JPS6039892A - How to install electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field of invention] TECHNICAL FIELD The present invention relates to a method of attaching a child component.

[Prior art and its problems]

The conventional method for attaching electronic components such as chip components to a wiring board is to attach the electronic components to a predetermined position on the wiring board using an adhesive.
After temporarily fixing it to the FF, it is a manual process of attaching a box of electronic parts and the terminal part of the board to an I/D connector, which requires skill and is not very efficient, especially these days.
In order to make the wiring board thinner, an installation method has been adopted in which 6 holes are provided on the wiring board and electronic components are inserted into these holes. Since accuracy is required for correct positioning of parts, it has been desired to present an accurate and highly efficient method for attaching the parts.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned situation, and an object thereof is to provide an accurate and efficient mounting method for four child parts without requiring any skill in the work. [Summary of the Invention] The method for attaching a child component of the present invention is to provide a mounting jig with a pin for positioning and a recessed part, and place the electronic component in the recessed part of the Tosa + II! Apply glue to the poles, make holes in the wiring board, insert the pins of the mounting jig, and heat the mounting jig to melt the powder and attach the electronic component to the wiring board. It is something.

〔Example〕

An embodiment of the electronic component mounting method of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a wiring board; numeral 1 in the figure is a trench board in which a wiring pattern 1α is formed on a thin film made of polyimide or the like. This wiring board 1 is used, for example, as the main board of a small-sized Shinko 2 emulsion device, and has a large number of key contacts and points 1h for manual operation on the front side, and a display device (not shown in the figure) on the back side. A continuation terminal IC is formed to be connected to the
These front and back patterns are connected by through holes 1d... Wiring contact 1h
. . , the entire surface of the connecting terminal IC . . . other than the contact portions and terminal portions is coated with a solder resist film. In addition, 2 in the figure is an LSI that performs operations such as calculation and control, and 3...
are chip components such as resistors, capacitors, diodes, etc., and the T, S I 2, and chip component 3 are fitted into 17 mounting holes that penetrate the wiring board 1, which will be described later, and are mounted so that they protrude from both the front and back sides of the board. It is being 4.4 is a hole for positioning, and this hole is punched and formed by press working at the same time as the mounting holes for the LSI 2 and chip components 3. Each peripheral edge of the through-hole 4.4 is plated with copper foil 4a, and in addition to serving as a conductive part, the recess also serves as a filler for burrs generated at the periphery of the through-hole due to press working. In this way, the through-hole 4 maintains its accuracy. In addition, a copper foil 4α provided on the periphery of one of the through holes 4 (the one placed on the top of the board)
is connected to the wiring pattern 1α, and even if the pattern is good, it is used for one.

Figure 2 (4) and (13) are each LSI before resin sealing.
A sectional view showing how this is attached to the printed circuit board 1 is shown. A chip-on-board (OOB) method is adopted for attachment to a tape carrier 21 made of a flexible film, in which a large number of 'tIt terminals 22 . . . are arranged. The LSI chip 23 is placed in the center of this terminal 22..., and each end 23α... is connected to each electrode/terminal 22...
...to face.

Each terminal 23α... and each tll are connected by wire 24...
, wi terminal 22...wire bonding,
The tape carrier 21 is cut into a predetermined size. This state is shown in FIG. The wiring board II is provided with a mounting hole 11 for the LSI chip, and on the back side thereof, electrode terminals 22 of the LSI chip are arranged. As shown in FIG. 1B, the LSI chip is inserted into the mounting hole 11 from the bottom of the wiring board 1, and each electrode terminal 22 is brought into contact with each connection terminal 12 of the wiring board 1. The situation! Sweet resin 25
Seal with. In this way, the LSI 2 is attached to the attachment hole 11 passing through the wiring board 1.

Next, a method for attaching the chip component 3 to the attachment hole of the wiring board 1 will be explained.

Figure 3 shows how to attach the chip parts! ,;I is a partially enlarged sectional view of FIG. All the chip parts 3... are mounted at the same time using a mounting jig, and the method is the same for all chip parts, so only one will be considered. The wiring board 1 is provided with a mounting hole 14 that extends directly through the front and outer surfaces for mounting chip components. Chip part 3 has both sides in the longitudinal direction! Eleven electrodes 3α, 3a are formed in a substantially rectangular parallelepiped shape, and the mounting hole 14 of the wiring board 1 is sized to allow the chip component 3 to fit loosely therein. At both ends of the mounting hole 14 in the two longitudinal directions, there are land portions 15.15 facing the electrodes 3α, 3α of the f-tube part 3.
is formed.

