS6039272U (ja) 1983-08-25 1983-08-25 厚膜回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13162383U JPS6039272U (ja) 1983-08-25 1983-08-25 厚膜回路基板

Publications (1)

Publication Number Publication Date
JPS6039272U true JPS6039272U (ja) 1985-03-19

Family

ID=30297508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13162383U Pending JPS6039272U (ja) 1983-08-25 1983-08-25 厚膜回路基板

Country Status (1)

Country Link
JP (1) JPS6039272U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173778A (ja) * 1987-12-28 1989-07-10 Ibiden Co Ltd 低抗体付きプリント配線板の製造方法
JPH0211374U (ja) * 1988-07-05 1990-01-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01173778A (ja) * 1987-12-28 1989-07-10 Ibiden Co Ltd 低抗体付きプリント配線板の製造方法
JPH0211374U (ja) * 1988-07-05 1990-01-24

Similar Documents

Publication Publication Date Title
JPS6039272U (ja) 厚膜回路基板
JPS59189270U (ja) フレキシブル基板の接続構造
JPS6112201U (ja) 配線回路基板
JPS58120662U (ja) チツプキヤリヤ−
JPS58177967U (ja) 配線基板
JPS62140760U (ja)
JPS58159703U (ja) 厚膜抵抗器
JPS5881949U (ja) 集積回路基板
JPS6074425U (ja) コ−ド板
JPS59128765U (ja) プリント回路板
JPS5967961U (ja) プリント基板
JPS6357772U (ja)
JPS58171339U (ja) 立体感が強調された化粧板
JPS58105162U (ja) フレキシブル基板
JPS5984835U (ja) 半導体ペレツト
JPS59166464U (ja) 配線基板
JPS58146372U (ja) プリント配線板
JPS61102073U (ja)
JPS5895667U (ja) プリント配線基板
JPS59149608U (ja) ポテンシヨメ−タ
JPS5929008U (ja) 厚膜配線基板
JPS59101401U (ja) 両面回路素子
JPS6037236U (ja) 厚膜コンデンサ
JPS58146373U (ja) プリント配線基板
JPS6420771U (ja)