This land portion 15.15 is made of metal plating such as copper or elm, and is located in the mounting hole 14 of the wiring board 1! It is continuous along the edge of II and spans both the front and top surfaces with a U-shaped cross section. The wiring board 1 formed of a resin film is thinner than the chip component 3, and when it is loosely fitted into the mounting hole 14, the chip component 3 is projected to the front and back screens of the wiring board 1. The area around the mounting hole 14 is coated with a soldering resist 13, and t4 is the surface of the wiring board 1 which has already been explained.
This is a hole to determine the number 1 hole to be inserted on both sides of the stem. In the figure, numerals 50 and 60 are metal shells, the surfaces of which are coated with Teflon for solder resist. FIG. 4 shows a perspective view of the entire mounting jig 50 arranged on the lower side. The mounting jig 50 has a size that can accommodate at least one wiring piece 1, and its upper surface 51 is flat. A rectangular parallelepiped-shaped recess 52 is provided on the left hand side, and step portions 52α are formed at both longitudinal ends of this recess 52. The stepped portions 52α serve as escape grooves for the melted solder, and the chip component 3 is tightly fitted between the stepped portions 52α in each recessed portion 52. That is, each concave portion 52 is used to position each chip component 3. A positioning pin 53° 53 is planted near this concave portion 52. Also, on the right hand side, there is an E cross section of the mounting jig 50 in the 1j direction.
fg iK wall 54 is provided. The wiring board 1 is attached to the mounting jig 50J by inserting the pin 534 of the mounting jig 50 through the hole 4, and the right side 1e of the wiring board 1 is brought into close contact with the vertical wall 54i of the mounting jig 50. This allows accurate positioning. ￥4 In the figure, the wiring J left plate 1 attached to the mounting A50 is shown with a two-dot chain line. The mounting jig 60 has a pin hole 61 for tightly fitting the pin 53 at a position corresponding to the positioning pin 53 for installation performance -50, and a recess 62 facing the recess 52. Provided,
be.

Therefore, in order to attach the chip component 3 to the wiring board 1ζ, first place the chip component 3 in the recessed part 52 of the jig 50 with 112, place the chip component 3 in the recessed part 52 of the jig 50 with the arrangement nJ, and connect the hole 4.4 of the board 1 with the pin 53. ．．
53 to attach the wiring board 1 to the mounting jig 50. This 1: The top and bottom plate 1 has the entire length of the side portion 1e in close contact with the vertical wall 54 of the mounting jig 50, and the wiring board 1 is accurately rounded (L”l Iff r).In this state, the chip component The upper surface 3b of the chip component 3 protrudes higher than the surface of the wiring board 1, and the pin 53 of the mounting jig 50 protrudes upward through the hole 4 of the mounting plate 1. After applying a cream-like 7-dia 70 to the electrode-saving electrodes 3α and 3α, insert the pin holes 61 and 61 of the mounting jig 60 into the pins 53 and 53 of the mounting jig 50, and attach the wiring board 1 to the mounting jig 601. Fix from above.After this, heat jig 7
1 from above the mounting jig 60 to melt and measure the solder 70. The sacrificial solder 70 is placed on the land portion 15.15.
It flows from the long side to the back side along , filling the gap between the mounting hole 14 and the chip component 3. When the heating jig 71 is moved upward and left to cool, the mounting jig 50, 60 rapidly absorbs the heat and solidifies instantly, and the parts 3α and 3α of the chip component 3 become lands. 15.15. At this time, the solder of the connection part is applied to the recess 62 of the mounting jig 60 and the stepped part 50 of the mounting jig 50 for both the upper and lower parts.
Since it is pressed by α, it is fixed flat along the land portion 15.

In the above description, the order of attaching the chip component 1 and the wiring board 1 may be reversed. That is, after mounting the wiring board 1 on the mounting jig 50, the chip component 3 can be inserted into the recess 52 through the mounting hole 14 of the wiring board 1. Alternatively, the pin 53 may be provided in the mounting jig 60, and in this case, the mounting jig 50 is provided with a pin hole. The number of pins 53 may be as large as possible, and in such a case, either side g3 of the wiring board 1 may not be used for positioning, and positioning may be performed only by holes corresponding to the pins. As is clear from the above embodiments, the mounting method of the sub-components of the present invention can be carried out accurately and efficiently by simply mounting the electronic components and wiring board on the mounting jig and applying heat and pressure. It has the advantage of being possible.

Furthermore, the holes for positioning the wiring board used for mounting electronic components can also be used for positioning the wiring board when attaching it to the case or frame. It is also possible to make the body structure extremely simple. Next, such an example will be explained.

Figure 5 is a perspective view of a small electronic calculator, and Figure 6 is an exploded perspective view showing its four features.
Is the overall thickness of machine 80 l? It is extremely thin, on the order of IrH, and for this reason, its structure is very unique in that all the members are formed into film sheets, and then they are bonded together and laminated into layers. 81 in the diagram
is an upper sheet made of a stainless steel plate, and the lower half has openings 81α and 8 for attaching a display device and a sun pond.
1/l, and a number of contact holes 31C are provided in the lower half to partition the key button suppression range. Next to the slurry modification hole 81C in the lower half, there is a K81g mark half-etched from the back side. +'7181g・
... is used to fit the upper part of an LSI or chip to make it hard and thin. The upper seam) 81 is provided with positioning holes 81d at three locations. 82 is also a frame made of stainless steel.

This frame 82 has a frame shape with an outer circumference the same size as the outer circumference of the upper sheet 81, and the opening 81 of the upper sheet 81
The interior has been removed except for a protrusion 82α positioned 1a between α and 81b. Then, the upper sheet 81 and the frame body 82 are integrally formed by applying an adhesive and laminating them. 83 is a spacer arranged on the lower surface of the upper sheet 81, and this spacer 831 corresponds to each concession hole 81C of the upper sheet 81... and )tP#8
Partition holes 83α... and (111\1 holes 83b...) are drilled corresponding to 1e..., respectively.

E. The positioning holes 83C are also located at positions 3-7 corresponding to the positioning holes 81d of the upper sheet 81. 84
is a plate having a pattern on the screen and is arranged below the spacer 83 within the frame 82. Wiring resistance) The vertical line 84 corresponds to approximately the center of each contact hole 81C of the upper sheet 81. A fixed contact 84α... and a connection terminal 84b,... or 84 for connection to a display device or a solar oxide film.
C,841? is the provision. There are positioning holes 84d in three places.

is provided, LSI84g and chip parts 84f.
. . . are attached using the above-described method using these positioning holes 84d. However, the one located on the right side of this positioning hole 84cl can be used to install the chip component 84f. A lower sheet 85 made of a stainless steel plate and four lower sheets 86 made of polyester film or the like are arranged below the placing plate 84. Three positioning holes 85α are provided in the lower sheet 85. Each of these sheet members The three positioning holes provided in the sheet are used to relatively position each sheet member, and the pitch intervals are the same for all sheet members.
A top sheet 87 made of a transparent film having movable contacts for a key switch is placed on the uppermost 15 g of the material. The upper sheet 87 has translucent parts 87a and 87b in the areas where the display device body and the solar panel are arranged, and the entire other surface is printed to form a decorative surface 87C. In addition, the key switch section has a key display 87 that displays the name of the input key.
d... is printed, and each key display 87d is provided with a β1 moving contact (1' shown in the figure) on the back side.

In addition, 88 and 89 are a display device and a solar panel, respectively, and by heat sealing 90.91, the 1'15 concatenated ζ' fortuneteller 845..., 841? , 84
Click on C to add 6p.

Below, the above-mentioned parts are put together + a small electronic leaf made of mushrooms.
At 11 of F1 aircraft 80 (I'm going to talk about it).

Wiring board 841 heat seal 90.91f display rumor 1! 88 outside and sun 4 pond 89 mulberry contact 17. In addition, the H section sheet 81 and the frame body 82 are laminated and integrated so that the angle is 41 degrees! I already mentioned it. Next, place 1 corresponding to the positioning hole of each sheet member,
Hang the jig with the pin planted on the coin. As a reminder, in this case, unlike the mounting base 4 shown in Figure i44, a pin is placed at a position i4 where each sheet member can be attached with its top side upside down. That is, in this fitting, three pins are arranged correspondingly in three positions on each of the seven members so that they can be inserted into the holes from above (from the top sheet 87 side).

In this state, the upper sheet 81 with the IJ block 82 integrated therein is turned upside down and attached using a mounting jig. To do this, all that is required is to match the three bins of the mounting jig to the positioning holes 81d of the upper sheet 81 and insert them therethrough.

Next, after applying adhesive to the front and actual screen of the spacer 83,
Attach it to the jig with the top and bottom sides reversed. If you use a double-sided adhesive spacer, you only need to peel off the separator before installation. When installing the spacer 83, the positioning holes 83C serve as guides. Similarly,
The wiring boards 84 are attached to the jig by inserting the positioning holes 84d of the wiring boards 11i, 84 into the jars of the jig. At this time, the display device 88 and the solar cell 89 are fitted into the openings 81α and 81b of the upper sheet 81 for positioning. Here, the upper and lower sheets 85α with adhesive poured into the frame of the frame 82 are attached to a jig, and pressure is applied from above the lower sheet 85α. It may be heated if necessary. After cooling and solidifying the adhesive, the upper sheet 81 spacer 83, wiring board 84 and lower sheet 85 are each accurately positioned.Remove the four bonds from the mounting jig and inoculate the upper surface as shown in FIG. It is possible to form a small-sized sleeper type meter 41 to 80. Like Otsu, the positioning bin that was useful for the wiring board is distributed! 11!3 when installing electronic parts at 1 store Sakagami
It can also be used for positioning when installing a case or holding member, and for this reason, it is possible to make the device case or holding member a 1m leather structure with no positioning points, or to make it thinner. It is.

FIG. 7 shows an example in which the stripe rocket holes of an LSI film carrier tape are used as positioning holes when attaching a chip component to a wiring board. This is the trick
To explain, film gear rear tape 92 for LSI
A pattern is arranged on a long strip carrier table 92, and wiring boards 94 are arranged in the longitudinal direction thereof. In this case, connection terminals 95 for LSI are also formed on the wiring board 94. Then, LSIs 96 are formed at predetermined positions on each wiring board 94 while sequentially feeding the film carrier tape 92 in this manner. This can be done more accurately by counting the number of Q output 1i sprocket holes 93... at the position.
SI96 is formed with 4 holes as shown in Fig. 2, and is sealed with resin at 1%, lx. Figure 7 shows the state formed by the machining process up to this point. After that, each wiring board 9 arranged on the film carrier tape 92
4... are painstakingly completed, and the chip components 97 are attached to each of the wide plates 94 by the method already described. However, in this case, it is provided corresponding to the puller of the pinwheel brocket hole 97 of (positioning of the mounting jig) fl. In this way, the striped rocket holes of the film carrier tape can be used for all of LSI mounting, chip component mounting, and equipment assembly, making it highly efficient.

In addition, the mounting method of the electronic component of the present invention is Chi-Sof.

It goes without saying that it can be applied to the attachment of electronic parts other than parts, and it can also be widely applied to electronic equipment other than small electronic meters and deployment boards that do not have LSI.

〔Effect of the invention〕

As is clear from the above explanation, according to the electronic component mounting method of the present invention, both the electronic component and the wiring board can be mounted by simply attaching the mounting jig.
The effect is that beam making can be done accurately and efficiently without requiring any skill.

[Brief explanation of the drawing]

All of the drawings relate to the method for mounting electronic components of the present invention, and Figure 1 is a plan view of a wiring board with electronic components mounted thereon, and Figure 2 (m<A+ and 2) shows the wiring board formed on a tape carrier, respectively. A cross-sectional view of an LSI chip and a cross-sectional view of the state in which it is mounted on a wiring board.
Figure 4 is a perspective view of the mounting jig; FIG. 6 is a perspective view of a small-sized tun-sen-ni computer as an example of actual tXr4, FIG. 6 is a perspective view of the same size as that of FIG. 5, and FIG. 7 is a perspective view of another embodiment. 1...Wiring method board, 1α...Wiring pattern, 2...
・LSI, 3...Chip parts, 3α...Electronic (侃, 4)
... hole 50.60 ... mounting jig, 52 ... recessed part, 53 ... bottle, 61 ... bottle hole, 70 ... solder, 71 ... heating jig. Patent applicant Casio Computer Co., Ltd.

Claims (1)

[Claims] A hole for positioning is provided in the wiring board, and a bottle that fits into the hole in the wiring board is planted on one side of a mounting jig that can be divided downward, and a pin hole that fits this bottle is placed on the other side. At the same time, a recessed part for determining the position of one of the components of the mounting jig is provided, and the electronic component is placed in the recessed part of the mounting jig, and the electrodes of this electronic component are coated with... , and attaching the wiring board between the upper and lower mounting jigs by inserting the pins of the mounting jig into the holes of the wiring board, and heating the mounting jig to attach the electronic component to the wiring board. A method for attaching electronic components, characterized by attaching them.